摘要:
An information processing apparatus includes a specification unit configured to specify a layer of a record level from print data of a hierarchical structure having metadata, a display control unit configured to display the metadata contained in the layer specified by the specification unit, a receiving unit configured to receive selection of specific metadata for filter printing from the metadata displayed by the display control unit, and a determination unit configured to determine a record in which the specific metadata received by the receiving unit is set to be a print target.
摘要:
An information processing apparatus includes a specification unit configured to specify a layer of a record level from print data of a hierarchical structure having metadata, a display control unit configured to display the metadata contained in the layer specified by the specification unit, a receiving unit configured to receive selection of specific metadata for filter printing from the metadata displayed by the display control unit, and a determination unit configured to determine a record in which the specific metadata received by the receiving unit is set to be a print target.
摘要:
In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
摘要:
A connection method is disclosed for a high-performance semiconductor system. The connection method enables high-speed operation with low noise, so as to obtain reliable and excellent connection in a short TAT at low costs. Semiconductor chips and the interposer chips are polished by grinding at their rear surfaces, holes are formed at rear surface positions corresponding to external electrode parts on the device side (front surface side) so that the holes extend to front surface electrodes, and metal plating films are applied to the side walls of the holes and rear surface side. Metal bumps of another semiconductor chip laminated at an upper stage being press-fitted into the holes applied with the metal plating films through deformation and being geometrically calked in the through holes formed in the semiconductor chip so as to electrically connected thereto.
摘要:
An electromagnetic induction heating apparatus capable of uniformize a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts the effective magnetic flux so that the effective magnetic flux at a central portion of the fixation roller in the longitudinal direction of the heating portion is less than that at an end portion of the induction heating member in the longitudinal direction.
摘要:
An electromagnetic induction heating apparatus capable of uniformize a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts the effective magnetic flux so that the effective magnetic flux at a central portion of the fixation roller in the longitudinal direction of the heating portion is less than that at an end portion of the induction heating member in the longitudinal direction.
摘要:
A chemical analyzing apparatus comprises a reaction cell holder which holds a plurality of reaction cells that are supplied with samples and reagents at a predetermined position, a measurer for measuring characteristics of the sample, a plurality of reagent containers, a liquid deliverer provided below each of the plurality of reagent containers, one or more sound wave generators provided outside the reaction cells, and storage containers for storing cleansing liquid with different contamination states. The cleansing liquid with different contamination states is reused according to the contamination levels of the reaction cells.
摘要:
In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
摘要:
A vehicle bumper beam including: a resin beam having an elongate body extending along a vehicle-width direction, two tubular shock-absorbing portions disposed at the beam body's opposite longitudinal end portions extending in front-rear direction, the beam body and shock-absorbing portions being formed with each other; a metal beam disposed outside the resin beam in the front-rear direction, fixedly fitted to the resin beam. Further, flat attachment portions, formed with inner end portions of the shock-absorbing portions in front-rear direction; bent portions bent in a crank extending from attachment portions outward in front-rear direction, the beam body being to attachment portions via bent portions, the metal beam fixedly fitted to an outer surface of the beam body's intermediate portion; metal beam's opposite end portions extending beyond bent portions covering the right and left sides, fixedly fitted to distal end portions; each space defined by shock-absorbing portion, metal beam and bent portion.
摘要:
In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.