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    METHODS RELATING TO THE RECONSTRUCTION OF SEMICONDUCTOR WAFERS FOR WAFER LEVEL PROCESSING
    1.
    发明申请
    METHODS RELATING TO THE RECONSTRUCTION OF SEMICONDUCTOR WAFERS FOR WAFER LEVEL PROCESSING 有权
    关于重建用于水平加工的半导体波形的方法

    公开(公告)号：US20080311685A1

    公开(公告)日：2008-12-18

    申请号：US12200027

    申请日：2008-08-28

    申请人： Yong Kian Tan ,  Wuu Yean Tay

    发明人： Yong Kian Tan ,  Wuu Yean Tay

    IPC分类号： H01L21/70

    CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68309 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed in contact with liquid, gel or other flowable alignment droplets in a similar pattern protruding from a substrate to position the dice through surface tension interaction. The alignment droplets are then solidified to maintain the positioning and an underfill is disposed between the dice and the fixture to strengthen and maintain the reconstructed wafer. A fixture plate may be used in combination with the underfill to add additional strength and simplify handling. The reconstructed wafer may be subjected to wafer-level processing, wafer-level testing and burn-in being particularly facilitated using the reconstructed wafer. Alignment droplets composed of sacrificial material may be removed from the reconstructed wafer and the resulting void filled to form interconnects or contacts on the resulting dice.

    摘要翻译： 公开了关于用于晶片级处理的半导体晶片的重建的方法。 将其在其表面中形成的对准空腔的选定的半导体晶片放置成以与基板突出的相似图案中的液体，凝胶或其它可流动的对准液接触，以通过表面张力相互作用来定位骰子。 然后将对准液滴固化以保持定位，并且在骰子和固定装置之间设置底部填充物以加强和维持重建的晶片。 固定板可以与底部填充物组合使用，以增加额外的强度并简化处理。 重构的晶片可以经受晶片级处理，晶片级测试和老化使用重建的晶片特别方便。 由牺牲材料组成的对准液可以从重建的晶片中去除，并且所产生的空隙填充以形成所得骰子上的互连或接触。

    Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
    2.
    发明授权
    Reconstructed semiconductor wafers including alignment droplets contacting alignment vias 有权
    重构的半导体晶片包括对齐液滴接触对准通孔

    公开(公告)号：US07190074B2

    公开(公告)日：2007-03-13

    申请号：US11196584

    申请日：2005-08-02

    申请人： Yong Kian Tan ,  Wuu Yean Tay

    发明人： Yong Kian Tan ,  Wuu Yean Tay

    IPC分类号： H01L23/24 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68309 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： Apparatus, systems and methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed in contact with liquid, gel or other flowable alignment droplets in a similar pattern protruding from a substrate to position the dice through surface tension interaction. The alignment droplets are then solidified to maintain the positioning and an underfill is disposed between the dice and the fixture to strengthen and maintain the reconstructed wafer. A fixture plate may be used in combination with the underfill to add additional strength and simplify handling. The reconstructed wafer may be subjected to wafer-level processing, wafer-level testing and burn-in being particularly facilitated using the reconstructed wafer. Alignment droplets composed of sacrificial material may be removed from the reconstructed wafer and the resulting void filled to form interconnects or contacts on the resulting dice.

    摘要翻译： 公开了与用于晶片级处理的半导体晶片的重建相关的装置，系统和方法。 将其在其表面中形成的对准空腔的选定的半导体晶片放置成以与基板突出的相似图案中的液体，凝胶或其它可流动的对准液接触，以通过表面张力相互作用来定位骰子。 然后将对准液滴固化以保持定位，并且在骰子和固定装置之间设置底部填充物以加强和维持重建的晶片。 固定板可以与底部填充物组合使用，以增加额外的强度并简化处理。 重构的晶片可以经受晶片级处理，晶片级测试和老化使用重建的晶片特别方便。 由牺牲材料组成的对准液可以从重建的晶片中去除，并且所产生的空隙填充以形成所得骰子上的互连或接触。

    Methods and apparatus for testing and burn-in of semiconductor devices
    3.
    发明授权
    Methods and apparatus for testing and burn-in of semiconductor devices 失效
    半导体器件测试和老化的方法和装置

    公开(公告)号：US06856155B2

    公开(公告)日：2005-02-15

    申请号：US10266140

    申请日：2002-10-07

    申请人： Wuu Yean Tay ,  Yong Kian Tan ,  Yong Poo Chia ,  Siu Waf Low ,  Suan Jeung Boon ,  Soon Huat Goh

    发明人： Wuu Yean Tay ,  Yong Kian Tan ,  Yong Poo Chia ,  Siu Waf Low ,  Suan Jeung Boon ,  Soon Huat Goh

    IPC分类号： G01R31/28 ,  G01R31/02

    CPC分类号： G01R31/2863

    摘要： A testing scheme for ball-grid array devices of different sizes where the same ball-grid pattern may be tested using the same set of test adapters. A testing scheme includes providing a plurality of devices having a predetermined pattern of solder balls attached, providing a plurality of adapters secured to a test board, each of the adapters including a plurality of test contacts arranged in a pattern corresponding to the predetermined pattern of solder balls, removably attaching the plurality of devices to a device holding apparatus such that the predetermined pattern of solder balls on the devices corresponds to the predetermined pattern of test contacts on the plurality of adapters, then positioning the device holding apparatus to bring the plurality of solder balls in contact with the plurality of test contacts.

