-
公开(公告)号：US09133327B2
公开(公告)日：2015-09-15
申请号：US14344272
申请日：2012-09-11
申请人： Xiaosong Wu , Kim L. Walton , Jeffrey C. Munro
发明人： Xiaosong Wu , Kim L. Walton , Jeffrey C. Munro
CPC分类号： C08L23/26 , C08L23/0815 , C08L23/10 , C08L2205/025 , C08L2312/00
摘要： The invention provides a composition comprising at least the following: A) an ethylene/α-olefin interpolymer; B) an olefin-based polymer; and C) a crosslinking agent; and wherein the ethylene/α-olefin interpolymer of component A) has the following properties: i) has a density greater than, or equal to, 0.850 g/cc; ii) a molar ratio of “vinyl to total unsaturation” greater than, or equal to, 1/10; iii) an 1 10/12 ratio from 6.2 to 40.
摘要翻译： 本发明提供至少包含以下物质的组合物：A）乙烯/α-烯烃互聚物; B）烯烃类聚合物; 和C）交联剂; 并且其中组分A）的乙烯/α-烯烃互聚物具有以下性质：i）具有大于或等于0.850g / cc的密度; ii）“乙烯基与总不饱和度”的摩尔比大于或等于1/10; iii）1/10/12的比例为6.2〜40。
-
公开(公告)号：US20140357799A1
公开(公告)日：2014-12-04
申请号：US14344272
申请日：2012-09-11
申请人： Xiaosong Wu , Kim L. Walton , Jeffrey C. Munro
发明人： Xiaosong Wu , Kim L. Walton , Jeffrey C. Munro
IPC分类号： C08L23/26
CPC分类号： C08L23/26 , C08L23/0815 , C08L23/10 , C08L2205/025 , C08L2312/00
摘要： The invention provides a composition comprising at least the following: A) an ethylene/α-olefin interpolymer; B) an olefin-based polymer; and C) a crosslinking agent; and wherein the ethylene/α-olefin interpolymer of component A) has the following properties: i) has a density greater than, or equal to, 0.850 g/cc; ii) a molar ratio of “vinyl to total unsaturation” greater than, or equal to, 1/10; iii) an 110/12 ratio from 6.2 to 40.
摘要翻译： 本发明提供至少包含以下物质的组合物：A）乙烯/α-烯烃互聚物; B）烯烃类聚合物; 和C）交联剂; 并且其中组分A）的乙烯/α-烯烃互聚物具有以下性质：i）具有大于或等于0.850g / cc的密度; ii）“乙烯基与总不饱和度”的摩尔比大于或等于1/10; iii）110/12比例为6.2〜40。
-
公开(公告)号：US20130296494A1
公开(公告)日：2013-11-07
申请号：US13465140
申请日：2012-05-07
CPC分类号： C08L23/142 , C08L2203/162 , C08L23/0815
摘要： A composition of matter particularly well suited for use as a peelable seal layer is described. The composition comprises from about 50 to about 85 percent by weight of a first polymer and from 15 to 50 percent of a second polymer. The first polymer is a propylene based polymer characterized by having a melting point of at least 125° C. together with a Comonomer Composition Distribution Breadth (“CCDB”) less than 2. The second polymer is characterized by having an interfacial adhesion with the first polymer of less than 1 lb/inch.
摘要翻译： 描述了特别适合用作可剥离密封层的物质组合物。 组合物包含约50至约85重量％的第一聚合物和15至50重量％的第二聚合物。 第一聚合物是丙烯基聚合物，其特征在于熔点至少为125℃，共聚单体组合物分布宽度（“CCDB”）小于2.第二聚合物的特征在于与第一聚合物具有界面粘合 聚合物小于1磅/英寸。
-
公开(公告)号：US08691916B2
公开(公告)日：2014-04-08
申请号：US13465140
申请日：2012-05-07
CPC分类号： C08L23/142 , C08L2203/162 , C08L23/0815
摘要： A composition of matter particularly well suited for use as a peelable seal layer is described. The composition comprises from about 50 to about 85 percent by weight of a first polymer and from 15 to 50 percent of a second polymer. The first polymer is a propylene based polymer characterized by having a melting point of at least 125° C. together with a Comonomer Composition Distribution Breadth (“CCDB”) less than 2. The second polymer is characterized by having an interfacial adhesion with the first polymer of less than 1 lb/inch.
