利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

54 条记录 (耗时 0.018 秒)

    Device, system and method for providing MEMS structures of a semiconductor package
    6.
    发明授权
    Device, system and method for providing MEMS structures of a semiconductor package 有权
    用于提供半导体封装的MEMS结构的装置，系统和方法

    公开(公告)号：US09505610B2

    公开(公告)日：2016-11-29

    申请号：US14129541

    申请日：2013-09-25

    申请人： Weng Hong Teh ,  Tarek A Ibrahim ,  Sarah K Haney ,  Daniel N Sobieski ,  Parshuram B Zantye ,  Chad E Mair ,  Telesphor Kamgaing

    发明人： Weng Hong Teh ,  Tarek A Ibrahim ,  Sarah K Haney ,  Daniel N Sobieski ,  Parshuram B Zantye ,  Chad E Mair ,  Telesphor Kamgaing

    IPC分类号： H01L21/00 ,  B81C1/00

    CPC分类号： B81C1/00246 ,  B81B2201/0271 ,  B81C1/00261 ,  B81C1/00277 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/01079

    摘要： Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material. Seed copper and plated copper is disposed on the layer of porous dielectric material. Subsequent etching is performed to remove copper adjacent to the layer of porous dielectric material, forming a gap separating a suspended portion of a MEMS structure from the layer of porous dielectric material. In another embodiment, the semiconductor package includes a copper structure disposed between portions of an insulating layer or portions of a layer of silicon nitride material. The layer of silicon nitride material couples the insulating layer to another insulating layer. One or both of the insulating layers are each protected from desmear processing with a respective release layer structure.

    摘要翻译： 用于提供半导体封装的精确制造结构的技术和机构。 在一个实施例中，半导体封装的积聚载体包括多孔介电材料层。 种子铜和电镀铜设置在多孔电介质材料层上。 进行随后的蚀刻以去除邻近多孔介电材料层的铜，形成将MEMS结构的悬置部分与多孔介电材料层分开的间隙。 在另一个实施例中，半导体封装包括设置在绝缘层的一部分之间或者氮化硅材料层的一部分的铜结构。 氮化硅材料层将绝缘层耦合到另一绝缘层。 每个绝缘层中的一个或两个保护层不受去离子处理的剥离层结构的剥离。

    THROUGH-SILICON VIA (TSV)-BASED DEVICES AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
    7.
    发明申请
    THROUGH-SILICON VIA (TSV)-BASED DEVICES AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS 有权
    通过硅胶（TSV）设备和相关技术和配置

    公开(公告)号：US20150255372A1

    公开(公告)日：2015-09-10

    申请号：US14203415

    申请日：2014-03-10

    申请人： Telesphor Kamgaing

    发明人： Telesphor Kamgaing

    IPC分类号： H01L23/48 ,  H01L49/02 ,  B81B7/00 ,  H01L21/768

    CPC分类号： H01L23/481 ,  B81B2201/0271 ,  B81B2207/096 ,  B81C1/00246 ,  B81C1/00301 ,  H01L23/5228 ,  H01L23/642 ,  H01L23/647 ,  H01L25/0657 ,  H01L27/0694 ,  H01L28/20 ,  H01L28/60 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2924/15311

    摘要： Embodiments of the present disclosure are directed toward through-silicon via (TSV)-based devices and associated techniques and configurations. In one embodiment, an apparatus includes a die having active circuitry disposed on a first side of the die and a second side disposed opposite to the first side, a bulk semiconductor material disposed between the first side and the second side of the die and a device including one or more of a capacitor, resistor or resonator disposed in the bulk semiconductor material, the capacitor, resistor or resonator including one or more TSV structures that extend through the bulk semiconductor material, an electrically insulative material disposed in the one or more TSV structures and an electrode material or resistor material in contact with the electrically insulative material within the one or more TSV structures.

    摘要翻译： 本公开的实施例涉及基于硅通孔（TSV）的器件及相关技术和配置。 在一个实施例中，一种装置包括具有设置在管芯的第一侧上的有源电路和与第一侧相对设置的第二侧的管芯，设置在管芯的第一侧和第二侧之间的体半导体材料， 包括设置在体半导体材料中的电容器，电阻器或谐振器中的一个或多个，包括延伸穿过体半导体材料的一个或多个TSV结构的电容器，电阻器或谐振器，设置在一个或多个TSV结构中的电绝缘材料 以及与一个或多个TSV结构内的电绝缘材料接触的电极材料或电阻材料。

    MMWAVE ANTENNAS AND TRANSMISSION LINES ON STANDARD SUBSTRATE MATERIALS
    8.
    发明申请
    MMWAVE ANTENNAS AND TRANSMISSION LINES ON STANDARD SUBSTRATE MATERIALS 审中-公开
    MMWAVE天线和标准衬底材料的传输线

    公开(公告)号：US20150188218A1

    公开(公告)日：2015-07-02

    申请号：US14141830

    申请日：2013-12-27

    申请人： Adel A. ELSHERBINI ,  Telesphor Kamgaing ,  Sarah K. Haney

    发明人： Adel A. ELSHERBINI ,  Telesphor Kamgaing ,  Sarah K. Haney

    IPC分类号： H01Q1/38 ,  H01Q1/50

    CPC分类号： H01Q1/38 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01Q1/2283

    摘要： A method including disposing a transmission line or an antenna on dielectric material; and removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material. An apparatus including a package substrate including a transmission line coupled to an antenna, the transmission line and the antenna disposed on a dielectric layer including an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.

    摘要翻译： 一种包括在电介质材料上布置传输线或天线的方法; 以及从邻近传输线或天线的区域去除电介质材料的一部分，其中来自传输线或天线的电磁辐射被预定为大于电介质材料的另一部分。 一种包括包括耦合到天线的传输线的封装衬底的装置，所述传输线和天线设置在包括具有第一介电常数的有机介电材料和介电常数小于所述第一介电常数的第二材料的电介质层上 ，其中所述第二电介质材料邻接所述传输线或所述天线的一部分。

    SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS
    10.
    发明申请
    SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS 有权
    具有独立子阵列的单包装阵列模块

    公开(公告)号：US20140266902A1

    公开(公告)日：2014-09-18

    申请号：US13799645

    申请日：2013-03-13

    申请人： Telesphor Kamgaing ,  Adel A. Elsherbini

    发明人： Telesphor Kamgaing ,  Adel A. Elsherbini

    IPC分类号： H01Q21/29 ,  H01P11/00 ,  H01Q21/06 ,  H01Q3/24 ,  H01Q1/50 ,  H01Q15/08

    CPC分类号： H01Q21/293 ,  H01L2224/16225 ,  H01P11/00 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00 ,  H01Q25/00 ,  Y10T29/49016 ,  Y10T29/49018

    摘要： Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.

    摘要翻译： 本公开的实施例涉及一种单包装通信设备，其包括具有多个可独立选择的天线元件阵列的天线模块。 不同阵列的天线元件可以在不同的信号角度范围上发送和/或接收数据信号。 通信设备还可以包括用于单独地激活各个阵列的交换机模块。 在一些实施例中，射频（RF）通信模块可以包括在通信设备的包中。 在一些实施例中，RF通信模块可以被配置为使用多个天线元件阵列在毫米波（mm波）网络上进行通信。