公开(公告)号：US20120125679A1

公开(公告)日：2012-05-24

申请号：US13032653

申请日：2011-02-23

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0245 ,  H05K1/116

摘要： A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.

摘要翻译： 印刷电路板包括绝缘板，一对差动通孔和多个布线层。 一对通孔延伸穿过绝缘板的相对表面。 差分过孔对应于一对通孔。 每个差分通孔包括一个金属电镀桶和两个通孔捕获垫。 电镀桶被镀在相应通孔的内表面上，并且终止于绝缘板的两个相对表面的每一个。 通孔捕获垫形成在绝缘板的围绕通孔的开口的相对表面上，并且电连接到电镀桶。 布线层布置在绝缘板中，并且每个限定围绕所有通孔捕获垫的间隙孔。

公开(公告)号：US20120145448A1

公开(公告)日：2012-06-14

申请号：US13031617

申请日：2011-02-22

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0225 ,  H05K1/0295 ,  H05K1/0298 ,  H05K1/113

摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

摘要翻译： 具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。 衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。 第一和第二对焊盘安装在信号层上。 每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。 第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。 第二保留开口形成在第二参考层上并围绕其上的通孔。

公开(公告)号：US20110168437A1

公开(公告)日：2011-07-14

申请号：US12693418

申请日：2010-01-25

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K1/0245 ,  H05K1/0231 ,  H05K2201/09236

摘要： A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.

摘要翻译： 印刷电路板（PCB）包括包括第一和第二段的正差分信号线，包括第三和第四段的负差分信号线，焊接在PCB的相对表面上的第一和第二连接元件。 第一段和第四段位于具有第一介电常数的第一直线中。 第三段和第二段位于具有与第一介电常数不同的第二介电常数的第二直线上。 第一连接元件连接在第一段和第二段之间。 第二连接元件连接在第三段和第四段之间。

公开(公告)号：US20110271025A1

公开(公告)日：2011-11-03

申请号：US12824850

申请日：2010-06-28

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

IPC分类号： G06F13/00

CPC分类号： H05K1/113 ,  G06F1/185 ,  H05K1/0251 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/10159

摘要： A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

摘要翻译： 计算机主板包括印刷电路板，其包括中央处理单元（CPU）插座和一组存储器插槽。 该组存储器插槽包括一个在线型存储器插槽和一个表面安装器件（SMD）型存储器插槽。 在线型存储槽包括多个电镀通孔。 SMD型内存插槽设置在串行型内存插槽和CPU插槽之间。 在线式存储插槽的通孔通过走线连接到CPU插座，SMD型存储插槽的焊盘连接到具有相同引脚定义的在线型存储器插槽的相应通孔。

公开(公告)号：US20120147579A1

公开(公告)日：2012-06-14

申请号：US12978527

申请日：2010-12-24

申请人： CHENG-HSIEN LEE ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  SHIN-TING YEN

发明人： CHENG-HSIEN LEE ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  SHIN-TING YEN

IPC分类号： H05K7/00

CPC分类号： H05K1/0295 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/113 ,  H05K2201/10015

摘要： A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.

摘要翻译： 印刷电路板包括高速差分信号控制芯片，第一至第八耦合电容器焊盘，第一至第四连接器焊盘，第一传输线，第二传输线，第三传输线，第四传输线，第一至第八 传输线，两个第九传输线，第一和第二通孔以及第一至第四共享焊盘。 印刷电路板可操作以选择性地支撑多个连接器。

公开(公告)号：US20110114379A1

公开(公告)日：2011-05-19

申请号：US12633653

申请日：2009-12-08

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

IPC分类号： H01R12/00

CPC分类号： H05K1/0295 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/029 ,  H05K3/222 ,  H05K2201/09481 ,  H05K2201/09636 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10636 ,  Y02P70/611

摘要： A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.

