公开(公告)号：US20080230884A1

公开(公告)日：2008-09-25

申请号：US11725827

申请日：2007-03-19

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

摘要翻译： 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。

公开(公告)号：US07525185B2

公开(公告)日：2009-04-28

申请号：US11725827

申请日：2007-03-19

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

摘要翻译： 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。

公开(公告)号：US20080197478A1

公开(公告)日：2008-08-21

申请号：US11677489

申请日：2007-02-21

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu

IPC分类号： H01L23/043

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device package with the die receiving through hole and connecting through holes structure comprising a substrate with a die receiving through hole, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A die is disposed within the die receiving through hole. A first adhesion material is formed under the die and a second adhesion material is filled in the gap between the die and sidewall of the die receiving though hole of the substrate. Further, a bonding wire is formed to couple and the bonding pads and the first contact pads. A dielectric layer is formed on the bonding wire, the die and the substrate.

摘要翻译： 本发明提供了一种半导体器件封装，其具有管芯接收通孔并且连接通孔结构，该孔结构包括具有管芯接纳通孔的基板，连接通孔结构和上表面上的第一接触焊盘以及下表面上的第二接触焊盘 底物。 模具设置在模具接收通孔内。 第一粘合材料形成在模具下面，第二粘合材料填充在基板的模具和模具的侧壁之间的间隙中。 此外，形成接合线以连接和接合焊盘和第一接触焊盘。 在接合线，芯片和基板上形成电介质层。

公开(公告)号：US20080224248A1

公开(公告)日：2008-09-18

申请号：US11725041

申请日：2007-03-15

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L21/44 ,  H01L31/0203 ,  H01J40/14

CPC分类号： H01L27/14618 ,  H01L24/19 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/14 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。 一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。 在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US07498556B2

公开(公告)日：2009-03-03

申请号：US11725041

申请日：2007-03-15

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/19 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/14 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。 一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。 在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20080274579A1

公开(公告)日：2008-11-06

申请号：US12216641

申请日：2008-07-09

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02327 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper layer of the substrate, wherein terminal pads are formed on the upper surface of the substrate, the same plain as the micro lens. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection.

摘要翻译： 本发明提供一种封装结构，其包括：衬底，其具有形成在衬底的上层内的管芯容纳腔，其中端子衬垫形成在衬底的上表面上，与微透镜相同。 通过粘合将模具设置在模具接收腔内，并且在模具和基板上形成介电层。 在电介质层上形成再分配金属层（RDL）并与管芯耦合。 在电介质层内形成一个开口和一个顶部保护层，以露出图像传感器芯片的芯片的微透镜区域。 保护层（膜）涂覆在微透镜区域上，具有防水和防油性，以消除颗粒污染。 可选地，在微透镜区域上形成具有涂覆的IR滤光器的透明盖，用于保护。

公开(公告)号：US20080197435A1

公开(公告)日：2008-08-21

申请号：US11708476

申请日：2007-02-21

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02327 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper layer of the substrate, wherein terminal pads are formed on the upper surface of the substrate, the same plain as the micro lens. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection.

公开(公告)号：US20080157312A1

公开(公告)日：2008-07-03

申请号：US11647217

申请日：2006-12-29

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/00

摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

摘要翻译： 本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

公开(公告)号：US20080142946A1

公开(公告)日：2008-06-19

申请号：US11609970

申请日：2006-12-13

申请人： Wen-Kun Yang ,  Tung-Chuan Wang ,  Chao-Nan Chou ,  Chih-Wei Lin

发明人： Wen-Kun Yang ,  Tung-Chuan Wang ,  Chao-Nan Chou ,  Chih-Wei Lin

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： The present invention provides a structure of package comprising a substrate with a pre-formed die receiving cavity formed and/or terminal contact metal pads formed within an upper surface of the substrate. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. At least one re-distribution built up layer (RDL) is formed on the dielectric layer and coupled to the die via contact pad. Connecting structure, for example, UBM is formed over the redistribution built up layer. Terminal Conductive bumps are coupled to the UBM.

摘要翻译： 本发明提供了一种包装结构，其包括具有预先形成的模具容纳空腔的基板和/或形成在基板的上表面内的端接触金属焊盘。 通过粘合将模具设置在模具接收腔内，并且在模具和基板上形成介电层。 在电介质层上形成至少一个重新分配建立层（RDL），并通过接触焊盘与芯片耦合。 连接结构，例如，UBM形成在再分配建立层上。 端子导电凸块耦合到UBM。

公开(公告)号：US07655501B2

公开(公告)日：2010-02-02

申请号：US12141138

申请日：2008-06-18

申请人： Wen-Kun Yang ,  Tung-Chuan Wang ,  Chao-Nan Chou ,  Chih-Wei Lin

发明人： Wen-Kun Yang ,  Tung-Chuan Wang ,  Chao-Nan Chou ,  Chih-Wei Lin

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： The present invention provides a structure of package comprising a substrate with a pre-formed die receiving cavity formed and/or terminal contact metal pads formed within an upper surface of the substrate. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. At least one re-distribution built up layer (RDL) is formed on the dielectric layer and coupled to the die via contact pad. Connecting structure, for example, UBM is formed over the re-distribution built up layer. Terminal Conductive bumps are coupled to the UBM.

摘要翻译： 本发明提供了一种包装结构，其包括具有预先形成的模具容纳空腔的基板和/或形成在基板的上表面内的端接触金属焊盘。 通过粘合将模具设置在模具接收腔内，并且在模具和基板上形成介电层。 在电介质层上形成至少一个重新分配建立层（RDL），并通过接触焊盘与芯片耦合。 连接结构，例如UBM形成在重新分配建立的层上。 端子导电凸块耦合到UBM。