-
1.发明授权Polymetaphenylene isophthalamide-based polymer porous film, process for its production and battery separator 失效聚邻苯二甲酰间苯二胺基聚合物多孔膜，其生产工艺及电池隔膜公开(公告)号：US07407702B2
公开(公告)日：2008-08-05
申请号：US10776184
申请日：2004-02-12
申请人： Takao Ohno , Jiro Sadanobu , Tsutomu Nakamura , Susumu Honda , Toyoaki Ishiwata
发明人： Takao Ohno , Jiro Sadanobu , Tsutomu Nakamura , Susumu Honda , Toyoaki Ishiwata
CPC分类号： B32B27/08 , B01D67/0011 , B01D67/0016 , B01D69/02 , B01D69/141 , B01D71/56 , B01D2323/08 , B01D2323/12 , B01D2325/22 , B01D2325/24 , B32B27/18 , B32B27/304 , B32B27/34 , B32B27/36 , B32B38/0036 , B32B2305/026 , B32B2307/306 , B32B2307/724 , B32B2309/025 , B32B2377/00 , B32B2457/10 , C08J5/18 , C08J9/28 , C08J2201/0542 , C08J2377/10 , H01M2/1646 , H01M2/1653 , H01M2/166 , Y10T428/249978 , Y10T428/249979 , Y10T428/24998 , Y10T428/249981 , Y10T428/249986 , Y10T428/249991 , Y10T428/249992 , Y10T428/249993 , Y10T428/31725
摘要： A polymetaphenylene isophthalamide-based polymer porous film having a satisfactory porous structure that exhibits excellent gas permeability and heat resistance. It is produced by a process which comprises casting a dope of the polymetaphenylene isophthalamide-based polymer and coagulating it in a coagulating bath. The porous film may also contain inorganic whiskers, and a composite porous film may be formed in combination with a separate thermoplastic polymer film.
摘要翻译： 具有令人满意的多孔结构的聚邻苯二甲酰间苯二胺系聚合物多孔膜具有优异的透气性和耐热性。 它是通过一种方法生产的，该方法包括将聚邻苯二甲酰间苯二胺基聚合物的掺杂物浇铸并在凝固浴中凝结。 多孔膜也可以含有无机晶须，并且复合多孔膜可以与单独的热塑性聚合物膜组合形成。
-
公开(公告)号：US06646060B1
公开(公告)日：2003-11-11
申请号：US09743408
申请日：2001-01-10
IPC分类号： C08G6948
CPC分类号： C08L67/02 , C08G73/1082 , C08L79/08 , Y10T428/31721
摘要： A resin composition containing a mixture produced by blending a crystalline polyamide expressed e.g. by formula (1) (in the formula, R1 is a bivalent organic aromatic group or aliphatic group having a carbon number of 2 to 30, optionally having substituent and optionally containing non-reactive groups such as ether group and aromatic group in the main chain, and Ar1 is an aromatic residue having a carbon number of 6 to 45 and optionally having substituent) with a thermoplastic polyester. The resin composition has excellent mechanical characteristics such as high elastic modulus, flow properties and heat-resistance and is suitable as a material for an electronic part for surface mounting.
摘要翻译： 一种树脂组合物，其含有通过将结晶聚酰胺共混而制得的混合物， 通式（1）（式中，R 1为二价有机芳香族基团或碳数为2〜30的脂肪族基，任选具有取代基且任选地含有非反应性基团，例如主链中的醚基和芳香族基团 ，Ar 1为碳原子数为6〜45，可以具有取代基的芳香族残基）与热塑性聚酯。 树脂组合物具有优异的机械特性，例如高弹性模量，流动性和耐热性，并且适合作为用于表面安装的电子部件的材料。
-
3.发明授权
公开(公告)号：US5853878A
公开(公告)日：1998-12-29
申请号：US704539
申请日：1996-09-12
申请人： Toyoaki Ishiwata , Jiro Sadanobu
发明人： Toyoaki Ishiwata , Jiro Sadanobu
CPC分类号： D01F6/86 , C08G63/672 , Y10T428/2913 , Y10T428/2969
摘要： The present invention relates to an elastic fiber of polyester elastomer mainly comprising the polyester elastomer further comprising aromatic polyester component as a hard segment and poly(alkyleneoxide)glycol having a number-average molecular weight of 500 to 5000 as a soft segment, wherein a residual elongation after 400 percent stretching does not exceed 100 percent. Made of the polyester elastomer comprising 1,2-bis�4-(2-hydroxyethyl)phenoxy!ethane as the diol component constituting said aromatic polyester component, or 1,4-benzenediethanol and ethyleneglycol as the diol component constituting said aromatic polyester component, the elastic fiber features excellent elastic properties in the event of great deformation and provides suitable material for clothing.
