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    Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts
    5.
    发明申请
    Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts 审中-公开
    用于制造电触点和由此产生的电触头的程序化材料固结工艺

    公开(公告)号：US20060211313A1

    公开(公告)日：2006-09-21

    申请号：US11429012

    申请日：2006-05-04

    申请人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    发明人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    IPC分类号： H01R13/02

    CPC分类号： H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

    摘要： An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core, a conductive coating on at least a portion of the core, or both that are at least partially fabricated by a programmed material consolidation process, such as, but not limited to, stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program. The electrical contact may be flexible and resilient or it may be rigid. Protective structures may accompany flexible, resilient contacts to prevent deformation thereof beyond their elastic limits.

    摘要翻译： 与半导体器件，载体，探针卡或另一基底一起使用的电触点包括介电芯，芯的至少一部分上的导电涂层或两者，至少部分地由编程材料固结 方法，例如但不限于立体光刻术，其中根据程序选择性地固结未固结的材料。 电接触可以是柔性的和弹性的，或者它可以是刚性的。 保护结构可以伴随柔性弹性触点，以防止其变形超出其弹性极限。

    Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated
    6.
    发明申请
    Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated 审中-公开
    用于制造包括突出接触件和如此制造的电子器件部件的电子器件部件的方法

    公开(公告)号：US20060205291A1

    公开(公告)日：2006-09-14

    申请号：US11429011

    申请日：2006-05-04

    申请人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    发明人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    IPC分类号： H01R13/02

    CPC分类号： H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

    摘要： A method for fabricating a semiconductor device component, such as a probe card, includes providing a support plate with at least one aperture therethrough and providing at least one contact in the at least one aperture. Ends of the at least one contact may be enlarged to retain the same within the at least one aperture. A protective structure may be provided to prevent excessive compression of the at least one contact. The support plate, all or part of the at least one contact, the protective structure, or a combination thereof may be formed by a programmed material consolidation process, such as stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program.

    摘要翻译： 用于制造诸如探针卡的半导体器件部件的方法包括提供具有穿过其中的至少一个孔的支撑板，并在所述至少一个孔中提供至少一个触点。 可以扩大至少一个触点的端部以将其保持在至少一个孔内。 可以提供保护结构以防止至少一个接触件的过度压缩。 支撑板，全部或部分至少一个触点，保护结构或其组合可以通过程序化材料固结工艺（例如立体光刻）形成，其中根据程序选择性地固结未固结的材料。

    Electrical contacts, devices including the same, and associated methods of fabrication
    9.
    发明申请
    Electrical contacts, devices including the same, and associated methods of fabrication 失效
    电触点，包括相同的器件和相关的制造方法

    公开(公告)号：US20050191913A1

    公开(公告)日：2005-09-01

    申请号：US10788941

    申请日：2004-02-27

    申请人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    发明人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    IPC分类号： H01R4/48 ,  H01R13/24

    CPC分类号： H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

    摘要： An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a stereolithographically fabricated portion, which may comprise a plurality of at least partially superimposed, contiguous, mutually adhered layers. The electrical contact may include a dielectric core and a conductive coating on at least a portion thereof, or it may be completely formed from conductive material. The electrical contact may be rigid or flexible and resilient. Protective structures for use with flexible resilient contacts prevent deformation of such contacts beyond their elastic limits. Probe cards are also disclosed, as are methods for fabricating the electrical contacts, protective structures, and probe cards.

    摘要翻译： 与半导体器件，载体，探针卡或另一基底一起使用的电触点包括立体光刻制造部分，其可以包括多个至少部分重叠的邻接的相互附着的层。 电接触可以在其至少一部分上包括介质芯和导电涂层，或者它可以由导电材料完全形成。 电触点可以是刚性的或柔性的和弹性的。 与柔性弹性触点一起使用的保护结构可防止这种触点变形超出其弹性极限。 还公开了探针卡，以及制造电触点，保护结构和探针卡的方法。