摘要翻译： 描述了特别适合用作可剥离密封层的物质组合物。 组合物包含约50至约85重量％的第一聚合物和15至50重量％的第二聚合物。 第一聚合物是丙烯基聚合物，其特征在于熔点至少为125℃，共聚单体组合物分布宽度（“CCDB”）小于2.第二聚合物的特征在于与第一聚合物具有界面粘合 聚合物小于1磅/英寸。
-
5.发明申请公开(公告)号：US20130316111A1
公开(公告)日：2013-11-28
申请号：US13991545
申请日：2011-12-29
申请人： Xiaosong Wu , Jose M. Rego , Kim L. Walton , Brian W. Walther , Michael D. Read
发明人： Xiaosong Wu , Jose M. Rego , Kim L. Walton , Brian W. Walther , Michael D. Read
IPC分类号： C08L47/00
CPC分类号： C08L47/00 , C08L23/10 , C08L23/16 , Y10T428/139
摘要： A composition comprising at least the following components: (A) a first composition comprising the following: i) a first interpolymer comprising, in polymerized form, ethylene, an α-olefin, and a nonconjugated polyene; ii) a second interpolymer comprising, in polymerized form, ethylene, an α-olefin and a nonconjugated polyene; and wherein the first composition has an MWD less than, or equal to, 3.5, a Mooney Viscosity (ML (1+4 @125° C.)) greater than, or equal to, 80, and an [(ML(1+4 @125° C.))/Mw(conv)]*1000 greater than 0.429 mole/g; (B) a thermoplastic polymer; and (C) a vulcanization agent is provided. A crosslinked composition made by heating one or more of the inventive compositions is also provided. Articles made from one or more of the inventive compositions are also provided.
摘要翻译： 至少包含以下组分的组合物：（A）包含以下物质的第一组合物：i）以聚合形式包含乙烯，α-烯烃和非共轭多烯的第一共聚体; ii）以聚合形式包含乙烯，α-烯烃和非共轭多烯的第二共聚体; 并且其中第一组合物的MWD小于或等于3.5，大于或等于80的门尼粘度（ML（1 + 4 @ 125℃））和[（ML（1+ 4 @ 125℃））/ Mw（conv）] * 1000大于0.429摩尔/ g; （B）热塑性聚合物; 和（C）硫化剂。 还提供了通过加热一种或多种本发明组合物制备的交联组合物。 还提供了由一种或多种本发明组合物制成的制品。
-
公开(公告)号：US20110082258A1
公开(公告)日：2011-04-07
申请号：US12896585
申请日：2010-10-01
IPC分类号： C08L53/00
CPC分类号： C08F297/083 , C08K3/013 , C08K5/01 , C08L23/00 , C08L23/06 , C08L23/12 , C08L53/00 , C08L2666/24 , C08L2666/06
摘要： Embodiments of the invention provide block composites and their use in thermoplastic vulcanizate compounds.
摘要翻译： 本发明的实施方案提供了嵌段复合材料及其在热塑性硫化胶料中的应用。
-
公开(公告)号：US10072146B2
公开(公告)日：2018-09-11
申请号：US13991545
申请日：2011-12-29
申请人： Xiaosong Wu , Jose M. Rego , Kim L. Walton , Brian W. Walther , Michael D. Read
发明人： Xiaosong Wu , Jose M. Rego , Kim L. Walton , Brian W. Walther , Michael D. Read
CPC分类号： C08L47/00 , C08L23/10 , C08L23/16 , Y10T428/139
摘要： A composition comprising at least the following components: (A) a first composition comprising the following: i) a first interpolymer comprising, in polymerized form, ethylene, an α-olefin, and a nonconjugated polyene; ii) a second interpolymer comprising, in polymerized form, ethylene, an α-olefin and a nonconjugated polyene; and wherein the first composition has an MWD less than, or equal to, 3.5, a Mooney Viscosity (ML (1+4 @125° C.)) greater than, or equal to, 80, and an [(ML(1+4 @125° C.))/Mw(conv)]*1000 greater than 0.429 mole/g; (B) a thermoplastic polymer; and (C) a vulcanization agent is provided. A crosslinked composition made by heating one or more of the inventive compositions is also provided. Articles made from one or more of the inventive compositions are also provided.
