Pressure container
    1.
    发明授权
    Pressure container 失效
    压力容器

    公开(公告)号:US5894084A

    公开(公告)日:1999-04-13

    申请号:US949847

    申请日:1997-10-14

    CPC分类号: G01N3/10

    摘要: A pressure container that easily fixes a sample or installs various measurement sensors onto a material tester before initiating various tests under an ambient pressure using the material tester, the container including a cover member that is mounted on the bottom surface of an upper loading frame plate with the loading cylinder of the material tester penetrating the center thereof, a bottom member that is mounted on the top surface of a lower loading frame plate with the platen of the material tester penetrating the center thereof, and a cylindrical side wall member having the same outer diameter as the cover member and the same inner diameter as the bottom member. The side wall member is disposed so as to slide vertically around the bottom member and can be detachably fixed to the cover member in its uppermost position in which the side wall member touches the cover member. This type of pressure container enables various preparatory work to be conducted without removing the loading frame plates from the material tester after a sample inside the pressure container has been adhered directly to the loading cylinder of the material tester.

    摘要翻译: 一种压力容器,其容易地固定样品或将各种测量传感器安装到材料测试仪上,然后使用材料测试仪在环境压力下进行各种测试之前,该容器包括安装在上装载框架板的底表面上的盖构件, 材料试验器的装载筒穿过其中心,底部构件安装在下装载框架板的顶表面上,其中材料试验台的压板穿过其中心,并且具有相同外部的圆柱形侧壁构件 直径作为盖构件,并且与底部构件具有相同的内径。 侧壁构件被布置成围绕底部构件垂直滑动,并且可以在其侧壁构件与盖构件接触的最上部位置中可拆卸地固定到盖构件。 这种压力容器能够在压力容器内的样品直接粘附到材料测试仪的装载圆筒上之后进行各种准备工作,而不从材料测试仪上卸下装载框架板。

    Waterproof structure
    3.
    发明授权
    Waterproof structure 有权
    防水结构

    公开(公告)号:US07941196B2

    公开(公告)日:2011-05-10

    申请号:US11900228

    申请日:2007-09-10

    IPC分类号: H04M1/00

    摘要: A waterproof structure for a casing has a first casing, a second casing to be put together with the first casing, and a waterproof member formed of an elastic material to prevent water from penetrating between the first casing and the second casing. The second casing has a recess. The waterproof member has a peripheral part which, when fitted into the recess, prevents penetration of water. The peripheral part is provided at the periphery of the waterproof member, which is laid out all around space between the first casing and the second casing. A projection engages with a dent. A restriction part of the first casing, provided at a position facing the peripheral part and protruding toward the second casing, prevents the peripheral part from coming out.

    摘要翻译: 用于壳体的防水结构具有第一壳体,与第一壳体放在一起的第二壳体和由弹性材料形成的防水构件,以防止水在第一壳体和第二壳体之间穿透。 第二壳体具有凹部。 防水构件具有周边部,该周边部在嵌入凹部时防止水的渗透。 外围部分设置在防水构件的周围,其布置在第一壳体和第二壳体之间的整个空间周围。 一个突起与一个凹痕啮合。 第一壳体的限制部分设置在面向周边部分并朝向第二壳体突出的位置,防止周边部件脱出。

    Semiconductor laser apparatus and fabrication method thereof
    4.
    发明授权
    Semiconductor laser apparatus and fabrication method thereof 有权
    半导体激光装置及其制造方法

    公开(公告)号:US07773654B2

    公开(公告)日:2010-08-10

    申请号:US11092947

    申请日:2005-03-30

    IPC分类号: H01S5/00

    摘要: A blue-violet semiconductor laser device has a first p-electrode formed on its upper surface and a first n-electrode formed on its lower surface. A red semiconductor laser device has a second n-electrode formed on its upper surface and a second p-electrode formed on its lower surface. An infrared semiconductor laser device has a third n-electrode formed on its upper surface and a third p-electrode formed on its lower surface. Solder films are partially formed on the upper surface of the first p-electrode in the blue-violet semiconductor laser device. Two of the solder films are formed with a predetermined distance between them on the upper surface of the first p-electrode. This results in a portion of the first p-electrode being exposed. The first, second and third p-electrodes of the blue-violet semiconductor laser device, red semiconductor laser device, and infrared semiconductor laser device are common electrodes.

