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11 条记录 (耗时 0.031 秒)

    Through silicon via noise suppression using buried interface contacts
    1.
    发明授权
    Through silicon via noise suppression using buried interface contacts 有权
    通过硅通过噪声抑制使用埋入式接口

    公开(公告)号：US08809995B2

    公开(公告)日：2014-08-19

    申请号：US13408300

    申请日：2012-02-29

    申请人： Xiaomin Duan ,  Xiaoxiong Gu ,  Yong Liu ,  Joel A. Silberman

    发明人： Xiaomin Duan ,  Xiaoxiong Gu ,  Yong Liu ,  Joel A. Silberman

    IPC分类号： H01L23/528

    CPC分类号： H01L23/481 ,  H01L23/535 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： Circuits for shielding devices from electromagnetic coupling with through-silicon vias are shown that include a substrate having a through via, which provides access to a device layer on a first surface of the circuit to a device layer on a second surface of the circuit; a conductive layer on the first side of the substrate; a contact point on one of the device layers; and a grounded buried interface tie on the conductive layer, adjacent to the contact point, to isolate the contact point from coupling noise.

    摘要翻译： 示出了用于屏蔽器件与通过硅通孔的电磁耦合的电路，其包括具有通孔的衬底，其提供对电路的第一表面上的器件层的访问到电路的第二表面上的器件层; 在所述基板的第一侧上的导电层; 一个设备层上的接触点; 以及在接触点附近的导电层上的接地埋入界面，以将接触点与耦合噪声隔离。

    THROUGH SILICON VIA NOISE SUPPRESSION USING BURIED INTERFACE CONTACTS
    2.
    发明申请
    THROUGH SILICON VIA NOISE SUPPRESSION USING BURIED INTERFACE CONTACTS 有权
    通过使用BURIED接口联系的噪声抑制通过硅

    公开(公告)号：US20130221484A1

    公开(公告)日：2013-08-29

    申请号：US13408300

    申请日：2012-02-29

    申请人： Xiaomin Duan ,  Xiaoxiong Gu ,  Yong Liu ,  Joel A. Silberman

    发明人： Xiaomin Duan ,  Xiaoxiong Gu ,  Yong Liu ,  Joel A. Silberman

    IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L29/92

    CPC分类号： H01L23/481 ,  H01L23/535 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： Circuits for shielding devices from electromagnetic coupling with through-silicon vias are shown that include a substrate having a through via, which provides access to a device layer on a first surface of the circuit to a device layer on a second surface of the circuit; a conductive layer on the first side of the substrate; a contact point on one of the device layers; and a grounded buried interface tie on the conductive layer, adjacent to the contact point, to isolate the contact point from coupling noise.

    摘要翻译： 示出了用于屏蔽器件与通过硅通孔的电磁耦合的电路，其包括具有通孔的衬底，其提供对电路的第一表面上的器件层的访问到电路的第二表面上的器件层; 在所述基板的第一侧上的导电层; 一个设备层上的接触点; 以及在接触点附近的导电层上的接地埋入界面，以将接触点与耦合噪声隔离。

    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION
    3.
    发明申请
    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION 有权
    轴向焊接网格阵列接触和制造方法

    公开(公告)号：US20120325541A1

    公开(公告)日：2012-12-27

    申请号：US13604363

    申请日：2012-09-05

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11 ,  H01R43/00

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Phased-array transceiver
    4.
    发明授权
    Phased-array transceiver 有权
    相控阵收发器

    公开(公告)号：US09203159B2

    公开(公告)日：2015-12-01

    申请号：US13371924

    申请日：2012-02-13

    申请人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

    发明人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

    IPC分类号： H01Q1/24 ,  H01Q21/06

    CPC分类号： H01Q21/061 ,  H01L2224/16225 ,  H01Q21/065 ,  H01Q23/00 ,  H04B7/04 ,  Y10T29/49016

    摘要： Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

    摘要翻译： 公开了针对收发器设备的系统，方法，设备和设备。 根据一种方法，选择电路封装的电路布局的一组部分的第一部分中的第一组天线位置。 该方法还包括在电路布局的另一部分中选择另一组天线位置，使得另一组的所选择的天线位置的布置与先前选择的一组天线位置的选定天线位置的布置不同。 迭代在另一部分中选择另一组位置，直到对天线总数进行选择。 执行另一组的选择，使得另一部分中的连续未选定位置不超过预定数量的位置。 此外，天线元件形成在所选择的位置以制造电路封装。

    Axiocentric scrubbing land grid array contacts and methods for fabrication
    6.
    发明授权
    Axiocentric scrubbing land grid array contacts and methods for fabrication 有权
    轴心洗涤地面网格阵列触点和制造方法

    公开(公告)号：US09040841B2

    公开(公告)日：2015-05-26

    申请号：US13604363

    申请日：2012-09-05

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11 ,  H05K3/40 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K3/32

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Axiocentric scrubbing land grid array contacts and methods for fabrication
    9.
    发明授权
    Axiocentric scrubbing land grid array contacts and methods for fabrication 有权
    轴心洗涤地面网格阵列触点和制造方法

    公开(公告)号：US08263879B2

    公开(公告)日：2012-09-11

    申请号：US12614224

    申请日：2009-11-06

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。