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    Optoelectronic component
    4.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US07271425B2

    公开(公告)日：2007-09-18

    申请号：US10535794

    申请日：2003-11-27

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

    IPC分类号： H01L29/22

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.

    摘要翻译： 本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44） 向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分 在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。 本发明还涉及包括所述部件的装置。 组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

    Methods for producing a light emitting semiconductor body with a luminescence converter element
    5.
    发明授权
    Methods for producing a light emitting semiconductor body with a luminescence converter element 有权
    具有发光转换元件的发光半导体体的制造方法

    公开(公告)号：US07601550B2

    公开(公告)日：2009-10-13

    申请号：US10204576

    申请日：2001-03-02

    申请人： Georg Bogner ,  Günter Waitl ,  Alexandra Debray

    发明人： Georg Bogner ,  Günter Waitl ,  Alexandra Debray

    IPC分类号： H01L21/00

    CPC分类号： H01L33/501 ,  H01L2933/0041

    摘要： The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body.In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.

    摘要翻译： 本发明描述了制造半导体元件的两种方法，其中将发光转换元件直接应用于半导体本体（1）。 在第一种方法中，将含有粘合剂和至少一种发光材料（5）的悬浮液（4）分层地施加到半导体本体（1）上。 在下一步骤中，溶剂逸出，仅在半导体本体上仅留下具有粘合剂的发光材料（5）。 在第二种方法中，半导体本体（1）设置有直接施加发光材料（5）的粘合剂层（6）。

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
    6.
    发明授权
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
    发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座

    公开(公告)号：US07427806B2

    公开(公告)日：2008-09-23

    申请号：US11179028

    申请日：2005-07-18

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    IPC分类号： H01L23/20

    CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

    摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。

    Optoelectronic component
    8.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08314441B2

    公开(公告)日：2012-11-20

    申请号：US13084149

    申请日：2011-04-11

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

    摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。