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公开(公告)号：US11278715B2
公开(公告)日：2022-03-22
申请号：US15897014
申请日：2018-02-14
发明人： Jesse J. Wheeler , John Lachapelle , Caroline K. Bjune , Philip D. Parks, II , Carlos A. Segura
IPC分类号： A61N1/05 , A61N1/36 , A61B5/00 , A61B5/24 , A61B5/296 , A61B5/316 , A61N1/365 , A61N1/372 , A61N1/04 , A61B5/30
摘要： A lead assembly for networked implants may contain a controller, an implantable tissue contact system connected to the controller and including a plurality of leads, and a breakout connector connected to each of the plurality of leads, and further connected to a shared communication path. A physiological interface system may contain a controller and an implantable tissue contact system. Methods of treating a subject and monitoring a subject include transmitting signals between a controller and an implantable tissue contact system.
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公开(公告)号：US20180229025A1
公开(公告)日：2018-08-16
申请号：US15897019
申请日：2018-02-14
发明人： Jesse J. Wheeler , John R. Burns, IV , John Lachapelle , Caroline K. Bjune , Philip D. Parks, II
CPC分类号： A61N1/05 , A61B5/04001 , A61B5/04004 , A61B5/04012 , A61B5/0492 , A61B5/6847 , A61B5/6877 , A61B2562/028 , A61B2562/04 , A61B2562/125 , A61N1/0404 , A61N1/0502 , A61N1/0504 , A61N1/36 , A61N1/36003 , A61N1/3606 , A61N1/36062 , A61N1/36114 , A61N1/36125 , A61N1/36128 , A61N1/365 , A61N1/37211
摘要： An electrode array includes a body portion, at least one tail portion, at least one tissue surface contact, and at least one intratissue contact. The electrode array can provide stimulation or record signals from both the surface of a target tissue and within the target tissue. A system for tissue surface and intratissue signal recording and/or stimulation contains an electrode array, a controller or receiver, and at least one connection between the electrode array and the controller or receiver. A method of recording signals and/or stimulating tissue includes contacting the target tissue surface and target tissue interior with an electrode array and providing or recording an electrical, chemical, or optical signal.
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公开(公告)号：US20170154867A1
公开(公告)日：2017-06-01
申请号：US15432559
申请日：2017-02-14
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065 , A61N1/375 , H01L23/498 , A61N1/05 , A61B5/04 , H01L23/13 , H01L23/31
CPC分类号： H01L24/83 , A61B5/0031 , A61B5/04001 , A61N1/05 , A61N1/0543 , A61N1/0551 , A61N1/375 , H01L23/13 , H01L23/147 , H01L23/3107 , H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/065 , H01L25/0657 , H01L25/50 , H01L2224/45169 , H01L2224/4811 , H01L2224/48496 , H01L2224/83007 , H01L2224/83345 , H01L2224/83365 , H01L2224/83385 , H01L2224/83986 , H01L2224/85 , H01L2224/85007 , H01L2224/85345 , H01L2224/85385 , H01L2224/85986 , H01L2924/00014 , H01L2924/0002 , H01L2924/07802 , H01L2924/12042 , H01L2924/00 , H01L2924/0001 , H01L2224/05599
摘要： A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
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4.发明申请DISTRIBUTED NEURO-MODULATION SYSTEM WITH AUXILIARY STIMULATION-RECORDING CONTROL UNITS 审中-公开具有辅助刺激记录控制单元的分布式神经调节系统公开(公告)号：US20160015979A1
公开(公告)日：2016-01-21
申请号：US14867425
申请日：2015-09-28
CPC分类号： A61N1/36139 , A61N1/05 , A61N1/36 , A61N1/3686 , A61N1/3752 , H01B7/00
摘要： Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.