摘要翻译： PCT No.PCT / JP96 / 00729 Sec。 371日期：1996年9月12日 102（e）1996年9月12日PCT PCT 1996年3月21日PCT公布。 WO96 / 30427PC PCT出版物 日期：1996年10月3日本发明涉及一种聚酯弹性体弹性纤维，主要由聚酯弹性体构成，该聚酯弹性体还包含作为硬链段的芳族聚酯组分和数均分子量为500〜5000的聚（环氧烷）二醇作为软质 其中400％拉伸后的残余伸长率不超过100％。 由构成所述芳香族聚酯成分的二醇成分的1,2-双[4-（2-羟乙基）苯氧基]乙烷或作为构成所述芳香族聚酯成分的二醇成分的1,4-苯二乙醇和乙二醇的聚酯弹性体构成， 弹性纤维在大变形的情况下具有优异的弹性，并为衣服提供合适的材料。
-
公开(公告)号：US20100285292A1
公开(公告)日：2010-11-11
申请号：US11887510
申请日：2006-03-27
申请人： Toyoaki Ishiwata , Jyuhou Matsuo , Nobuaki Kido
发明人： Toyoaki Ishiwata , Jyuhou Matsuo , Nobuaki Kido
CPC分类号： B29C41/24 , B29C55/143 , B29K2079/08 , C08G73/105 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08L79/08
摘要： Disclosed is an aromatic polyimide film having specific elastic modulus and thermal expansion coefficient. Also disclosed is a method for producing such an aromatic polyimide film. Specifically disclosed is an aromatic polyimide film which is composed of an aromatic polyimide containing not less than 70 mol % of repeating units represented by the following formula (I): (I) while satisfying the following relations (1) and (2): CTEMD≦−11×MiMD+70 (1) CTETD≦−11×MiTD+70 (2) wherein CTEMD represents the in-plane thermal expansion coefficient (ppm·K−1) in the machine direction; CTETD represents the in-plane thermal expansion coefficient (ppm·K−1) in the transverse direction; MiMD represents the elastic modulus (GPa) in the machine direction; and MiTD represents the elastic modulus (GPa) in the transverse direction. Also specifically disclosed is a method for producing such an aromatic polyimide film.
摘要翻译： 公开了具有比弹性模量和热膨胀系数的芳族聚酰亚胺膜。 还公开了一种制备这种芳族聚酰亚胺膜的方法。 具体公开了一种芳族聚酰亚胺膜，其由满足下列关系式（1）和（2）的含有不少于70摩尔％的由下式（I）表示的重复单元的芳族聚酰亚胺组成：（I）：CTEMD＆nlE ; -11×MiMD + 70（1）CTETD＆nlE; -11×MiTD + 70（2）其中CTEMD表示机器方向上的面内热膨胀系数（ppm·K-1） CTETD表示横向的面内热膨胀系数（ppm·K-1） MiMD表示机器方向的弹性模量（GPa） MiTD表示横向的弹性模量（GPa）。 还具体公开了这种芳族聚酰亚胺膜的制造方法。
-
公开(公告)号：US10047478B2
公开(公告)日：2018-08-14
申请号：US13981807
申请日：2012-03-21
摘要： The present invention provides a prepreg comprising: a primary pre-pregnant made of a reinforced fiber substrate and an epoxy resin composition containing at least epoxy resin and thermoplastic resin impregnated into the reinforcing fiber that forms the reinforced fiber substrate; and a surface layer made of epoxy resin composition containing at least an epoxy resin and an epoxy resin-soluble thermoplastic resin that dissolves in the epoxy resin, the surface layer being formed on one or both surfaces of the primary prepreg; the prepreg being characterized in that only one of either the epoxy resin composition of the primary prepreg or the epoxy resin composition of the surface layer contains a hardening agent for an epoxy resin.
