公开(公告)号：US20080224248A1

公开(公告)日：2008-09-18

申请号：US11725041

申请日：2007-03-15

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L21/44 ,  H01L31/0203 ,  H01J40/14

CPC分类号： H01L27/14618 ,  H01L24/19 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/14 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。 一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。 在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20080191333A1

公开(公告)日：2008-08-14

申请号：US11703663

申请日：2007-02-08

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Hsien-Wen Hsu

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L21/6835 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.

摘要翻译： 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 形成保护层以覆盖引线接合。 通过粘合将透明盖设置在模具通孔内的模具上，以露出微透镜区域。 导电凸块耦合到端子焊盘。

公开(公告)号：US07498556B2

公开(公告)日：2009-03-03

申请号：US11725041

申请日：2007-03-15

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/19 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/14 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。 一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。 在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20080083980A1

公开(公告)日：2008-04-10

申请号：US11753006

申请日：2007-05-24

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/13 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure; and a transparent base formed on the protection layer.

摘要翻译： 本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 第二接触焊盘，其形成在所述基板的下表面并且在所述连接通孔结构下方; 以及形成在保护层上的透明基底。

公开(公告)号：US20080211075A1

公开(公告)日：2008-09-04

申请号：US11950921

申请日：2007-12-05

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/04 ,  H01L21/71

CPC分类号： H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028

摘要： A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.

摘要翻译： 一种具有间隙的粘合性的半导体器件封装的结构，包括：具有接合焊盘的芯片和嵌入到具有模具窗口和互连通孔的衬底中的传感器区域，其中，RDL形成在衬底上，用于在接合 垫和相互连接的通孔; 形成在基板上的多个环（阻挡条），RDL和除了传感器区域之外的接合焊盘区域; 粘合剂胶水填充到除了传感器区域之外的多个环的空间中; 以及粘合在多个环的顶部上的透明材料和胶粘剂，其中粘合剂胶合透明材料和多个环之间的粘附。

公开(公告)号：US20080191335A1

公开(公告)日：2008-08-14

申请号：US11755293

申请日：2007-05-30

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.

摘要翻译： 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 除了微透镜，接合焊盘和接触焊盘之外，在裸片和基板上形成厚的电介质层。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 并且核芯浆料填充到芯片边缘和基板的管芯通孔的侧壁之间的间隙中。 通过粘合将透明盖设置在模具和厚介电层上，以在透明盖之间产生间隙。

公开(公告)号：US20080261346A1

公开(公告)日：2008-10-23

申请号：US12165876

申请日：2008-07-01

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/00

摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

摘要翻译： 本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

公开(公告)号：US20080157312A1

公开(公告)日：2008-07-03

申请号：US11647217

申请日：2006-12-29

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/00

摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

摘要翻译： 本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

公开(公告)号：US07459729B2

公开(公告)日：2008-12-02

申请号：US11647217

申请日：2006-12-29

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang

IPC分类号： H01L29/22 ,  H01L33/00 ,  H01L29/04 ,  H01L29/10 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/20 ,  H01L29/15 ,  H01L29/80 ,  H01L31/112 ,  H01L31/062 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/00

摘要： The present invention discloses a structure of package including: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

摘要翻译： 本发明公开了一种封装结构，包括：具有管芯接收通孔的基板，连接通孔结构和第一接触焊盘; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

公开(公告)号：US20080173792A1

公开(公告)日：2008-07-24

申请号：US11656410

申请日：2007-01-23

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19105 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

摘要： The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种图像传感器模块结构，其包括具有形成在基板的上表面内的模具接收空腔的基板和基板内的导电迹线以及具有设置在模具接收腔内的微透镜的模具。 在管芯和衬底上形成电介质层，在电介质层上形成再分配导电层（RDL），其中RDL耦合到管芯，并且导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。