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    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION
    1.
    发明申请
    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION 有权
    轴向焊接网格阵列接触和制造方法

    公开(公告)号：US20120325541A1

    公开(公告)日：2012-12-27

    申请号：US13604363

    申请日：2012-09-05

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11 ,  H01R43/00

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Axiocentric scrubbing land grid array contacts and methods for fabrication
    2.
    发明授权
    Axiocentric scrubbing land grid array contacts and methods for fabrication 有权
    轴心洗涤地面网格阵列触点和制造方法

    公开(公告)号：US08263879B2

    公开(公告)日：2012-09-11

    申请号：US12614224

    申请日：2009-11-06

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION
    3.
    发明申请
    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION 有权
    轴向焊接网格阵列接触和制造方法

    公开(公告)号：US20110108316A1

    公开(公告)日：2011-05-12

    申请号：US12614224

    申请日：2009-11-06

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11 ,  G03F7/20

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电部件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Axiocentric scrubbing land grid array contacts and methods for fabrication
    4.
    发明授权
    Axiocentric scrubbing land grid array contacts and methods for fabrication 有权
    轴心洗涤地面网格阵列触点和制造方法

    公开(公告)号：US09040841B2

    公开(公告)日：2015-05-26

    申请号：US13604363

    申请日：2012-09-05

    申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC分类号： H05K1/11 ,  H05K3/40 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K3/32

    CPC分类号： H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    摘要： A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    摘要翻译： 接触结构和组件及其制造方法用于微电子器件包括第一和第二导电接触件，其为螺旋形的。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Two mask process for electroplating metal employing a negative electrophoretic photoresist
    9.
    发明授权
    Two mask process for electroplating metal employing a negative electrophoretic photoresist 有权
    使用负电泳光致抗蚀剂的电镀金属的两个掩模工艺

    公开(公告)号：US09340892B2

    公开(公告)日：2016-05-17

    申请号：US13584326

    申请日：2012-08-13

    申请人： Gareth G. Hougham ,  Gerard McVicker ,  Anna Pratt

    发明人： Gareth G. Hougham ,  Gerard McVicker ,  Anna Pratt

    IPC分类号： G03F7/213 ,  C25D17/12 ,  G03F7/20 ,  G03F7/00 ,  C25D1/00 ,  C25D5/02 ,  C25D13/00

    CPC分类号： C25D17/12 ,  C25D1/003 ,  C25D5/022 ,  C25D13/00 ,  G03F7/0037 ,  G03F7/2022 ,  G03F7/203 ,  Y10T428/24562

    摘要： A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.

    摘要翻译： 将负电泳光致抗蚀剂施加在基板上的多个突出的一次性模板部分上。 筒状结构放置在横向包围多个突出的一次性模板部分的负电泳光致抗蚀剂的平面部分上。 负电泳光致抗蚀剂利用筒仓结构和第一平版印刷掩模进行光刻曝光，第一光刻掩模包括具有分离的不透明图案的透明基板。 在移除筒仓结构之后，使用第二光刻掩模将负电泳光致抗蚀剂光刻曝光，其包括覆盖负电泳光刻胶的平面部分的透明区域的图案，而不是随后通过电镀形成的金属结构的基底区域 。 负电泳光致抗蚀剂被开发以在其中形成空腔，并且通过在腔内电镀形成金属结构。 负电泳光致抗蚀剂和多个突出的一次性模板部分可以随后被去除。