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公开(公告)号：US4774687A
公开(公告)日：1988-09-27
申请号：US748945
申请日：1985-06-26
CPC分类号： G06F12/0859
摘要： A memory access control system for an information processing apparatus having a buffer memory and a main memory wherein when a store or access request is generated, in the case where the data block in the address to be accessed does not exist in the buffer memory, the store requested data from a data register is written into the buffer memory before the first data in the data block read out from the main memory is written into the buffer memory, and the data register is released to receive the next request.
摘要翻译： 一种用于具有缓冲存储器和主存储器的信息处理装置的存储器访问控制系统，其中当存储或访问请求被生成时，在要访问的地址中的数据块不存在于缓冲存储器中的情况下， 在将从主存储器读出的数据块中的第一数据写入缓冲存储器之前，将来自数据寄存器的请求数据存储器写入缓冲存储器，并且释放数据寄存器以接收下一个请求。
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2.发明授权Memory access control unit for allowing maximum throughput of an I/O processor and an I/O request buffer full state 失效用于允许I / O处理器和I / O请求缓冲器的最大吞吐量的存储器访问控制单元
公开(公告)号：US5235688A
公开(公告)日：1993-08-10
申请号：US532446
申请日：1990-06-04
CPC分类号： G06F9/5016 , G06F12/084
摘要： When an IOP is transferring data at the maximal throughput because of the fact that the input-output processor (IOP) has issued a next request under a state when the request buffers are full of requests from the IOP at least a part of the requests from the instruction processor (IP) is inhibited. Inhibition of the requests from the IP is released when the pitch of the requests from the IOP reaches a predetermined period or more. When the IOP is transferring data at the maximal throughput in a system having a cache memory, access to the main memory by the IP is inhibited in case requested data does not exist in the cache memory.
摘要翻译： 当IOP以最大吞吐量传输数据时，由于输入输出处理器（IOP）在请求缓冲器满足来自IOP的请求的状态下发出下一个请求的事实，至少一部分请求来自 指令处理器（IP）被禁止。 当来自IOP的请求的音调达到预定时间段或更长时间时，释放来自IP的请求的抑制。 当IOP在具有高速缓存存储器的系统中以最大吞吐量传送数据时，在高速缓冲存储器中不存在所请求的数据的情况下，禁止由IP访问主存储器。
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公开(公告)号：US08182729B2
公开(公告)日：2012-05-22
申请号：US12382138
申请日：2009-03-10
IPC分类号： B29C65/02
CPC分类号： H05K1/0366 , B29C43/003 , B29C43/18 , B29C43/203 , B29C2043/025 , B32B37/185 , B32B2309/025 , B32B2457/08 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2203/065 , H05K2203/1178
摘要： In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.
摘要翻译： 在制造具有基板和形成在基板中的布线图案的多层布线板的方法中，基膜沿预定方向堆叠以形成层叠膜结构。 每个基膜包括热塑性树脂。 压力和热量从层叠方向的两侧施加到层叠膜结构体上，使得基膜结合在一起形成基板。 基膜中的至少一个是包括纤维片的组合膜。 纤维片的两侧用热塑性树脂覆盖，使纤维片中残留有空气。
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公开(公告)号：US20050034780A1
公开(公告)日：2005-02-17
申请号：US10849011
申请日：2004-05-20
CPC分类号： H05K3/4053 , H05K3/4069 , H05K2201/0394 , H05K2203/0143 , H05K2203/0191 , H05K2203/085
摘要： A method for filling a fluidized material into a hole having a bottom, the hole disposed on one surface of a sheet member, the method includes the steps of: depressurizing a first closed space, which is formed on the one surface of the sheet member; depressurizing a second closed space, which is adjacent to the first closed space and accumulates the fluidized material; displacing the hole together with the sheet member to the second closed space, the hole depressurized in the first closed space; applying the fluidized material on the surface of the sheet member; and filling the applied fluidized material into the hole.
