公开(公告)号：US20050038537A1

公开(公告)日：2005-02-17

申请号：US10806105

申请日：2004-03-23

申请人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

发明人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

IPC分类号： G06F17/50 ,  G05B19/418 ,  G06F19/00 ,  G06Q50/00 ,  G06Q50/04 ,  H01L21/02

CPC分类号： G05B19/41885 ,  G05B2219/31334 ,  G05B2219/31343 ,  G05B2219/35029 ,  G05B2219/35179 ,  G06Q10/06 ,  G06Q50/04 ,  Y02P90/185 ,  Y02P90/26 ,  Y02P90/265 ,  Y02P90/30

摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

摘要翻译： 本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。 基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息 预先。 输出部可以输出由制造线信息准备部准备的生产线的信息。 包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

公开(公告)号：US07133733B2

公开(公告)日：2006-11-07

申请号：US10806105

申请日：2004-03-23

申请人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

发明人： Toru Okada ,  Masanao Fujii ,  Takatoyo Yamakami ,  Kazuhisa Mishima ,  Toshiaki Otsuka

IPC分类号： G06F19/00

CPC分类号： G05B19/41885 ,  G05B2219/31334 ,  G05B2219/31343 ,  G05B2219/35029 ,  G05B2219/35179 ,  G06Q10/06 ,  G06Q50/04 ,  Y02P90/185 ,  Y02P90/26 ,  Y02P90/265 ,  Y02P90/30

摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

摘要翻译： 本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。 基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息 预先。 输出部可以输出由制造线信息准备部准备的生产线的信息。 包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

公开(公告)号：US20050034960A1

公开(公告)日：2005-02-17

申请号：US10804040

申请日：2004-03-19

申请人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

发明人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

IPC分类号： H01L21/50 ,  B65G49/02

CPC分类号： B81C3/002 ,  Y10T29/53 ,  Y10T29/53174 ,  Y10T29/534 ,  Y10T29/53417

摘要： The present invention provides an apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.

摘要翻译： 本发明提供了一种结合了与模具接合机相当的高速高精度特性和快速应对的灵活性的设备，以及工艺变化和产品变化以及尺寸减小和经济性。 该装置包括：基座单元，包括：主体，其包含用于安装和组装部件的多个工艺中共同使用的装置;用于沿预定输送方向输送工件的机构和用于定位工件的机构;专用单元 包括端部执行器，以及选择的机构单元，其包括用于在垂直于预定输送方向的两个轴向方向上移动末端执行器的机构，以调节端部执行器和工件或部件之间的相对位置。 移动机构可互换地安装在基座单元上，并且端部执行器可互换地附接在移动机构上。

公开(公告)号：US07111390B2

公开(公告)日：2006-09-26

申请号：US10804040

申请日：2004-03-19

申请人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

发明人： Koichi Shimamura ,  Kazuhisa Mishima ,  Toshiaki Otsuka ,  Toru Okada ,  Masanao Fujii

IPC分类号： B23P19/00

CPC分类号： B81C3/002 ,  Y10T29/53 ,  Y10T29/53174 ,  Y10T29/534 ,  Y10T29/53417

摘要： An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.

摘要翻译： 一种结合了与模具接合机相当的高速高精度特性的装置和快速应对的过程变化和产品变化以及尺寸减小和经济性的灵活性。 该装置包括：基座单元，包括：主体，其包含用于安装和组装部件的多个工艺中共同使用的装置;用于沿预定输送方向输送工件的机构和用于定位工件的机构;专用单元 包括端部执行器，以及选择的机构单元，其包括用于在垂直于预定输送方向的两个轴向方向上移动末端执行器的机构，以调节端部执行器和工件或部件之间的相对位置。 移动机构可互换地安装在基座单元上，并且端部执行器可互换地附接在移动机构上。

公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050057856A1

公开(公告)日：2005-03-17

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  G11B21/20

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US06885522B1

公开(公告)日：2005-04-26

申请号：US09548313

申请日：2000-04-12

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20080101746A1

公开(公告)日：2008-05-01

申请号：US11553743

申请日：2006-10-27

申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

IPC分类号： G02B6/12

CPC分类号： G03B17/00 ,  H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0182 ,  Y02P70/613

摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

摘要翻译： 光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。 当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。 端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

公开(公告)号：US06744183B2

公开(公告)日：2004-06-01

申请号：US10347708

申请日：2003-01-21

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC分类号： H01L41047

CPC分类号： H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

摘要翻译： 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

公开(公告)号：US07963434B2

公开(公告)日：2011-06-21

申请号：US12774881

申请日：2010-05-06

申请人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

发明人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

IPC分类号： B23K1/018

CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

摘要翻译： 一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。