摘要:
A microscope capable of controlling the position and fluorescent recording of an object under observation such as cells is provided with the fluorescent observation method using the microscope. The microscope 1 comprises: a stage 3 on which the object under observation 2 is placed; an illumination light source 4 for the object under observation 2; an excitation light source 5 for exciting fluorescent light F to the object under observation 2; an image information detecting part 16 for detecting the image information formed with the light T generated at the object under observation 2; a fluorescent image information detecting part 17 for detecting the fluorescent image information formed with fluorescent light F; and a control part 20, which determines the fluorescent observation area of the object under observation 2 based on the dynamic model of the object under observation 2 and its image information entered from the image information detecting part 16, and then obtains the image information of the object under observation 2 entered from the image information detecting part 16 and the fluorescent image information entered from the fluorescent image information detecting part 17 at specified interval within the fluorescent observation area.
摘要:
A microscope capable of controlling the position and fluorescent recording of an object under observation such as cells is provided with the fluorescent observation method using the microscope. The microscope 1 comprises: a stage 3 on which the object under observation 2 is placed; an illumination light source 4 for the object under observation 2; an excitation light source 5 for exciting fluorescent light F to the object under observation 2; an image information detecting part 16 for detecting the image information formed with the light T generated at the object under observation 2; a fluorescent image information detecting part 17 for detecting the fluorescent image information formed with fluorescent light F; and a control part 20, which determines the fluorescent observation area of the object under observation 2 based on the dynamic model of the object under observation 2 and its image information entered from the image information detecting part 16, and then obtains the image information of the object under observation 2 entered from the image information detecting part 16 and the fluorescent image information entered from the fluorescent image information detecting part 17 at specified interval within the fluorescent observation area.
摘要:
The technical task of the present invention is to provide a lead-free glass for semiconductor encapsulation, which is easy to automate an appearance inspection, and furthermore, has excellent refinability and encapsulatability of semiconductor devices. In the lead-free glass for semiconductor encapsulation according to the present invention, a temperature at which the viscosity of glass is 106 dPa·s is 670° C. or lower, and, as a glass composition, the content of CeO2 is from 0.01 to 6% by mass, and the content of Sb2O3 is 0.1% by mass or less.
摘要翻译:本发明的技术任务是提供一种用于半导体封装的无铅玻璃,其容易自动进行外观检查,此外,具有优异的可熔性和半导体器件的可封装性。 在本发明的半导体封装用无铅玻璃中,玻璃粘度为106dPa·s的温度为670℃以下,作为玻璃组合物,CeO 2的含量为0.01 〜6质量%,Sb 2 O 3的含量为0.1质量%以下。
摘要:
A semiconductor element including an MISFET exhibits diode characteristics in a reverse direction through an epitaxial channel layer. The semiconductor element includes: a silicon carbide semiconductor substrate of a first conductivity type, semiconductor layer of the first conductivity type, body region of a second conductivity type, source region of the first conductivity type, epitaxial channel layer in contact with the body region, source electrode, gate insulating film, gate electrode and drain electrode. If the voltage applied to the gate electrode is smaller than a threshold voltage, the semiconductor element functions as a diode wherein current flows from the source electrode to the drain electrode through the epitaxial channel layer. The absolute value of the turn-on voltage of this diode is smaller than the turn-on voltage of a body diode that is formed of the body region and the first silicon carbide semiconductor layer.
摘要:
A data center is disclosed that includes a container; a server; a rack installed within the container and storing the server; and a curtain fixed to at least one point of the rack or the container and separating an internal space of the container between a cold side and a hot side; wherein the rack is configured to enable the circulation of air from the cold side to the hot side. The curtain is fixed by a removable clamping mechanism. The data center further includes a modular refrigeration unit configured to attach to the container and direct cold air into the cold area. At least one prop is positioned below a bottom of the housing and connected to a container bottom, the prop is configured to absorb vibration of the container or housing.
摘要:
A semiconductor element 100 including an MISFET according to the present invention is characterized by having diode characteristics in a reverse direction through an epitaxial channel layer 50. The semiconductor element 100 includes a semiconductor layer 20 of a first conductivity type, a body region 30 of a second conductivity type, source and drain regions 40 and 75 of the first conductivity type, an epitaxial channel layer 50 in contact with the body region, source and drain electrodes 45 and 70, a gate insulating film 60, and a gate electrode 65. If the voltage applied to the gate electrode of the MISFET is smaller than a threshold voltage, the semiconductor element 100 functions as a diode in which current flows from the source electrode 45 to the drain electrode 70 through the epitaxial channel layer 50. The absolute value of the turn-on voltage of this diode is smaller than that of the turn-on voltage of a body diode that is formed of the body region and the first silicon carbide semiconductor layer.
摘要:
A semiconductor element 100 including an MISFET according to the present invention is characterized by having diode characteristics in a reverse direction through an epitaxial channel layer 50. The semiconductor element 100 includes a silicon carbide semiconductor substrate 10 of a first conductivity type, a semiconductor layer 20 of the first conductivity type, a body region 30 of a second conductivity type, a source region 40 of the first conductivity type, an epitaxial channel layer 50 in contact with the body region, a source electrode 45, a gate insulating film 60, a gate electrode 65 and a drain electrode 70. If the voltage applied to the gate electrode of the MISFET is smaller than a threshold voltage, the semiconductor element 100 functions as a diode in which current flows from the source electrode 45 to the drain electrode 70 through the epitaxial channel layer 50. The absolute value of the turn-on voltage of this diode is smaller than that of the turn-on voltage of a body diode that is formed of the body region and the first silicon carbide semiconductor layer.
摘要:
A semiconductor encapsulation material of the present invention contains a glass for metal coating which has a strain point of 480° C. or higher, a temperature corresponding to a viscosity of 104 dPa·s of 1,100° C. or lower, and a thermal expansion coefficient at 30 to 380° C. of 70×10−7 to 110×10−7/° C. The semiconductor encapsulation material of the present invention contains no environmentally harmful substances, has a heat resistance temperature as high as 500° C. or above, and can be used for the encapsulation of metals susceptible to oxidation, e.g., Dumet.
摘要:
A hammer drill includes a motor; a spindle rotatingly driven by the motor and holding an output bit; a motion conversion member for converting rotational movement of the motor to reciprocating movement; a striker reciprocatingly driven by the motion conversion member for applying an axial striking force to the output bit; a striking-motion-releasing mechanism for releasing the striking force applying action exercised by the striker; and a tightening-torque adjusting clutch for interrupting the transfer of the rotational force to the output bit by increasing a load torque.
摘要:
A semiconductor device includes: a semiconductor layer 10; a semiconductor region 15s of a first conductivity type defined on the surface 10s of the semiconductor layer; a semiconductor region 14s of a second conductivity type defined on the surface 10s of the semiconductor layer to surround the semiconductor region 15s; and a conductor 19 with a conductive surface 19s to contact with the semiconductor regions 15s and 14s. The semiconductor layer 10 includes silicon carbide. At least one of the semiconductor region 15s and the conductive surface 19s is not circular. The semiconductor region 15s and the conductive surface 19s are shaped such that as the degree of misalignment between the conductive surface 19s and the semiconductor region 15s increases from zero through one-third of the width of the conductive surface 19s, a portion of the profile of the conductive surface 19s that crosses the semiconductor region 15s has smoothly changing lengths.