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19 条记录 (耗时 0.015 秒)

    Method for encapsulating at least one organic light-emitting (OLED) device and OLED device
    1.
    发明申请
    Method for encapsulating at least one organic light-emitting (OLED) device and OLED device 有权
    用于封装至少一种有机发光（OLED）器件和OLED器件的方法

    公开(公告)号：US20060128042A1

    公开(公告)日：2006-06-15

    申请号：US11268338

    申请日：2005-11-07

    申请人： Wolfgang Gramann ,  Ewald Guenther

    发明人： Wolfgang Gramann ,  Ewald Guenther

    IPC分类号： H01L21/00

    CPC分类号： H01L51/5259 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/525

    摘要： A method for encapsulating at least one organic light-emitting (OLED) device (22) comprising the step of forming a concave region (24) on a plate (6) by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate (1) comprising at least one active region (23) such that the concave region (24) of the plate (6) spans over the active region (23). Also disclosed is a OLED device (22), in which at least a part of an encapsulation of the device is formed by applying a negative pressure to a predetermined area of a plate (6) forming a concave region (24) of the plate (6).

    摘要翻译： 一种用于封装至少一个有机发光（OLED）器件（22）的方法，包括通过向板的预定区域施加负压来在板（6）上形成凹区（24）的步骤。 板被附接到包括至少一个有源区（23）的衬底（1），使得板（6）的凹区（24）跨越有源区（23）。 还公开了一种OLED器件（22），其中通过向形成板的凹区域（24）的板（6）的预定区域施加负压来形成装置的至少一部分封装（22） 6）。

    Method for fabricating an optical transmitting subassembly
    4.
    发明授权
    Method for fabricating an optical transmitting subassembly 失效
    光发射子组件的制造方法

    公开(公告)号：US06693312B2

    公开(公告)日：2004-02-17

    申请号：US10200420

    申请日：2002-07-22

    申请人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    发明人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    IPC分类号： H01L310328

    CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423

    摘要： A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.

    摘要翻译： 以下列方式生产光电发射机组件：将玻璃晶片固定在透明底座上，随后使用目标锯齿形成在光学棱镜元件之间的V形凹槽。 将具有反射涂层的棒状元件插入到V形凹部中。 因此，来自半导体激光器的激光束在具有反射涂层的棒状元件上偏转90°，并穿过底座。

    Method for measuring product parameters of components formed on a wafer and device for performing the method
    5.
    发明授权
    Method for measuring product parameters of components formed on a wafer and device for performing the method 有权
    用于测量在晶片上形成的部件的产品参数的方法和用于执行该方法的装置

    公开(公告)号：US06946864B2

    公开(公告)日：2005-09-20

    申请号：US10078146

    申请日：2002-02-19

    申请人： Wolfgang Gramann ,  Raimund Oberschmid ,  Werner Späth ,  Wolfgang Teich

    发明人： Wolfgang Gramann ,  Raimund Oberschmid ,  Werner Späth ,  Wolfgang Teich

    IPC分类号： G01N21/66 ,  G01R31/28

    CPC分类号： G01N21/66

    摘要： A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.

    摘要翻译： 用于测量晶片的外延层（28）中的部件的产品参数的测量装置包括测量探针（3），其上安装有接触侧（23）的凹部（24），可以将电解液倒入其中。 电解液在与脉冲电流源的信号充电的接触体（11）和晶片（2）的表面（22）之间产生电连接。 检测器（16）用于检测由该部件发出的光。

    Method for producing a beam splitter molded part and optoelectronic module using the beam splitter molded part
    6.
    发明授权
    Method for producing a beam splitter molded part and optoelectronic module using the beam splitter molded part 有权
    用于制造分束器模制部件的方法和使用分束器模制部件的光电模块

    公开(公告)号：US06028708A

    公开(公告)日：2000-02-22

    申请号：US282040

    申请日：1999-03-30

    申请人： Wolfgang Gramann ,  Werner Spath

    发明人： Wolfgang Gramann ,  Werner Spath

    IPC分类号： G02B5/04 ,  G02B6/12 ,  G02B6/42 ,  G02B27/14 ,  G02B27/10

    CPC分类号： G02B27/1073 ,  G02B27/1006 ,  G02B6/4246 ,  G02B2006/12114 ,  G02B6/4214 ,  Y10S359/90

    摘要： A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.

    摘要翻译： 提供了一种用于从透明材料制造至少一个分束器模制部件的方法，其中分束器层被嵌入其中。 两个辐射透明晶片（其中一个设置有分束器层）以使得分束器层位于两个晶片之间的方式互连。 随后，该晶片组件被进一步处理以形成单独的棱镜锭，例如通过将它们锯切成晶片条并研磨或抛光侧面，或通过型材锯切。 用于双向光学数据传输的光电模块使用分束器模制部件。

    Optoelectronic component and method for the manufacture thereof
    7.
    发明授权
    Optoelectronic component and method for the manufacture thereof 失效
    光电子元件及其制造方法

    公开(公告)号：US5875205A

    公开(公告)日：1999-02-23

    申请号：US799494

    申请日：1997-02-12

    申请人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    发明人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    IPC分类号： H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/18 ,  H01S3/19

    CPC分类号： H01S5/02284 ,  H01S5/02292 ,  H01S5/0201 ,  H01S5/02248 ,  H01S5/0683

    摘要： In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

    摘要翻译： 在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中，透镜耦合光学器件被立即布置在激光器芯片的前面，并且以稳定的方式被调整和固定 一个简单的方法。 该组件在晶片联合中合理制造。 激光芯片布置在两个载体部件之间的公共载体上，其相对于激光芯片的谐振器面的侧表面设置有镜层，并且相对于谐振器面倾斜45度。 因此，在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面，并且透镜耦合光学器件被布置在至少一个载体部分上，使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。

    Optical sensing head and method for fabricating the sensing head
    8.
    发明授权
    Optical sensing head and method for fabricating the sensing head 有权
    光学感测头及其制造方法

    公开(公告)号：US07223952B2

    公开(公告)日：2007-05-29

    申请号：US10667717

    申请日：2003-09-22

    申请人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    发明人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    IPC分类号： G01B7/00

    CPC分类号： G11B7/1263 ,  G02B6/4214 ,  G11B7/123 ,  G11B7/22

    摘要： An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.

    摘要翻译： 用于读出光学数据存储器的光学检测头具有具有主表面的基板。 边缘发射激光器部件被构造在基板的主表面上，并具有基本上平行于第一主平面定向的照射轴。 偏转装置设置在基板的主表面上，并使激光辐射沿基本垂直于主表面的方向偏转。 提供至少一个信号检测器用于感测由光学数据存储器反射的激光辐射。 光学元件将偏转的激光辐射引导到光学数据存储器并将反射的激光辐射引导到信号检测器。 光学元件通过至少一个支撑元件连接到基板。 本发明还包括一种用于制造这种感测头的方法。