公开(公告)号：US20030027081A1

公开(公告)日：2003-02-06

申请号：US10154555

申请日：2002-05-23

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC: H01R009/03 ,  G03C005/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US20030067009A1

公开(公告)日：2003-04-10

申请号：US10281421

申请日：2002-10-25

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Philip D. Floyd ,  Thomas L. Paoli ,  Decai Sun

IPC: H01L027/15

CPC classification number: H01S5/0261 ,  H01S5/18313 ,  H01S5/1833 ,  H01S5/18388

Abstract: Semiconductor devices in an optoelectronic integrated circuit are electrically isolated from each other by using planar lateral oxidation to oxidize a buried semiconductor layer vertically separating the semiconductor devices.

Abstract translation: 光电子集成电路中的半导体器件通过使用平面横向氧化来彼此电绝缘以氧化垂直分离半导体器件的掩埋半导体层。

公开(公告)号：US20020110758A1

公开(公告)日：2002-08-15

申请号：US09780165

申请日：2001-02-09

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Christopher L. Chua

IPC: G03C005/00

CPC classification number: H01F17/0033 ,  H05K1/165 ,  H05K3/4092

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. Structures and methods for adjusting the coil diameter after spring release, if necessary, are also disclosed. In one method the radius of curvature of the released elastic members is controlled by depositing a layer of a reflow material and reflowing the layer after release. The high yield structures may be used in numerous electronic applications such as filter circuits.

Abstract translation: 描述了用于提高包括弹簧和线圈在内的平面外微结构结构的产量的几种方法和结构。 还公开了如果需要，在弹簧释放之后调节线圈直径的结构和方法。 在一种方法中，释放的弹性构件的曲率半径通过沉积回流材料层并在释放之后回流来控制。 高产量结构可用于许多电子应用中，例如滤波电路。

公开(公告)号：US20030030965A1

公开(公告)日：2003-02-13

申请号：US10154995

申请日：2002-05-23

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Eric Peeters ,  Koenraad F. Van Schuylenbergh ,  Donald L. Smith

IPC: H01G004/228

CPC classification number: H01G5/16 ,  H01G5/18

Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.

公开(公告)号：US20020125980A1

公开(公告)日：2002-09-12

申请号：US10004819

申请日：2001-12-07

Applicant: Xerox Corporation

Inventor： David K. Biegelsen ,  Christopher L. Chua ,  David K. Fork

IPC: H01F005/00

CPC classification number: H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01F2027/2814 ,  H01G5/18 ,  H01G5/38 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K3/4092 ,  H01L2924/00014

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. Alternately, the loop winding can be formed of two elastic members in which the free ends are joined in mid-air. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US20020080554A1

公开(公告)日：2002-06-27

申请号：US09975358

申请日：2001-10-11

Applicant: Xerox Corporation.

Inventor： Christopher L. Chua ,  Eric Peeters ,  Koenraad F. Schuylenbergh ,  Donald L. Smith

IPC: H01G004/35

CPC classification number: H01G5/16 ,  H01G5/18

Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.

Abstract translation: 一种新型的高Q可变电容器包括：衬底，固定到衬底的第一导电层，固定到导电层的一部分的电介质层;以及第二导电层，具有锚固部分和自由部分 。 锚固部分​​固定在电介质层上，自由部分最初固定在电介质层上，但是从电介质层释放出来，与电介质层分离，其中第二导电层中的固有应力分布使 远离电介质层的自由部分。 当在第一导电层和第二导电层之间施加偏置电压时，自由部分中的静电力将自由部分弯曲朝向第一导电层，从而增加电容器的电容。

公开(公告)号：US20030231683A1

公开(公告)日：2003-12-18

申请号：US10159930

申请日：2002-05-30

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Michael A. Kneissl ,  David P. Bour

IPC: H01S005/00

CPC classification number: B82Y20/00 ,  H01S5/0216 ,  H01S5/0217 ,  H01S5/0425 ,  H01S5/18341 ,  H01S5/18358 ,  H01S5/18369 ,  H01S5/3095 ,  H01S5/34333 ,  H01S5/423 ,  H01S2301/176

Abstract: A nitride based resonant cavity semiconductor structure has highly reflective mirrors on opposite sides of the active layer. These highly reflective mirrors can be distributed Bragg reflectors or metal terminated layer stacks of dielectric materials. The nitride based resonant cavity semiconductor structure can be vertical cavity surface emitting laser (VCSEL), a light emitting diode (LED), or a photodetector (PD), or a combination of these devices.

Abstract translation: 基于氮化物的谐振腔半导体结构在有源层的相对侧上具有高反射镜。 这些高反射镜可以是分布式布拉格反射器或介电材料的金属端接层堆叠。 基于氮化物的谐振腔半导体结构可以是垂直腔表面发射激光器（VCSEL），发光二极管（LED）或光电检测器（PD）或这些器件的组合。

公开(公告)号：US20030179064A1

公开(公告)日：2003-09-25

申请号：US10387203

申请日：2003-03-11

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC: H01F005/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US20010053620A1

公开(公告)日：2001-12-20

申请号：US09794101

申请日：2001-02-28

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  David K. Fork ,  Patrick G. Kim ,  Linda Romano

IPC: H05K001/00 ,  H01R012/00 ,  H01R013/44

CPC classification number: H05K3/325 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01R4/04 ,  H01R12/52 ,  H01L2924/00

Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.

Abstract translation: 一种用于互连至少两个装置的方法和装置。 互连设备中的每一个包括用于电和/或物理互连设备的接触结构。 优选地，用于至少一个装置的接触结构包括弹簧接触件。 将诸如UV可固化粘合剂的粘合剂施加到装置中的一个的至少一部分，并且一旦施加了粘合剂，则将这些装置组装，即使其具有足够的接近性，使得接触结构将装置 。 粘合剂可以直接施加到装置中的一个的接触结构和/或可以施加到装置的其它部分，使得粘合剂在组装期间流过接触结构。 然后固化粘合剂以将装置粘合在一起。 在组装设备之前应用粘合剂可以防止接触结构之间的互连干扰，特别是如果接触结构包括与相应接触垫电连接的弹簧触点。

公开(公告)号：US20030010615A1

公开(公告)日：2003-01-16

申请号：US09904370

申请日：2001-07-11

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Christopher L. Chua

IPC: H01H001/02

CPC classification number: B81C1/00666 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81C1/00476 ,  G01R1/06727 ,  G01R3/00 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/035 ,  H01R13/24 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  H01L2924/00

Abstract: Efficient methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure after release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger. A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material on the cantilevered tip of the finger. The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating on the upper surface and front edge of the finger tip.

Abstract translation: 公开了用于制造弹簧结构的有效方法，其中在释放之后将无源导电涂层沉积到弹簧结构上。 释放层沉积在基底上，然后在其上形成弹簧金属层。 然后使用第一掩模来蚀刻弹簧金属层以形成弹簧金属指。 然后沉积第二（释放）掩模，其限定用于去除释放层的一部分并释放弹簧金属指的自由端的释放窗口。 在随后将导电涂层材料定向沉积在手指的悬臂尖端上时，第二掩模也用作掩模。 然后剥离第二个掩模，并且将其上沉积的残余涂层剥离。 所得到的弹簧结构包括在指尖的上表面和前边缘上的导电涂层。