    摘要翻译: 蓝紫色半导体激光器件具有在其上表面上形成的第一p电极和形成在其下表面上的第一n电极。 红色半导体激光器件具有在其上表面上形成的第二n电极和形成在其下表面上的第二p电极。 红外半导体激光器件具有在其上表面上形成的第三n电极和形成在其下表面上的第三p电极。 在蓝紫色半导体激光器件中的第一p电极的上表面部分地形成焊料膜。 两个焊料膜在第一p电极的上表面之间以它们之间的预定距离形成。 这导致第一p电极的一部分被暴露。 蓝紫色半导体激光器件的第一,第二和第三p电极,红色半导体激光器件和红外半导体激光器件是公共电极。

    METHOD OF MANUFACTURING SEMICONDUCTOR LASER
    5.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR LASER 审中-公开
    制造半导体激光的方法

    公开(公告)号:US20100003778A1

    公开(公告)日:2010-01-07

    申请号:US12274435

    申请日:2008-11-20

    IPC分类号: H01L33/00

    摘要: A method of manufacturing a semiconductor laser includes sequentially forming a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on top of one another on a semiconductor substrate; forming a ridge in the second conductivity type semiconductor layer; forming a first insulating film on the second conductivity type semiconductor layer at a first temperature; forming a second insulating film on the first insulating film at a second temperature, lower than the first temperature; and forming an electrode on the second insulating film.

    摘要翻译: 半导体激光器的制造方法包括在半导体基板上依次形成第一导电型半导体层,有源层和第二导电型半导体层, 在第二导电类型半导体层中形成脊; 在第一温度下在第二导电类型半导体层上形成第一绝缘膜; 在低于第一温度的第二温度下在第一绝缘膜上形成第二绝缘膜; 以及在所述第二绝缘膜上形成电极。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20090022197A1

    公开(公告)日:2009-01-22

    申请号:US12104756

    申请日:2008-04-17

    IPC分类号: H01L33/00 H01S5/00

    摘要: Semiconductor laser elements are formed on a common substrate. Au plating is formed on principal surfaces of the other semiconductor laser elements. The semiconductor laser elements are mounted on a package with solder applied to the Au plating. Areas opposed to each other across a light-emitting area of each semiconductor laser element are designated first and second areas. Average thickness of the Au plating is different in the first and second areas of each semiconductor laser element.

    摘要翻译: 半导体激光元件形成在公共基板上。 在其他半导体激光元件的主表面上形成Au电镀。 半导体激光器元件安装在具有焊料应用于Au镀层的封装上。 在每个半导体激光元件的发光区域彼此相对的区域被指定为第一和第二区域。 在每个半导体激光元件的第一和第二区域中,Au镀层的平均厚度不同。

    Keyboard device for keyboard instrument
    9.
    发明申请
    Keyboard device for keyboard instrument 失效
    键盘乐器键盘设备

    公开(公告)号:US20060021490A1

    公开(公告)日:2006-02-02

    申请号:US11185857

    申请日:2005-07-21

    申请人: Tsutomu Yamaguchi

    发明人: Tsutomu Yamaguchi

    IPC分类号: G10C3/18

    CPC分类号: G10C3/12

    摘要: A high-quality keyboard device for a keyboard instrument, which can be manufactured by a simplified manufacturing process and at reduced manufacturing costs. A keyframe is formed by a molded piece of a synthetic resin. A plurality of front rail pins and a plurality of balance rail pins are arranged in a juxtaposed manner in a left-right direction at a front part and a central part of the keyframe in a front-rear direction. A plurality of keys are made of wood and each have a balance rail pin hole formed in a central portion thereof in the front-rear direction. A first reinforcing member and a second reinforcing member are made of metal and provided in the vicinity of the balance rail pins and the front rail pins for reinforcement of rigidity of the keyframe. The keys are swingably supported on the keyframe in a state where the balance rail pins are each engaged with the balance rail pin hole associated therewith and at the same time the keys are prevented from being swung in the left-right direction by the front rail pins associated therewith.

    摘要翻译: 用于键盘乐器的高品质键盘装置,其可以通过简化的制造过程和降低的制造成本来制造。 关键帧由合成树脂的模制件形成。 多个前轨销和多个平衡轨销在前后方向上以关键框的前部和中心部分沿左右方向并列布置。 多个键由木材制成,并且每个键具有在前后方向上形成在其中心部分的平衡导轨销孔。 第一加强构件和第二加强构件由金属制成并且设置在平衡轨销和前导轨销附近,用于加强关键框架的刚性。 在平衡轨销彼此相配合的平衡轨针销孔的状态下,键被可摆动地支撑在关键帧上,同时通过前导轨销防止键在左右方向上摆动 相关联。