公开(公告)号：US09095067B2

公开(公告)日：2015-07-28

申请号：US14069054

申请日：2013-10-31

Applicant: Wintec Industries, Inc.

Inventor： Kong-Chen Chen

IPC: H05K1/11 ,  H05K3/30 ,  H01L23/64 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L23/64 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/181 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/086 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract translation: 呈现电子设备用于集成电路部件的第一焊盘触点和基本上位于目标平台的第一平面中的目标触点之间的电连接。 电子设备包括基本上平行于第一平面的第一表面和基本上平行于第一平面的第一表面下方的第二表面。 第一表面包括第一接触区域，被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到第一焊盘触点。 第二表面包括被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到目标触点的第二触点区域。 电子设备还包括连接在第一和第二接触区域之间的多个电动无源元件。

公开(公告)号：US20140160681A1

公开(公告)日：2014-06-12

申请号：US13708876

申请日：2012-12-07

Applicant: WINTEC INDUSTRIES, INC.

Inventor： Kong-Chen Chen

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R12/721 ,  H01R12/737 ,  H05K1/0201 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10787 ,  H05K2201/1081 ,  Y10T29/49117

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract translation: 用于连接到第一印刷电路的电气设备包括第二印刷电路，其包括基本上平行于第一平面的第一表面和基本上平行于垂直于第一平面的第二平面的第二表面。 第一表面包括第一区域，第二表面包括较小的第二区域。 第二印刷电路在第二印刷电路的一层中包括导电迹线。 电气设备还包括分别包括第一和第二纵向轴线的第一和第二导电销。 第二印刷电路中的第一和第二凹口包括通过第二表面的相应的第一和第二开口，其适于接收第一和第二引脚的部分，并且适于将引脚电连接到第一和第二相应的导电迹线。 第一和第二纵轴基本上平行于第一平面安装。

公开(公告)号：US09253894B2

公开(公告)日：2016-02-02

申请号：US13973766

申请日：2013-08-22

Applicant: Wintec Industries, Inc.

Inventor： Kong-Chen Chen

IPC: H01L23/00 ,  H05K3/30 ,  H01L21/66 ,  H01L21/67 ,  H01L23/04 ,  H01L23/10 ,  H01L23/40 ,  H01L23/544 ,  H01L25/065 ,  H05K1/14 ,  H05K3/32 ,  H05K1/16 ,  H05K7/20 ,  H01L23/48 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K3/303 ,  H01L21/67259 ,  H01L22/32 ,  H01L22/34 ,  H01L23/041 ,  H01L23/10 ,  H01L23/4093 ,  H01L23/481 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0268 ,  H05K1/0296 ,  H05K1/144 ,  H05K1/16 ,  H05K3/222 ,  H05K3/325 ,  H05K7/20436 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/49133 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract translation: 一种包括基板，电子部件，固定装置和壳体的电子组件。 衬底包括第一接触阵列。 电子部件包括第二接触阵列。 所述固定装置包括适于将所述电子部件定位在所述基板上并且当所述固定装置对准在所述基板上的第一位置时将所述第二接触阵列连接到所述第一接触阵列的开口。 壳体适于保持充满电子部件的基板。 壳体包括第一导电路径，当第一导电路径适于在该基座上的第一位置处对齐时，以串联连续的导电路径从壳体的外表面连接到衬底。 电子组件包括连接到连续导电路径的感测装置，以检测电子组件的完整性。

公开(公告)号：US20140301052A1

公开(公告)日：2014-10-09

申请号：US14214563

申请日：2014-03-14

Applicant: Wintec Industries, Inc.

Inventor： Kong-Chen Chen

IPC: H05K7/10 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01R12/7005 ,  H01R12/7029 ,  H01R12/721 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10325 ,  Y10T29/49147

Abstract: An electrical apparatus includes a printed circuit board (PCB) and a socket to electrically interface with the PCB. The PCB includes conductive traces formed in a layer of the PCB and one or more recess. Each of the recess includes an inner surface. A portion of the inner surface forms a first electrical contact connected to one of the conductive traces. The socket includes a multitude of conductive pins and one or more mechanical support matching the position of the recesses. Each of the mechanical support includes an outer surface. A portion of the outer surface forms a second electrical contact connected to an interface pin. The first electrical contact at the PCB and the second electrical contact at the socket form a conduction path from one of the conductive traces on the PCB to the interface pin at the socket when the PCB is inserted into the socket.

Abstract translation: 电气设备包括印刷电路板（PCB）和与PCB电接口的插座。 PCB包括形成在PCB的一层中的导电迹线和一个或多个凹部。 每个凹部包括内表面。 内表面的一部分形成连接到导电迹线之一的第一电触点。 插座包括多个导电插针和一个或多个匹配凹槽位置的机械支架。 每个机械支撑件包括外表面。 外表面的一部分形成连接到接口销的第二电触点。 当PCB插入插座时，PCB处的第一电接触和插座处的第二电接触形成从PCB上的导电迹线之一到插座处的接口引脚的导电路径。