公开(公告)号：US20090249312A1

公开(公告)日：2009-10-01

申请号：US11721682

申请日：2006-06-09

申请人： Yongkun Liao ,  Junhua Luo ,  Wei He

发明人： Yongkun Liao ,  Junhua Luo ,  Wei He

IPC分类号： G06F9/45 ,  H04L29/02

CPC分类号： G06F8/41 ,  H04M7/0012

摘要： An approach for process generation for computer telephony integration (CTI) of an integrated telecom platform, including the following steps. Step 1: The process input module receives the flow chart input by a user and saves it as a flow chart record file; Step 2: the process coversion module coverts the flow chart record file into the equivalent source codes and saves them as a flow chart coversion output file; Step 3: the process compilation module compiles the flow chart coversion output file and saves it as a flow chart compilation output file. The invention also announces a process generation system for an integrated telecom platform, including the process input module, the process coversion module and the process compilation module. The invention is an ideal system for various CTI applications, allowing easy and fast subsequent development as well as convenient system upgrade and maintenance.

摘要翻译： 一种集成电信平台的计算机电话集成（CTI）过程生成方法，包括以下步骤。 步骤1：进程输入模块接收用户输入的流程图，并将其保存为流程图记录文件; 步骤2：流程转换模块将流程图记录文件覆盖到等效的源代码中，并将它们保存为流程图转换输出文件; 步骤3：进程编译模块编译流程图转换输出文件，并将其保存为流程图编译输出文件。 本发明还公布了一种用于集成电信平台的过程生成系统，包括过程输入模块，过程转换模块和过程编译模块。 本发明是各种CTI应用的理想系统，可以方便快捷的后续开发，方便系统升级和维护。

公开(公告)号：US20140127862A1

公开(公告)日：2014-05-08

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US20140357023A1

公开(公告)日：2014-12-04

申请号：US14459331

申请日：2014-08-14

申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

IPC分类号： H01L23/495 ,  H01L21/78

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

公开(公告)号：US20130037966A1

公开(公告)日：2013-02-14

申请号：US13495011

申请日：2012-06-13

申请人： Shunan QIU ,  Guoliang Gong ,  Junhua Luo ,  Xuesong Xu

发明人： Shunan QIU ,  Guoliang Gong ,  Junhua Luo ,  Xuesong Xu

IPC分类号： H01L23/48 ,  H01L21/78

CPC分类号： H01L29/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/03009 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10155 ,  H01L2924/10156 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor die having first and second opposing faces and an edge surface. The edge surface has an undercut under the first face. The second face of the semiconductor die is bonded to a bonding surface of a die support member, such as a thermally conductive flag of a lead frame, with a die attach material. A fillet of the bonding material is formed within the undercut.

摘要翻译： 半导体器件包括具有第一和第二相对面和边缘表面的半导体管芯。 边缘表面在第一面下方具有底切。 半导体管芯的第二面通过管芯附着材料接合到管芯支撑构件的接合表面，例如引线框架的导热标记。 在底切下形成接合材料的圆角。

公开(公告)号：US09093438B2

公开(公告)日：2015-07-28

申请号：US14459331

申请日：2014-08-14

申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/49 ,  H01L21/56 ,  H01L23/433 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

公开(公告)号：US08836105B2

公开(公告)日：2014-09-16

申请号：US13681437

申请日：2012-11-20

申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/49 ,  H01L23/495 ,  H01L23/433 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

公开(公告)号：US08643170B2

公开(公告)日：2014-02-04

申请号：US13442878

申请日：2012-04-10

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L23/34

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US08859336B2

公开(公告)日：2014-10-14

申请号：US13398816

申请日：2012-02-16

申请人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L23/433 ,  H01L23/31 ,  H01L23/16 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US20140284806A1

公开(公告)日：2014-09-25

申请号：US14183511

申请日：2014-02-18

申请人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/48 ,  H01L25/00

CPC分类号： H01L23/49513 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/8349 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0665

摘要： A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

摘要翻译： 半导体器件具有第一半导体管芯和半导体管芯，所述半导体管芯具有在导电管芯支承件上并排连接到第一和第二接合区域的电接触元件和后表面。 将电绝缘材料层施加到模具支撑件的第一结合区域。 一层电绝缘粘合剂粘合材料通过电绝缘材料层将第一半导体管芯的背面附接到管芯支撑件的第一接合区域。 一层导电粘合剂粘合材料将第二半导体管芯的背面连接到管芯支撑件的第二接合区域。

公开(公告)号：US08722465B1

公开(公告)日：2014-05-13

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.