Infrared sensor manufacturing method suitable for mass production
    1.
    发明授权
    Infrared sensor manufacturing method suitable for mass production 有权
    红外传感器制造方法适合批量生产

    公开(公告)号:US07781030B2

    公开(公告)日:2010-08-24

    申请号:US11710962

    申请日:2007-02-27

    IPC分类号: B05D3/06 G01J5/00

    CPC分类号: G01J5/20

    摘要: An infrared sensor manufacturing method according to this invention includes a step of forming a bridge structure of an insulating material on an Si substrate, a step of forming a vanadium oxide thin film on the bridge structure by a dry film forming method, a step of irradiating laser light onto the vanadium oxide thin film to thereby change material properties thereof, a step of forming the vanadium oxide thin film with the changed material properties into a bolometer resistor having a predetermined pattern, and a step of forming a protective layer of an insulating material so as to cover the bolometer resistor having the predetermined pattern and the bridge structure.

    摘要翻译: 根据本发明的红外线传感器的制造方法包括在Si基板上形成绝缘材料的桥接结构的步骤,通过干式成膜法在桥式结构体上形成氧化钒薄膜的工序, 将激光照射到氧化钒薄膜上,从而改变其材料特性,将具有改变的材料特性的氧化钒薄膜形成具有预定图案的辐照热电阻器的步骤,以及形成绝缘材料的保护层的步骤 以覆盖具有预定图案和桥结构的测辐射热电阻。

    Infrared sensor manufacturing method suitable for mass production
    2.
    发明申请
    Infrared sensor manufacturing method suitable for mass production 有权
    红外传感器制造方法适合批量生产

    公开(公告)号:US20070272863A1

    公开(公告)日:2007-11-29

    申请号:US11710962

    申请日:2007-02-27

    IPC分类号: G01J5/00 C23C14/00 C25D5/00

    CPC分类号: G01J5/20

    摘要: An infrared sensor manufacturing method according to this invention includes a step of forming a bridge structure of an insulating material on an Si substrate, a step of forming a vanadium oxide thin film on the bridge structure by a dry film forming method, a step of irradiating laser light onto the vanadium oxide thin film to thereby change material properties thereof, a step of forming the vanadium oxide thin film with the changed material properties into a bolometer resistor having a predetermined pattern, and a step of forming a protective layer of an insulating material so as to cover the bolometer resistor having the predetermined pattern and the bridge structure.

    摘要翻译: 根据本发明的红外线传感器的制造方法包括在Si基板上形成绝缘材料的桥接结构的步骤,通过干式成膜法在桥式结构体上形成氧化钒薄膜的工序, 将激光照射到氧化钒薄膜上,从而改变其材料特性,将具有改变的材料特性的氧化钒薄膜形成具有预定图案的辐照热电阻器的步骤,以及形成绝缘材料的保护层的步骤 以覆盖具有预定图案和桥结构的测辐射热电阻。

    Method for producing a metal oxide and method for forming a minute pattern
    6.
    发明授权
    Method for producing a metal oxide and method for forming a minute pattern 失效
    金属氧化物的制造方法及形成微小图案的方法

    公开(公告)号:US06576302B1

    公开(公告)日:2003-06-10

    申请号:US09513814

    申请日:2000-02-25

    IPC分类号: C08J718

    摘要: There is disclosed a method for producing a metal oxide, which comprises the steps of: dissolving a metal organic compound (e.g. a metal organic acid salt, a metal acetylacetonato complex, and a metal alkoxide having an organic group with 6 or more carbon atoms) in a solvent to provide a state of solution, applying the solution onto a substrate, drying the solution, and subjecting the resultant substrate to irradiation with a laser light of a 400 nm or less wavelength, to form a metal oxide on the substrate. According to that method, a metal oxide can be produced without applying a heat treatment at a high temperature of the degree adopted in the conventionally known application thermal decomposition method.