-
公开(公告)号：US08476366B2
公开(公告)日：2013-07-02
申请号：US12896585
申请日：2010-10-01
CPC分类号： C08F297/083 , C08K3/013 , C08K5/01 , C08L23/00 , C08L23/06 , C08L23/12 , C08L53/00 , C08L2666/24 , C08L2666/06
摘要： Embodiments of the invention provide block composites and their use in thermoplastic vulcanizate compounds.
摘要翻译： 本发明的实施方案提供了嵌段复合材料及其在热塑性硫化胶料中的应用。
-
公开(公告)号：US09330820B2
公开(公告)日：2016-05-03
申请号：US13873961
申请日：2013-04-30
申请人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
发明人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
IPC分类号： H01B13/00 , A61B5/00 , A61M37/00 , H05K1/02 , C25D1/00 , C25D1/10 , C25D5/02 , A61N1/32 , H05K3/40 , H05K3/20
CPC分类号： B32B3/30 , A61B5/685 , A61B2562/125 , A61M37/0015 , A61M2037/0053 , A61N1/327 , C25D1/003 , C25D1/10 , C25D5/022 , H01B13/00 , H05K1/02 , H05K3/20 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/0113 , Y10T428/2958 , Y10T428/298
摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.
摘要翻译： 提供用于制造三维导电结构的方法。 还提供三维导电微结构。 该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压缩; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。 在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。
-
公开(公告)号：US20140377548A1
公开(公告)日：2014-12-25
申请号：US14364333
申请日：2012-12-27
摘要： The multilayer film comprises a first outer layer which is heat sealable. The first outer layer comprises from 95 to 100 percent (by weight of the first outer layer) of a first polymer, said first polymer being derived from propylene monomer and optionally one or more comonomers selected from the group consisting of ethylene and C4-C8 alpha olefins. The first polymer should have a melting point of at least 125 C. The multilayer film further comprises an inner portion adjacent to the first outer layer. The inner portion may be a single layer or may comprise several layers. At least one layer of the inner portion comprises an elastomeric propylene based polymer (“EPBP”). Further at least one layer of the inner portion comprises a second polymer, wherein the second polymer is selected from the group consisting of high pressure low density polyethylene, high density polyethylene, ethylene acrylic acid copolymers, ethylene (meth)acrylic acid copolymers and combinations thereof. The second polymer may be together with the EPBP in the same layer or may be in a separate layer. It is also contemplated that the inner portion may optionally comprise one or more additional layers, which may or may not contain EPBP or the second polymer. The multilayer film further comprises a second outer layer arranged so that the inner portion is encapsulated between the first outer layer and the second outer layer. The second outer layer comprises a third polymer, wherein said third polymer is selected from the group consisting of homopolymer polypropylene, random copolymer polypropylene and impact copolymer polypropylene and blends thereof.
摘要翻译： 多层膜包括可热封的第一外层。 第一外层包含95至100％（按第一外层的重量计）第一聚合物，所述第一聚合物衍生自丙烯单体和任选的一种或多种选自乙烯和C 4 -C 8α-烯烃的共聚单体 烯烃。 第一聚合物应具有至少125℃的熔点。多层膜还包括与第一外层相邻的内部部分。 内部可以是单层，或者可以包括几层。 至少一层内部部分包括弹性体丙烯基聚合物（“EPBP”）。 此外，内部部分的至少一层包括第二聚合物，其中第二聚合物选自高压低密度聚乙烯，高密度聚乙烯，乙烯丙烯酸共聚物，乙烯（甲基）丙烯酸共聚物及其组合 。 第二聚合物可以与EPBP一起在同一层中，或者可以在单独的层中。 还可以预期的是，内部部分可以任选地包括一个或多个另外的层，其可以含有或不包含EPBP或第二聚合物。 多层膜还包括第二外层，其布置成使得内部部分被封装在第一外层和第二外层之间。 第二外层包括第三聚合物，其中所述第三聚合物选自均聚聚丙烯，无规共聚物聚丙烯和抗冲共聚物聚丙烯及其共混物。
-
-
-
-
-
-
-
-
-
搜索结果
34 条记录 (耗时 0.028 秒)