摘要翻译： 一种用于将流化材料填充到具有底部的孔中的方法，所述孔设置在片状构件的一个表面上，所述方法包括以下步骤：对形成在所述片状构件的一个表面上的第一封闭空间进行减压; 减压与第一封闭空间相邻的第二封闭空间并积聚流化材料; 将所述孔与所述片构件一起移位到所述第二封闭空间，所述孔在所述第一封闭空间中减压; 将流化材料施加在片材的表面上; 并将施加的流化材料填充到孔中。
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公开(公告)号：US06284670B1
公开(公告)日：2001-09-04
申请号：US09120803
申请日：1998-07-23
IPC分类号： H01L213063
CPC分类号： B81C1/00158 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81C2201/0114 , B81C2201/0133 , H01L21/3063
摘要： After an Si wafer is anisotropically etched through an etching mask having an opening in an anisotropically etching solution, an etching face of the Si wafer emerged by the anisotropic etching is subjected to anodic oxidation by applying a positive voltage for anodic oxidation on the Si wafer. As a result, the etching face of the Si wafer is isotropically etched due to the anodic oxidation in the anisotropic etching solution. By the isotropic etching thus performed, a sharp corner formed at an end portion of a recess portion formed in the Si wafer by the anisotropic etching, is rounded. Because the isotropic etching reaction progresses very slowly in comparison with the anisotropic etching, control of the etching can be made easy and accurately. As a result, the thickness of the diaphragm can be prevented from being dispersed.
摘要翻译： 在通过各向异性蚀刻溶液中具有开口的蚀刻掩模对Si晶片进行各向异性蚀刻之后，通过在Si晶片上施加阳极氧化的正电压，通过各向异性蚀刻出现的Si晶片的蚀刻面进行阳极氧化。 结果，由于各向异性蚀刻溶液中的阳极氧化，Si晶片的蚀刻面被各向同性地蚀刻。 通过如此进行的各向同性蚀刻，通过各向异性蚀刻形成在形成在Si晶片中的凹部的端部处形成的尖角变圆。 由于与各向异性蚀刻相比，各向同性蚀刻反应进行得非常缓慢，因此可以容易且精确地控制蚀刻。 结果，可以防止隔膜的厚度分散。
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公开(公告)号：US07931065B2
公开(公告)日：2011-04-26
申请号：US12385895
申请日：2009-04-23
IPC分类号： B32B37/00
CPC分类号： B30B15/061 , B30B15/024 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/068
摘要： In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.
摘要翻译： 在印刷电路板制造装置中，压模包括第一按压部，第二按压部和框部。 缓冲构件设置在层叠体的第一表面和第一按压部之间。 第二按压部具有面向层叠体的第二面的部分和面向缓冲部件的部分。 框架部分围绕缓冲构件的侧表面的整个区域。 在加压之前，层叠体，第二按压部和缓冲部件在其间限定了由于按压而变形的缓冲部件的逸出空间。 唇缘从框架部分朝向层叠体突出。 在缓冲构件的变形之后唇部变形，并且与第二按压部的面向缓冲构件的表面接触。
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公开(公告)号：US07296340B2
公开(公告)日：2007-11-20
申请号：US11185760
申请日：2005-07-21
CPC分类号： H05K3/22 , B09B5/00 , B29B17/02 , B29B2017/0255 , B29B2017/0456 , B29B2017/0464 , B29L2031/3425 , C22B7/001 , C22B7/005 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2203/178 , Y02P10/214 , Y02P70/613 , Y02W30/622 , Y02W30/625 , Y10T29/49751 , Y10T29/49755 , Y10T29/49757 , Y10T29/53 , Y10T29/53274
摘要： The present invention provides a recycler that recycles a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. The insulating body base of the printed circuit board as the waste printed circuit board can be a thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. The recycler includes a pressuring device that pressurizes the waste printed circuit board, a heater that heats the waste printed circuit board to a predetermined temperature at which the waste printed circuit board is at least softened, and a filter that filters the resin material from the waste printed circuit board. The heater can be maintain the filter at the predetermined temperature provided by the heater.
