Resist underlayer film-forming composition, process for forming resist underlayer film and patterning process
    3.
    发明授权
    Resist underlayer film-forming composition, process for forming resist underlayer film and patterning process 有权
    抗蚀剂下层膜形成组合物,形成抗蚀剂下层膜的工艺和图案化工艺

    公开(公告)号:US08603732B2

    公开(公告)日:2013-12-10

    申请号:US12978978

    申请日:2010-12-27

    摘要: There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.

    摘要翻译: 公开了一种抗蚀剂下层膜形成组合物,其至少包括:通过以下通式(1)表示的化合物与下列通式(2)表示的化合物缩合得到的树脂(A):通过 酸催化剂; 由通式(1)表示的化合物(B); 富勒烯化合物(C); 和有机溶剂。 在光刻中使用的多层抗蚀剂膜中可以存在抗蚀剂下层膜组合物,该下层膜具有优异的填充基板的高度差的性能,具有耐溶剂性,并且不仅能够防止 在蚀刻基板期间发生扭曲,而且能够提供优异的图案粗糙度; 通过使用该组合物形成抗蚀剂下层膜的方法; 和图案化过程。