摘要:
An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched.
摘要:
Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled.
摘要:
Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled.
摘要:
An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched.
摘要:
An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.
摘要:
An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.
摘要:
An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
摘要:
An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.
摘要:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要:
Briefly, in accordance with one embodiment, an integrated circuit includes a phase-frequency detector (PFD) including two clock input ports, an up signal port and a down signal port. The PFD includes digital circuitry including transistors coupled in a configuration to adjust an amount of overlap of an up output signal pulse and a down output signal pulse based, at least in part, upon the magnitude of an amount of phase delay between two respective clock signal pulses applied to the two input ports. Of course, additional embodiments are also disclosed.