摘要翻译： 本发明提供一种再循环器，其用于回收用于分离和回收包括印刷金属材料的金属材料的印刷电路板和构成印刷电路板的绝缘材料。 作为废印刷电路板的印刷电路板的绝缘体基体可以是热塑性树脂或热塑性树脂和无机负载材料的混合物。 回收机包括对废印刷电路板加压的加压装置，将废印刷电路板加热到废印刷电路板至少软化的预定温度的加热器，以及从废物过滤树脂材料的过滤器 印刷电路板。 加热器可以将过滤器保持在由加热器提供的预定温度。
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公开(公告)号：US20060284357A1
公开(公告)日：2006-12-21
申请号：US11439418
申请日：2006-05-23
申请人： Norio Goko , Atsushi Sakaida , Toshihisa Taniguchi , Yuji Tuduki
发明人： Norio Goko , Atsushi Sakaida , Toshihisa Taniguchi , Yuji Tuduki
IPC分类号： B25B11/00
CPC分类号： B25J15/0616 , B25B11/005 , Y10T29/49131 , Y10T29/53178 , Y10T29/53191
摘要： A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.
摘要翻译： 一种能够缩短工件附着/脱离时间的工件保持方法和保持系统，其中加压空气始终通过卡盘的喷射器单元的喷嘴循环，以在夹紧工件之前使吸入室的内部成为负压 基于在夹持工件之后由压力传感器检测到的压力值来检测卡盘的完成，并且通过使阀关闭排气口而使工件被打开以提高排气室内的压力并从喷射器单元引入加压空气 到吸入室。
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公开(公告)号：US07107661B2
公开(公告)日：2006-09-19
申请号：US10381054
申请日：2002-12-16
CPC分类号： H05K3/22 , B09B5/00 , B29B17/02 , B29B2017/0255 , B29B2017/0456 , B29B2017/0464 , B29L2031/3425 , C22B7/001 , C22B7/005 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2203/178 , Y02P10/214 , Y02P70/613 , Y02W30/622 , Y02W30/625 , Y10T29/49751 , Y10T29/49755 , Y10T29/49757 , Y10T29/53 , Y10T29/53274
摘要： The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.
摘要翻译： 本发明提供一种回收用于分离和回收包括印刷金属材料的金属材料的印刷电路板和构成印刷电路板的绝缘材料的方法和装置。 分离和回收的金属材料和绝缘材料都可以进行再循环。 在回收印刷电路板的方法中，热过滤处理P 400中使用热过滤设备4a和树脂金属分离设备51。 对废弃印刷电路板1进行加热和强制过滤，使得只有绝缘材料1a通过过滤器。 然后，分离和取出绝缘材料1a和金属材料1b。 优选作为废印刷电路板的印刷电路板100的绝缘体基体23由热塑性树脂或热塑性树脂和无机负载材料的混合物制成。 结果，当回收的金属材料和回收的绝缘材料分别成为回收的必需品时，金属材料和绝缘材料都可以进行再循环。
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公开(公告)号：US20050246879A1
公开(公告)日：2005-11-10
申请号：US11185760
申请日：2005-07-21
CPC分类号： H05K3/22 , B09B5/00 , B29B17/02 , B29B2017/0255 , B29B2017/0456 , B29B2017/0464 , B29L2031/3425 , C22B7/001 , C22B7/005 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2203/178 , Y02P10/214 , Y02P70/613 , Y02W30/622 , Y02W30/625 , Y10T29/49751 , Y10T29/49755 , Y10T29/49757 , Y10T29/53 , Y10T29/53274
摘要： The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.
摘要翻译： 本发明提供一种回收用于分离和回收包括印刷金属材料的金属材料的印刷电路板和构成印刷电路板的绝缘材料的方法和装置。 分离和回收的金属材料和绝缘材料都可以进行再循环。 在回收印刷电路板的方法中，热过滤处理P 400中使用热过滤设备4a和树脂金属分离设备51。 对废弃印刷电路板1进行加热和强制过滤，使得只有绝缘材料1a通过过滤器。 然后，分离和取出绝缘材料1a和金属材料1b。 优选作为废印刷电路板的印刷电路板100的绝缘体基体23由热塑性树脂或热塑性树脂和无机负载材料的混合物制成。 结果，当回收的金属材料和回收的绝缘材料分别成为回收的必需品时，金属材料和绝缘材料都可以进行再循环。
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