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    LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
    1.
    发明申请
    LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH 审中-公开
    引导框架和制造的半导体封装

    公开(公告)号：US20110204498A1

    公开(公告)日：2011-08-25

    申请号：US12712159

    申请日：2010-02-24

    申请人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

    发明人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length. The second set lead parallel length of each second set lead has a constant width and edges that are parallel to edges of all other second set lead parallel lengths in the second set of leads and also parallel to the edges of first set lead parallel lengths. At least one second set lead has an extension length extending inwardly from the second set lead tapered length, the extension length has a constant width and provides a second set lead bond target region. Wire bond leads electrically couple both the first set lead bond target region and second set lead bond target region to respective die external electrical connection pads on a surface of the die and a package body encloses the die.

    摘要翻译： 半导体封装的引线框架具有安装有半导体管芯的标志。 领带条与标志相连。 存在第一组引线，并且第一组引线中的每个第一组引线具有第一组引线平行长度和第一组引线锥形长度。 每个第一组引线的第一组引线平行长度具有恒定的宽度，并且与所有其它第一组引线平行长度的边缘平行的边缘。 每个第一集合引线的第一组引线锥形长度的自由端区域提供第一组引线键合目标区域。 存在设置在第一组连杆和第一组引线之间的第二组引线。 在第二组引线中的每个第二设定引线具有第二设定引线平行长度和第二设定引线锥形长度。 每个第二组引线的第二组引线平行长度具有恒定的宽度，并且边缘平行于第二组引线中的所有其它第二设定引线平行长度的边缘，并且平行于第一组引线平行长度的边缘。 至少一个第二固定引线具有从第二组引线锥形长度向内延伸的延伸长度，延伸长度具有恒定的宽度并且提供第二组引线键合目标区域。 引线接合引线将第一组引线接合目标区域和第二组引线接合目标区域电耦合到管芯表面上的相应管芯外部电连接焊盘，并且封装主体封装管芯。

    SYSTEM AND METHOD FOR CLEANING BOND WIRE
    3.
    发明申请
    SYSTEM AND METHOD FOR CLEANING BOND WIRE 审中-公开
    用于清洁粘线的系统和方法

    公开(公告)号：US20140110461A1

    公开(公告)日：2014-04-24

    申请号：US13716193

    申请日：2012-12-16

    申请人： Mohd Rusli Ibrahim ,  Yin Kheng Au ,  Poh Leng Eu

    发明人： Mohd Rusli Ibrahim ,  Yin Kheng Au ,  Poh Leng Eu

    IPC分类号： H01L23/00 ,  B23K37/00

    CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/24 ,  B23K37/00 ,  B23K2101/42 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/7801 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2224/45157 ,  H01L2924/00015

    摘要： A system for cleaning bond wire for use by a wire bonding machine includes a bond wire supply station, a bond wire cleaning bath station, a bond wire neutralizing station, a bond wire drying station, and a wire bonding machine. In operation, the bonding machine is supplied with bond wire stored at the supply station, which is firstly de-oxidized with a cleaning solution in the cleaning bath station. Next, the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station. The bond wire is then dried in the drying station. The speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine.

    摘要翻译： 一种用于清洁用于引线接合机使用的接合线的系统包括接合线供应站，接合线清洁浴站，接合线中和站，接合线干燥站和引线接合机。 在操作中，粘合机被供给存储在供应站的接合线，首先在清洗浴台用清洁溶液去氧化。 接着，在中和站中用中和液中和接合线上的清洗液中和。 然后将粘合线在干燥站中干燥。 通过清洗浴站，中和站和干燥站的接合线的速度由引线接合机控制。

    Heat spreader for integrated circuit device
    4.
    发明授权
    Heat spreader for integrated circuit device 有权
    散热器用于集成电路设备

    公开(公告)号：US09064838B2

    公开(公告)日：2015-06-23

    申请号：US14029779

    申请日：2013-09-17

    申请人： Ruzaini B. Ibrahim ,  Mohd Rusli Ibrahim ,  Nor Azam Man

    发明人： Ruzaini B. Ibrahim ,  Mohd Rusli Ibrahim ,  Nor Azam Man

    IPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/433 ,  H01L23/498

    CPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

    摘要翻译： BGA型封装集成电路（IC）裸片具有暴露的冠状散热器。 附着在基材上的模具封装在模塑料的中心部分中。 中央部分由护城河横向包围并由模制化合物的环段分隔成一个槽。 将冠状散热器插入槽中以覆盖中心段。 冠状散热器通过热胶连接到基底和中心部分。 在操作中，由模具产生的至少一些热量通过冠状散热器消散。

    HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE
    6.
    发明申请
    HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE 有权
    集成电路装置的散热器

    公开(公告)号：US20150076680A1

    公开(公告)日：2015-03-19

    申请号：US14029779

    申请日：2013-09-17

    申请人： Ruzaini B. Ibrahim ,  Mohd Rusli Ibrahim ,  Nor Azam Man

    发明人： Ruzaini B. Ibrahim ,  Mohd Rusli Ibrahim ,  Nor Azam Man

    IPC分类号： H01L23/34 ,  H01L21/56

    CPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

    摘要翻译： BGA型封装集成电路（IC）裸片具有暴露的冠状散热器。 附着在基材上的模具封装在模塑料的中心部分中。 中央部分由护城河横向包围，并由成型复合体的环形部分分隔成形成槽。 将冠状散热器插入槽中以覆盖中心段。 冠状散热器通过热胶连接到基底和中心部分。 在操作中，由模具产生的至少一些热量通过冠状散热器消散。