摘要翻译： 印刷电路板可以通过选择性地设置印刷电路板上的连接部件来支持不同的连接器，而不改变传输线的接线或在印刷电路板中形成新的通孔。

公开(公告)号：US20120016620A1

公开(公告)日：2012-01-19

申请号：US12978418

申请日：2010-12-24

申请人： SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  WEN-LAING TSENG ,  YUNG-CHIEH CHEN ,  YU-CHANG PAI ,  SHOU-KUO HSU

发明人： SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  WEN-LAING TSENG ,  YUNG-CHIEH CHEN ,  YU-CHANG PAI ,  SHOU-KUO HSU

IPC分类号： G06F19/00

CPC分类号： G01R31/2808

摘要： A system and method for testing objects using a mechanical arm includes establishing coordinate system based on a work area of the mechanical arm, and obtaining test parameters from a storage system. The method further includes controlling the mechanical arm to get an object and position the object to the position of a test platform according to the test parameters, controlling the mechanical arm to get test tool from a tool shelf and position the test tool to a position of test point on the object to test the object according to the test parameters. The method also includes controlling the mechanical arm to get the object from the test platform and position the object to the location reserved for the object according to the test parameters.

摘要翻译： 使用机械臂测试物体的系统和方法包括基于机械臂的工作区域建立坐标系，以及从存储系统获得测试参数。 该方法还包括控制机械臂以获得物体，并根据测试参数将物体定位到测试平台的位置，控制机械臂从工具架获得测试工具，并将测试工具定位到 对象上的测试点根据测试参数测试对象。 该方法还包括控制机械臂以从测试平台获得物体，并根据测试参数将物体定位到为对象保留的位置。

公开(公告)号：US20110102103A1

公开(公告)日：2011-05-05

申请号：US12638992

申请日：2009-12-16

申请人： SHEN-CHUN LI ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIEN-CHUAN LIANG

发明人： SHEN-CHUN LI ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIEN-CHUAN LIANG

IPC分类号： H03H7/01

CPC分类号： H03H7/0115 ,  H03H1/0007 ,  H03H7/0153 ,  H03H7/175 ,  H03H7/1775

摘要： Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, and thickness of each of dielectric layers can be changed. When any component needs to be replaced, the filter can be detached as needed.

摘要翻译： 可以通过改变滤波器的每个分量的结构来改变射频滤波器的参数。 可以改变每个部件的材料，每个磁性圆筒的直径，每个导电线圈的密度和每个介电层的厚度。 当需要更换任何组件时，可以根据需要拆卸过滤器。

公开(公告)号：US20110047524A1

公开(公告)日：2011-02-24

申请号：US12701677

申请日：2010-02-08

申请人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  CHUN-JEN CHEN ,  SHOU-KUO HSU ,  DUEN-YI HO ,  YUNG-CHIEH CHEN

发明人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  CHUN-JEN CHEN ,  SHOU-KUO HSU ,  DUEN-YI HO ,  YUNG-CHIEH CHEN

IPC分类号： G06F17/50

CPC分类号： G06F17/5081

摘要： A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard.

摘要翻译： 用于检查印刷电路板（PCB）的布局的系统和方法提供图形用户界面（GUI）。 GUI显示PCB的布局。 发现脉冲宽度调制（PWM）控制器的高端引脚和连接到高端引脚的元件。 如果组件是金属氧化物半导体场效应晶体管（MOSFET），则该系统计算绝缘线性距离和MOSFET的源极引脚与连接到源极引脚的耦合电容的电容引脚之间的走线距离。 如果线性距离，迹线距离和耦合电容的电容符合布局标准，则PCB的布局被确定为达到标准。

公开(公告)号：US20100277198A1

公开(公告)日：2010-11-04

申请号：US12605434

申请日：2009-10-26

申请人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU

发明人： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU

IPC分类号： G01R1/06 ,  G01R27/28

CPC分类号： G01R27/04 ,  G01R31/2843

摘要： A method for testing a characteristic impedance of an electronic component includes sending a positioning command to a control computer through a switch, so as to drive a probe holder of a mechanical arm to position probes of a time domain reflectometer (TDR) on a position of the electronic component. The method further receives measured data collected by the TDR, and compares the measured data with preset standard values to determine if the measured data is acceptable.

摘要翻译： 一种用于测试电子部件的特征阻抗的方法包括：通过开关向控制计算机发送定位命令，以便驱动机械臂的探针支架，将时域反射计（TDR）的探针定位在 电子元件。 该方法还接收由TDR收集的测量数据，并将测量数据与预设的标准值进行比较，以确定测量数据是否可接受。