    摘要翻译: 公开了一种金属氧化物的制造方法,该方法包括以下步骤:将金属有机化合物(例如金属有机酸盐,金属乙酰丙酮络合物和具有6个或更多个碳原子的有机基团的金属醇盐) 在溶剂中以提供溶液状态,将溶液施加到基材上,干燥溶液,并使所得基板对波长为400nm以下的激光进行照射,以在基板上形成金属氧化物。 根据该方法,可以在常规已知的应用热分解方法中采用的高温下进行金属氧化物而不进行热处理。

    Manufacturing method and usage of crystallized metal oxide thin film
    8.
    发明授权
    Manufacturing method and usage of crystallized metal oxide thin film 有权
    结晶金属氧化物薄膜的制造方法和用途

    公开(公告)号:US07771531B2

    公开(公告)日:2010-08-10

    申请号:US11836387

    申请日:2007-08-09

    IPC分类号: C30B11/00 C30B21/02 C04B35/64

    摘要: Provided is a manufacturing method of a crystallized rare-earth thin films on a glass or a silicon substrate. This manufacturing method of a crystallized metal oxide thin film includes a step of retaining an metal organic thin film or a metal oxide film containing at least one type of rare-earth metal element selected from a group comprised of Y, Dy, Sm, Gd, Ho, Eu, Tm, Tb, Er, Ce, Pr, Yb, La, Nd and Lu formed on a substrate at a temperature of 250 to 600° C., and a step of crystallizing the organic metal thin film or the metal oxide film while irradiating ultraviolet radiation having a wavelength of 200 nm or less.

    摘要翻译: 提供了在玻璃或硅基板上的结晶化稀土类薄膜的制造方法。 该结晶化金属氧化物薄膜的制造方法包括:保持金属有机薄膜或金属氧化物膜的工序,所述金属有机薄膜或金属氧化物膜含有选自Y,Dy,Sm,Gd中的至少一种稀土金属元素, 在250〜600℃的温度下在基板上形成的Ho,Eu,Tm,Tb,Er,Ce,Pr,Yb,La,Nd和Lu,以及将有机金属薄膜或金属氧化物 同时照射波长为200nm以下的紫外线。

    Manufacturing Method of Phosphor Film
    9.
    发明申请
    Manufacturing Method of Phosphor Film 审中-公开
    荧光膜的制造方法

    公开(公告)号:US20080044590A1

    公开(公告)日:2008-02-21

    申请号:US11839270

    申请日:2007-08-15

    IPC分类号: C08J7/18

    摘要: Provided is a manufacturing method of a high-performance phosphor thin film material that enables a crystallized pervoskite-related Ti, Zr oxide thin film to be formed on a glass or a silicon substrate. This manufacturing method of a phosphor thin film includes a step of forming an organic metal thin film or a metal oxide film obtained by adding at least one element selected from a group comprised of Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu to a metal oxide represented with a composition formula of ABO3, A2BO4, A3B2O7 (provided that there may be a deficiency at the A, B, O sites) wherein A is an element selected from Ca, Sr and Ba, and B is a metal element selected from Ti and Zr on a substrate, and a step of irradiating an ultraviolet lamp to the substrate at room temperature and thereafter irradiating an ultraviolet laser thereto while retaining the substrate at a temperature of 400° C. or less. The film is subject to oxidation treatment after being crystallized.

    摘要翻译: 提供一种能够在玻璃或硅衬底上形成结晶的与渗透相关的Ti,Zr氧化物薄膜的高性能荧光体薄膜材料的制造方法。 这种荧光体薄膜的制造方法包括:形成通过添加选自由Ce,Pr,Nd,Sm,Eu,Gd,Tb等构成的组中的至少一种的有机金属薄膜或金属氧化物膜的工序, Dy,Ho,Er,Tm,Yb和Lu与由组成式ABO 3,A 2 BO 4表示的金属氧化物反应, A 3,B 2 O 7(前提是A,B,O位点可能存在缺陷),其中A是选择的元素 从Ca,Sr和Ba中选出,B是在基板上选自Ti和Zr的金属元素,以及在室温下向紫外灯照射紫外线,然后在保持基板的同时照射紫外线激光的步骤 400℃以下。 在结晶后,将该膜进行氧化处理。