-
公开(公告)号：US20110111663A1
公开(公告)日：2011-05-12
申请号：US13001375
申请日：2009-06-06
CPC分类号： C08J5/24 , C08G59/5033 , C08J2363/00 , C08K5/18 , C08K5/29 , C08L13/00 , C08L63/00 , Y10T442/20 , Y10T442/2951 , Y10T442/645
摘要： Disclosed is an epoxy resin composition comprising at least component [A]: a glycidyl-amino-group-containing polyfunctional epoxy resin, component [B]: an epoxy resin other than the component [A], component [C]: a polyisocyanate compound, component [D]: an aromatic-amine-based curing agent, and component [E]: a thermoplastic resin, characterized in that the epoxy resin composition has an epoxy group concentration of 0.67 to 1.51 Eq/kg of the total amount of the components [A] to [D], and preferably that the component [E] is in a proportion of 10 to 50% by weight of the total epoxy resin composition. Use of a prepreg having the resin composition as a matrix resin makes it possible to obtain a composite material with excellent heat resistance and wet heat resistance together with high mechanical properties.
摘要翻译： 公开了至少含有成分[A]：含缩水甘油基氨基的多官能环氧树脂，成分[B]：除[A]成分以外的环氧树脂，成分[C]的成分的环氧树脂组合物：多异氰酸酯化合物 ，成分[D]：芳香族胺系固化剂，[E]成分：热塑性树脂，其特征在于，所述环氧树脂组合物的环氧基浓度为0.67〜1.51 组分[A]至[D]，优选组分[E]的比例为总环氧树脂组合物的10至50重量％。 使用具有树脂组合物的预浸料作为基质树脂使得可以获得具有优异的耐热性和耐湿热性以及高机械性能的复合材料。
-
公开(公告)号：US20070100127A1
公开(公告)日：2007-05-03
申请号：US10530414
申请日：2003-03-31
IPC分类号： C08G69/08
CPC分类号： C08J5/18 , B29C41/003 , B29D7/01 , B29K2079/08 , C08G73/1042 , C08G73/1082 , C08J2379/08 , H05K1/0346
摘要： An oriented polyimide film with a high Young's modulus, satisfactory moist heat resistance and low moisture absorptivity, and a process for its production. The polyimide film is composed mainly of a pyromellitic acid component, with a p-phenylenediamine component at between 30 mole percent and 99 mole percent and a diamine component represented by the structural unit of the following formula (II) at between 1 mole percent and 70 mole percent: (wherein ArIIa and ArIIb are each independently a C6-20 aromatic group optionally having an non-reactive substituent, and X in structural unit (II) consists of at least one group selected from among —O—, —O—ArIIc—O—, —SO2— and —O—ArIId—O—ArIIe—O—), and the polyimide film is characterized by having two perpendicular directions in which the in-plane Young's modulus is 3 GPa or greater, and having a moisture absorptivity of no greater than 3.3 wt % at 72% RH, 25° C.
摘要翻译： 具有高杨氏模量，令人满意的耐湿热性和低吸湿性的取向聚酰亚胺膜及其制造方法。 聚酰亚胺膜主要由均苯四酸酸组分组成，对苯二胺组分为30摩尔％至99摩尔％，由下式（II）的结构单元表示的二胺组分的摩尔比为1摩尔％至70摩尔％ 摩尔百分数：（其中Ar IIa和Ar IIb各自独立地为任选具有非反应性取代基的C6-20芳族基团，结构单元（II）中的X由 的至少一个选自-O - ， - O-Ar II - ， - SO 2 - 和-O-Ar IId的基团， 其中，所述聚酰亚胺膜的特征在于，其中所述平面内杨氏模量为3GPa以上，并且具有吸湿性 在72％RH，25℃下不大于3.3重量％
-
公开(公告)号：US20060134407A1
公开(公告)日：2006-06-22
申请号：US10543813
申请日：2004-01-28
IPC分类号： B32B7/12
CPC分类号： H01L21/2007 , C09J7/22 , C09J7/35 , C09J2477/00 , C09J2479/086 , H01L21/76251 , Y10T428/28 , Y10T428/2852 , Y10T428/31721
摘要： There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500° C., as well as a laminate composed of the sheet and a process for its production. Also provided is a method of release after treatment of the laminate composed of the adhesive sheet, to obtain a laminate having the target to-be-treated layer.
