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公开(公告)号：USRE38280E1
公开(公告)日：2003-10-21
申请号：US09785346
申请日：2001-02-16
IPC分类号： G02B2714
CPC分类号： H04B10/40 , G02B6/4246
摘要： An optoelectric module for bidirectional optical data transmission has a molded element provided as a beam splitter, which consists essentially of a material that is transparent for the emitted radiation and the received radiation, and in which a beam splitter is embedded. A transmitting component, a receiving component and a radiation focusing device are advantageously directly connected to the molded element.
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2.发明授权Method for producing a beam splitter molded part and optoelectronic module using the beam splitter molded part 有权用于制造分束器模制部件的方法和使用分束器模制部件的光电模块
公开(公告)号：US06028708A
公开(公告)日：2000-02-22
申请号：US282040
申请日：1999-03-30
申请人： Wolfgang Gramann , Werner Spath
发明人： Wolfgang Gramann , Werner Spath
CPC分类号： G02B27/1073 , G02B27/1006 , G02B6/4246 , G02B2006/12114 , G02B6/4214 , Y10S359/90
摘要： A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.
摘要翻译： 提供了一种用于从透明材料制造至少一个分束器模制部件的方法，其中分束器层被嵌入其中。 两个辐射透明晶片（其中一个设置有分束器层）以使得分束器层位于两个晶片之间的方式互连。 随后，该晶片组件被进一步处理以形成单独的棱镜锭，例如通过将它们锯切成晶片条并研磨或抛光侧面，或通过型材锯切。 用于双向光学数据传输的光电模块使用分束器模制部件。
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公开(公告)号：US20070290383A1
公开(公告)日：2007-12-20
申请号：US11894569
申请日：2007-08-20
申请人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Spath , Gunter Waitl
发明人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Spath , Gunter Waitl
IPC分类号： B29D11/00
CPC分类号： G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.
摘要翻译： 公开了一种用于制造适于制造微透镜领域的透镜模具的方法。 该方法包括从由六边形安装件保持的紧密包装的球的一组模制模制透镜模具的步骤。
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公开(公告)号：US6137102A
公开(公告)日：2000-10-24
申请号：US343430
申请日：1999-06-30
CPC分类号： G11B5/59677 , G11B5/55 , G11B5/553 , G11B7/123 , G11B33/14
摘要： An optoelectronic sensor module is provided for recognition of reflection patterns on a magnetic data carrier. A laser component having a laser radiation axis, at least a first sensor photodetector laterally displaced relative to the laser radiation axis, electrically conducting bond pads and mutually electrically insulated conducting paths, are disposed on or in a silicon submount or cooling element. A lens configuration which is provided at a side of the laser emitter component opposite the cooling element, is fixed on the cooling element by at least one supporting web.
摘要翻译： 提供光电传感器模块用于识别磁数据载体上的反射图案。 具有激光辐射轴的激光组件，至少相对于激光辐射轴横向移位的第一传感器光电检测器，导电接合焊盘和相互电绝缘的导电路径，设置在硅基座或冷却元件上或硅基底座或冷却元件中。 设置在与冷却元件相对的激光发射器部件的一侧的透镜构造通过至少一个支撑腹板固定在冷却元件上。
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公开(公告)号：US6097521A
公开(公告)日：2000-08-01
申请号：US281816
申请日：1999-03-30
CPC分类号： G02B6/4246
摘要： An optoelectronic module for bidirectional optical data transmission has a molded element provided as a beam splitter, which consists essentially of a material that is transparent for the emitted radiation and the received radiation, and in which a beam splitter is embedded. A transmitting component, a receiving component and a radiation focusing device are advantageously directly connected to the molded element.
摘要翻译： 用于双向光学数据传输的光电模块具有作为分束器提供的模制元件，其基本上由对于所发射的辐射和所接收的辐射是透明的材料组成，并且其中嵌入有分束器。 发射部件，接收部件和辐射聚焦装置有利地直接连接到模制元件。
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公开(公告)号：US6087680A
公开(公告)日：2000-07-11
申请号：US127529
申请日：1998-07-31
申请人： Wolfgang Gramann , Werner Spath , Gunther Waitl , Herbert Brunner
发明人： Wolfgang Gramann , Werner Spath , Gunther Waitl , Herbert Brunner
IPC分类号： H01L25/075 , H01L27/15 , H01L33/40 , H01L33/00 , G09G3/32
CPC分类号： H01L33/40 , H01L25/0753 , H01L27/156 , H01L2224/73253 , H01L2924/09701 , H05K2201/10106
摘要： An LED device includes at least one LED chip having a front contact metallization disposed on a light exit surface of a light-emitting member and a rear contact metallization disposed on a side of the light-emitting member opposite the light exit surface. The LED chip is disposed between first and second conductor track supports. The first conductor track support is transparent and has at least one first electric conductor contacting the front contact metallization. The second conductor track support has at least one second electric conductor contacting the rear contact metallization. The LED device has, inter alia, the special advantage of permitting the size of the LED chips to be reduced, in contrast with the chip size in conventional LED devices, thus allowing the luminous spot density to be increased.
