METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE 审中-公开
    制造发光装置的方法

    公开(公告)号:US20120015463A1

    公开(公告)日:2012-01-19

    申请号:US13182814

    申请日:2011-07-14

    IPC分类号: H01L33/08

    摘要: The present invention relates to a method for manufacturing a light-emitting device, the method including applying resin encapsulation to a lead frame having mounted and packaged thereon a plurality of light-emitting elements, in which the following lead frame portion (A) is used as the lead frame portion: (A) a lead frame portion that is obtained by cutting and separating a lead frame, in which the lead frame has a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby and has a plurality of light-emitting elements disposed and packaged between the adjacent intersection points in each row, into individual column to produce a lead frame portion for each column, and that is passed a light emission test performed by flowing a current to the lead frame portion.

    摘要翻译: 本发明涉及一种发光装置的制造方法,该方法包括将树脂封装在其上安装并封装有多个发光元件的引线框架上,其中使用以下引线框架部分(A) 作为引线框架部分:(A)通过切割和分离引线框架而获得的引线框架部分,其中引线框架具有包括多行的格子形式和多个形成有多个交点的列 从而将多个发光元件设置并封装在各行的相邻交点之间,成为各列,以产生每列的引线框部分,并通过将电流流向 引线框架部分。

    INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE
    3.
    发明申请
    INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE 审中-公开
    发光装置的检查方法和检测发光装置后的处理方法

    公开(公告)号:US20120028375A1

    公开(公告)日:2012-02-02

    申请号:US13190738

    申请日:2011-07-26

    IPC分类号: H01L21/66 G01R31/00

    摘要: The present invention relates to a method for inspecting a light-emitting device, the method including performing a light emission test of (A) a light-emitting device including a lead frame having mounted and packaged thereon a plurality of light-emitting elements or (B) a light-emitting device obtained by resin encapsulating and packaging the light-emitting device (A), by applying a current to the plurality of light-emitting elements and judging each light-emitting element as passed or failed, in which arrangement of the plurality of light-emitting elements in the light-emitting device is set as in the following (α): (α) In a lead frame having a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby, a plurality of light-emitting elements are disposed between the adjacent intersection points in each row, the adjacent light-emitting elements in each row are connected to each other so that positive electrode terminals or negative electrode terminals thereof face each other, and a positive-side power supply channel or a negative-side power-supply channel in the lead frame works as a common channel between a certain column and a column adjacent thereto.

    摘要翻译: 本发明涉及一种用于检查发光器件的方法,该方法包括:(A)包括引线框的发光器件的发光测试,其中安装并封装有多个发光元件或( B)通过对所述发光元件(A)封装并封装所述发光元件而得到的发光元件,通过向所述多个发光元件施加电流,判定通过或失败的各发光元件, 发光装置中的多个发光元件如以下(α)所示设定:(α)在具有多列的格子状的引线框和具有多个交点的多个列 由此,在各列的相邻交点之间配置多个发光元件,将各行的各相邻的发光元件彼此连接,使正极端子 ls或其负极端子彼此面对,并且引线框架中的正侧电源通道或负侧电源通道作为与其相邻的特定列和列之间的公共通道。

    LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF
    4.
    发明申请
    LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF 有权
    发光二极管器件及其制造方法

    公开(公告)号:US20120248484A1

    公开(公告)日:2012-10-04

    申请号:US13429681

    申请日:2012-03-26

    IPC分类号: H01L33/50

    摘要: A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.

    摘要翻译: 一种发光二极管装置的制造方法,其特征在于,具备准备基板的工序, 允许在与厚度方向一侧设置电极部分的光半导体层相对于基板设置,并且电极部分与端子电连接,使得光半导体层被翻转, 芯片安装在基板上; 在所述基板的另一侧形成包含光反射部件的封装树脂层,以覆盖所述光半导体层和所述电极部分; 去除封装树脂层的另一侧部分以暴露光半导体层; 以及形成为片状状的荧光体层,以便与所述光半导体层的另一个表面接触。

    OPERATION UNIT
    9.
    发明申请
    OPERATION UNIT 审中-公开
    操作单元

    公开(公告)号:US20110242064A1

    公开(公告)日:2011-10-06

    申请号:US13072032

    申请日:2011-03-25

    IPC分类号: G09G5/00

    摘要: The operation unit includes a shaft that receives by its one end a pressing force applied through a pressing operation by a finger/thumb, a rotating body that rotates about the shaft according to an operation by the finger/thumb within a movable range of the finger/thumb, a first sensor that detects a pressing force applied to the shaft in an axial direction of the shaft, a second sensor that detects a pressing force applied to the shaft in a direction other than the axial direction of the shaft, and a third sensor that detects a rotating state of the rotating body.

    摘要翻译: 操作单元包括轴,其一端接受由手指/拇指按压操作而施加的按压力;旋转体,其根据手指/拇指在手指的可移动范围内的操作而围绕轴旋转 第一传感器,其检测沿着轴的轴向施加到轴的按压力;第二传感器,其检测沿轴的轴向以外的方向施加到所述轴的按压力;以及第三传感器, 传感器,其检测旋转体的旋转状态。