    摘要翻译： 不同尺寸的球栅阵列器件的测试方案，可以使用相同的一组测试适配器测试相同的球栅图案。 一种测试方案包括提供多个具有附着的焊球预定图案的装置，提供固定在测试板上的多个适配器，每个适配器包括以对应于预定图案焊料的图案布置的多个测试触点 球，可移除地将多个装置附接到装置保持装置，使得装置上的预定图案的焊球对应于多个适配器上的预定图案的试验接触，然后定位装置保持装置以使多个焊料 与多个测试触点接触的球。

    Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
    5.
    发明授权
    Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing 有权
    涉及用于晶片级处理的半导体晶片重构的装置

    公开(公告)号：US07573006B2

    公开(公告)日：2009-08-11

    申请号：US11196757

    申请日：2005-08-02

    申请人： Yong Kian Tan ,  Wuu Yean Tay

    发明人： Yong Kian Tan ,  Wuu Yean Tay

    IPC分类号： B23K10/00

    CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68309 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： Apparatus, systems and methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed in contact with liquid, gel or other flowable alignment droplets in a similar pattern protruding from a substrate to position the dice through surface tension interaction. The alignment droplets are then solidified to maintain the positioning and an underfill is disposed between the dice and the fixture to strengthen and maintain the reconstructed wafer. A fixture plate may be used in combination with the underfill to add additional strength and simplify handling. The reconstructed wafer may be subjected to wafer-level processing, wafer-level testing and burn-in being particularly facilitated using the reconstructed wafer. Alignment droplets composed of sacrificial material may be removed from the reconstructed wafer and the resulting void filled to form interconnects or contacts on the resulting dice.

    摘要翻译： 公开了与用于晶片级处理的半导体晶片的重建有关的装置，系统和方法。 将其在其表面中形成的对准空腔的选定的半导体晶片放置成以与基板突出的相似图案中的液体，凝胶或其它可流动的对准液接触，以通过表面张力相互作用来定位骰子。 然后将对准液滴固化以保持定位，并且在骰子和固定装置之间设置底部填充物以加强和维持重建的晶片。 固定板可以与底部填充物组合使用，以增加额外的强度并简化处理。 重构的晶片可以经受晶片级处理，晶片级测试和老化使用重建的晶片特别方便。 由牺牲材料组成的对准液可以从重建的晶片中去除，并且所产生的空隙填充以形成所得骰子上的互连或接触。

    Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
    6.
    发明授权
    Methods relating to the reconstruction of semiconductor wafers for wafer-level processing 有权
    涉及用于晶片级处理的半导体晶片重建的方法

    公开(公告)号：US07425462B2

    公开(公告)日：2008-09-16

    申请号：US11449472

    申请日：2006-06-07

    申请人： Yong Kian Tan ,  Wuu Yean Tay

    发明人： Yong Kian Tan ,  Wuu Yean Tay

    IPC分类号： H01L21/44

    CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68309 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed in contact with liquid, gel or other flowable alignment droplets in a similar pattern protruding from a substrate to position the dice through surface tension interaction. The alignment droplets are then solidified to maintain the positioning and an underfill is disposed between the dice and the fixture to strengthen and maintain the reconstructed wafer. A fixture plate may be used in combination with the underfill to add additional strength and simplify handling. The reconstructed wafer may be subjected to wafer-level processing, wafer-level testing and burn-in being particularly facilitated using the reconstructed wafer. Alignment droplets composed of sacrificial material may be removed from the reconstructed wafer and the resulting void filled to form interconnects or contacts on the resulting dice.

    摘要翻译： 公开了关于用于晶片级处理的半导体晶片的重建的方法。 将其在其表面中形成的对准空腔的选定的半导体晶片放置成以与基板突出的相似图案中的液体，凝胶或其它可流动的对准液接触，以通过表面张力相互作用来定位骰子。 然后将对准液滴固化以保持定位，并且在骰子和固定装置之间设置底部填充物以加强和维持重建的晶片。 固定板可以与底部填充物组合使用，以增加额外的强度并简化处理。 重构的晶片可以经受晶片级处理，晶片级测试和老化使用重建的晶片特别方便。 由牺牲材料组成的对准液可以从重建的晶片中去除，并且所产生的空隙填充以形成所得骰子上的互连或接触。