摘要翻译： LED装置包括至少一个LED芯片，其具有布置在发光部件的光出射面上的前接触金属化和设置在与光出射面相对的发光部件一侧的后接触金属化。 LED芯片设置在第一和第二导体轨道支架之间。 第一导体轨道支架是透明的并且具有接触前接触金属化的至少一个第一电导体。 第二导体轨道支撑件具有接触后接触金属化的至少一个第二电导体。 LED装置尤其具有允许将LED芯片尺寸减小的特殊优点，与常规LED器件中的芯片尺寸相反，从而允许增加发光斑点密度。
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公开(公告)号：US20090052178A1
公开(公告)日：2009-02-26
申请号：US12288376
申请日：2008-10-20
申请人： Werner Marchl , Werner Spath , Gunter Waitl
发明人： Werner Marchl , Werner Spath , Gunter Waitl
IPC分类号： F21V29/00
CPC分类号： H01L25/0753 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/12041 , Y10S362/80 , H01L2924/00012
摘要： A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
摘要翻译： 包括多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体，其中第一主区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。
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公开(公告)号：US5925898A
公开(公告)日：1999-07-20
申请号：US13292
申请日：1998-01-26
申请人： Werner Spath
发明人： Werner Spath
IPC分类号： H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/58 , H01S5/00 , H01S5/022 , H01S5/183 , H01L33/00
CPC分类号： H01L33/483 , H01L31/0203 , H01L31/0232 , H01L33/58 , H01S5/02288 , H01L2224/48091 , H01S5/02272 , H01S5/02276 , H01S5/183
摘要： An optoelectronic transducer configuration has a radiation-emitting and/or receiving semiconductor component fastened to a carrier plate in such a way that its beam exit/entry face is directed towards the carrier plate. The carrier plate is composed of a material which is transparent to the radiation. A device for focusing the radiation is additionally disposed on the carrier plate. The optoelectronic transducer is distinguished in particular by low reflection losses and simple mounting. A multiplicity of such transducers can be fabricated as a unit and then separated.
摘要翻译： 光电转换器配置具有固定到承载板的辐射发射和/或接收半导体部件，使得其光束出射/入射面朝向载体板。 承载板由对辐射透明的材料构成。 用于聚焦辐射的装置另外设置在载体板上。 特别是光电转换器的低反射损耗和简单的安装。 可以将多个这样的换能器制造为一个单元然后分离。
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公开(公告)号：US07135711B2
公开(公告)日：2006-11-14
申请号：US10488487
申请日：2002-08-30
申请人： Norbert Linder , Ernst Nirschl , Werner Spath
发明人： Norbert Linder , Ernst Nirschl , Werner Spath
IPC分类号： H01L29/22 , H01L29/227
CPC分类号： H01L33/08 , H01L27/156 , H01L33/20 , H01L33/46
摘要： An electroluminescent component (1), in particular an LED chip, which has a high external efficiency in conjunction with a simple construction. The electroluminescent component (1) has a substrate (2); a plurality of radiation decoupling elements arranged at a distance next to one another on the substrate (2) and having an active layer stack (7) with an emission zone (8); and a contact element (9) on each radiation decoupling element (4). The contact elements (9), whose width (b′) is dimensioned such that it is less than the width (b) of the radiation decoupling elements (4), are arranged centrally on the radiation decoupling elements (4), and the width (b) of the radiation decoupling elements (4), for a given height (h), is chosen to be so small that a substantial proportion of the light (11) radiated laterally from the emission zone (8) can be decoupled directly through the side areas (12) of the radiation decoupling elements (4).
摘要翻译： 电致发光元件（1），特别是LED芯片，结合简单的结构具有高的外部效率。 电致发光部件（1）具有基板（2）。 在衬底（2）上彼此相邻布置的多个辐射去耦元件，并具有带有发射区（8）的有源层堆叠（7）。 和每个辐射去耦元件（4）上的接触元件（9）。 尺寸小于辐射去耦元件（4）的宽度（b）的宽度（b'）的接触元件（9）被集中布置在辐射去耦元件（4）上，宽度 对于给定的高度（h），辐射去耦元件（4）的（b）被选择为非常小，使得从发射区（8）横向辐射的大部分光（11）可以直接通过 辐射去耦元件（4）的侧面区域（12）。
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公开(公告)号：US20050001223A1
公开(公告)日：2005-01-06
申请号：US10488487
申请日：2002-08-30
申请人： Norbert Linder , Ernst Nirschl , Werner Spath
发明人： Norbert Linder , Ernst Nirschl , Werner Spath
CPC分类号： H01L33/08 , H01L27/156 , H01L33/20 , H01L33/46
摘要： An electroluminescent component (1), in particular an LED chip, which has a high external efficiency in conjunction with a simple construction. The electroluminescent component (1) has a substrate (2); a plurality of radiation decoupling elements arranged at a distance next to one another on the substrate (2) and having an active layer stack (7) with an emission zone (8); and a contact element (9) on each radiation decoupling element (4). The contact elements (9), whose width (b′) is dimensioned such that it is less than the width (b) of the radiation decoupling elements (4), are arranged centrally on the radiation decoupling elements (4), and the width (b) of the radiation decoupling elements (4), for a given height (h), is chosen to be so small that a substantial proportion of the light (11) radiated laterally from the emission zone (8) can be decoupled directly through the side areas (12) of the radiation decoupling elements (4).
摘要翻译： 电致发光元件（1），特别是LED芯片，结合简单的结构具有高的外部效率。 电致发光部件（1）具有基板（2）。 在衬底（2）上彼此相邻布置的多个辐射去耦元件，并具有带有发射区（8）的有源层堆叠（7）。 和每个辐射去耦元件（4）上的接触元件（9）。 尺寸小于辐射去耦元件（4）的宽度（b）的宽度（b'）的接触元件（9）被集中布置在辐射去耦元件（4）上，宽度 对于给定的高度（h），辐射去耦元件（4）的（b）被选择为非常小，使得从发射区（8）横向辐射的大部分光（11）可以直接通过 辐射去耦元件（4）的侧面区域（12）。
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