摘要翻译： 提供了用于调节生理过程的系统和方法，以使得能够将信号精确传递到预定的治疗部位。 该系统可以包括可植入装置和电引线体。 电引线体可以包括紧邻电引线本体的端部的多个换能器触头，以及位于引线本体内靠近多个换能器触头的控制单元。
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公开(公告)号：US20140273345A1
公开(公告)日：2014-09-18
申请号：US13836582
申请日：2013-03-15
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L24/83 , A61B5/0031 , A61B5/04001 , A61N1/05 , A61N1/0543 , A61N1/0551 , A61N1/375 , H01L23/13 , H01L23/147 , H01L23/3107 , H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/065 , H01L25/0657 , H01L25/50 , H01L2224/45169 , H01L2224/4811 , H01L2224/48496 , H01L2224/83007 , H01L2224/83345 , H01L2224/83365 , H01L2224/83385 , H01L2224/83986 , H01L2224/85 , H01L2224/85007 , H01L2224/85345 , H01L2224/85385 , H01L2224/85986 , H01L2924/00014 , H01L2924/0002 , H01L2924/07802 , H01L2924/12042 , H01L2924/00 , H01L2924/0001 , H01L2224/05599
摘要： A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
摘要翻译： 一种将密封模块粘合到电极阵列的方法，包括以下步骤：提供具有顶表面和底表面的柔性基底的电极阵列，并且在基底的顶表面中包括多个垫片; 将密封模块附接到电极阵列的底表面，密封模块具有多个接合焊盘，其中每个接合焊盘邻近电极阵列的底表面并与相应的焊盘对齐; 通过每个焊盘钻孔到相应的焊盘; 用生物相容的导电油墨填充每个孔; 在每个垫上的生物相容性导电油墨上形成铆钉; 并用防潮材料包覆模制电极阵列。
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公开(公告)号：US11278716B2
公开(公告)日：2022-03-22
申请号：US15897019
申请日：2018-02-14
发明人： Jesse J. Wheeler , John R. Burns, IV , John Lachapelle , Caroline K. Bjune , Philip D. Parks, II
IPC分类号： A61N1/05 , A61N1/36 , A61B5/00 , A61B5/24 , A61B5/296 , A61B5/316 , A61N1/365 , A61N1/372 , A61N1/04 , A61B5/30
摘要： An electrode array includes a body portion, at least one tail portion, at least one tissue surface contact, and at least one intratissue contact. The electrode array can provide stimulation or record signals from both the surface of a target tissue and within the target tissue. A system for tissue surface and intratissue signal recording and/or stimulation contains an electrode array, a controller or receiver, and at least one connection between the electrode array and the controller or receiver. A method of recording signals and/or stimulating tissue includes contacting the target tissue surface and target tissue interior with an electrode array and providing or recording an electrical, chemical, or optical signal.
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公开(公告)号：US20210121687A1
公开(公告)日：2021-04-29
申请号：US16921486
申请日：2020-07-06
发明人： John Burns, IV , Julianne Grainger , Bryan McLaughlin , Tirunelveli S. Sriram , John Lachapelle
IPC分类号： A61N1/05
摘要： The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.
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8.发明授权Distributed neuro-modulation system with auxiliary stimulation-recording control units 有权具有辅助刺激记录控制单元的分布式神经调制系统公开(公告)号：US09174044B2
公开(公告)日：2015-11-03
申请号：US14268258
申请日：2014-05-02
CPC分类号： A61N1/36139 , A61N1/05 , A61N1/36 , A61N1/3686 , A61N1/3752 , H01B7/00
摘要： Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.
摘要翻译： 提供了用于调节生理过程的系统和方法，以使得能够将信号精确传递到预定的治疗部位。 该系统可以包括可植入装置和电引线体。 电引线体可以包括紧邻电引线本体的端部的多个换能器触头，以及位于引线本体内靠近多个换能器触头的控制单元。
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公开(公告)号：US11938314B2
公开(公告)日：2024-03-26
申请号：US16921486
申请日：2020-07-06
发明人： John Burns, IV , Julianne Grainger , Bryan McLaughlin , Tirunelveli S. Sriram , John Lachapelle
CPC分类号： A61N1/0551 , A61B5/4041 , A61B5/4893 , A61B5/6877 , A61N1/02 , A61N1/048 , A61N1/05 , A61N1/0529 , A61N1/0534 , A61N1/0539 , A61N1/36185 , A61B5/24 , A61B2018/00434 , A61B2562/125 , A61N1/0492
摘要： The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.
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公开(公告)号：US20190385969A1
公开(公告)日：2019-12-19
申请号：US16442259
申请日：2019-06-14
发明人： Caprice Gray Haley , Robert McCormick , Anthony Kopa , John Lachapelle , Amy Duwel , Sara Barron , Andrew P. Magyar
IPC分类号： H01L23/00 , H01L23/538 , H01L23/49 , H01L23/498 , H01L23/31 , H01L21/48
摘要： A micro-coaxial wire has an overall diameter in a range of 0.1 μm-550 μm, a conductive core of the wire has a cross-sectional diameter in a range of 0.05 μm-304 μm, an insulator is disposed on the conductive core with thickness in a range of 0.005 μm-180 μm, and a conductive shield layer is disposed on the insulator with thickness in a range of 0.009 μm-99 μm.
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