PRECURSORS AND METHODS FOR ATOMIC LAYER DEPOSITION OF TRANSITION METAL OXIDES
    1.
    发明申请
    PRECURSORS AND METHODS FOR ATOMIC LAYER DEPOSITION OF TRANSITION METAL OXIDES 审中-公开
    过渡金属氧化物原子层沉积的前兆和方法

    公开(公告)号:US20110293830A1

    公开(公告)日:2011-12-01

    申请号:US13034564

    申请日:2011-02-24

    IPC分类号: C23C16/455

    摘要: Methods are provided herein for forming transition metal oxide thin films, preferably Group IVB metal oxide thin films, by atomic layer deposition. The metal oxide thin films can be deposited at high temperatures using metalorganic reactants. Metalorganic reactants comprising two ligands, at least one of which is a cycloheptatriene or cycloheptatrienyl (CHT) ligand are used in some embodiments. The metal oxide thin films can be used, for example, as dielectric oxides in transistors, flash devices, capacitors, integrated circuits, and other semiconductor applications.

    摘要翻译: 本文提供了通过原子层沉积形成过渡金属氧化物薄膜,优选IVB族金属氧化物薄膜的方法。 金属氧化物薄膜可以使用金属有机反应物在高温下沉积。 在一些实施方案中使用包含两种配体的金属有机反应物,其中至少一种是环庚三烯或环庚三烯(CHT)配体。 金属氧化物薄膜可以用作例如晶体管,闪光器件,电容器,集成电路和其它半导体应用中的电介质氧化物。

    METHOD OF DEPOSITING RARE EARTH OXIDE THIN FILMS
    4.
    发明申请
    METHOD OF DEPOSITING RARE EARTH OXIDE THIN FILMS 有权
    沉积稀土氧化物薄膜的方法

    公开(公告)号:US20090035949A1

    公开(公告)日:2009-02-05

    申请号:US11024515

    申请日:2004-12-28

    IPC分类号: H01L21/44

    摘要: The present invention concerns a process for depositing rare earth oxide thin films, especially yttrium, lanthanum and gadolinium oxide thin films by an ALD process, according to which invention the source chemicals are cyclopentadienyl compounds or rare earth metals, especially those of yttrium, lanthanum and gadolinium. Suitable deposition temperatures for yttrium oxide are between 200 and 400° C. when the deposition pressure is between 1 and 50 mbar. Most suitable deposition temperatures for lanthanum oxide are between 160 and 165° C. when the deposition pressure is between 1 and 50 mbar.

    摘要翻译: 本发明涉及通过ALD方法沉积稀土氧化物薄膜,特别是钇,镧和氧化钆薄膜的方法,根据该方法,源化学品是环戊二烯基化合物或稀土金属,特别是钇,镧和 钆。 当沉积压力为1至50毫巴时,氧化钇的合适沉积温度为200至400℃。 当沉积压力在1至50毫巴之间时,氧化镧最合适的沉积温度为160至165℃。