摘要翻译： 提供具有特定剥离强度和剪切剥离强度的粘合片，并且由包含玻璃化转变温度为200℃以上的全芳香族聚酰亚胺膜和热粘合剂层（A）的基材（A） C）包括玻璃化转变温度为200-500℃的全芳族聚酰胺，以及由该片材制成的层压板及其制备方法。 还提供了由粘合片构成的层压体的处理后的剥离方法，得到具有被处理物的层的层叠体。
-
公开(公告)号：US06812319B2
公开(公告)日：2004-11-02
申请号：US10411116
申请日：2003-04-11
IPC分类号： C08G6400
摘要： The present invention relates to a wholly aromatic polyester carbonate and a process for its production. An aromatic dicarboxylic acid, an aromatic diol, and a diaryl carbonate are used as starting materials in specific molar ratios, a prepolymerization step, a crystallization step, and a solid-phase polymerization step are essential steps, and a compression molding step is an optional step. This makes it possible to produce with good productivity a wholly aromatic polyester carbonate that has low coloration and a high degree of polymerization.
摘要翻译： 本发明涉及全芳族聚酯碳酸酯及其制备方法。 芳族二羧酸，芳族二醇和碳酸二芳基酯以特定的摩尔比用作原料，预聚合步骤，结晶步骤和固相聚合步骤是必须的步骤，压缩成型步骤是可选的 步。 这使得可以以高生产率生产具有低着色和高聚合度的全芳族聚酯碳酸酯。
-
公开(公告)号：US20070148480A1
公开(公告)日：2007-06-28
申请号：US10584330
申请日：2004-12-22
CPC分类号： H01L21/6835 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/281 , B32B27/34 , B32B2255/06 , B32B2255/26 , B32B2307/206 , B32B2307/306 , B32B2307/734 , B32B2457/14 , C09J5/00 , C09J7/22 , C09J7/25 , C09J7/35 , C09J2203/326 , C09J2205/302 , C09J2477/00 , C09J2477/006 , C09J2479/08 , C09J2479/086 , H01L21/4803 , H01L21/6836 , H01L23/145 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y10T428/31721 , H01L2924/00
摘要： A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate. The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PIA-1) or (A-2) a specific wholly aromatic polyamide (PAA-2); and the layer B comprises (B-1) a specific wholly aromatic polyimide (PIB-1), (B-2) a specific wholly aromatic polyamide (PAB-2), or (B-3) a specific resin composition (RCB-3) comprising a wholly aromatic polyimide (PIB-3) and a specific wholly aromatic polyamide (PAB-3), laminates comprising the same and a process for manufacturing the above laminate.
摘要翻译： 有利地用作电子封装应用的绝缘层和用于固定用于半导体器件应用的半导体晶片的粘合膜的层压体，包括该半导体器件的层压体以及用于制造上述层叠体的方法。 层压体（I）包括在层A的一侧或两侧形成的基底层（A）和粘合剂层（B），层A是由（A-1）特定的全芳族聚酰亚胺 （A-2）特定的全芳族聚酰胺（PAA-A-2）;或（A-2） 并且层B包含（B-1）特定的全芳族聚酰亚胺（PI B-1），（B-2）特定的全芳族聚酰胺（PA B-2 / >）或（B-3）包含全芳香族聚酰亚胺（PI B-3）的特定树脂组合物（RC B-3）和特定的全芳族聚酰胺 （PA B-3），含有它们的层压体和制造上述层压体的方法。
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.018 秒)
