公开(公告)号：US08859336B2

公开(公告)日：2014-10-14

申请号：US13398816

申请日：2012-02-16

申请人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L23/433 ,  H01L23/31 ,  H01L23/16 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US20140284806A1

公开(公告)日：2014-09-25

申请号：US14183511

申请日：2014-02-18

申请人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/48 ,  H01L25/00

CPC分类号： H01L23/49513 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/8349 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0665

摘要： A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

摘要翻译： 半导体器件具有第一半导体管芯和半导体管芯，所述半导体管芯具有在导电管芯支承件上并排连接到第一和第二接合区域的电接触元件和后表面。 将电绝缘材料层施加到模具支撑件的第一结合区域。 一层电绝缘粘合剂粘合材料通过电绝缘材料层将第一半导体管芯的背面附接到管芯支撑件的第一接合区域。 一层导电粘合剂粘合材料将第二半导体管芯的背面连接到管芯支撑件的第二接合区域。

公开(公告)号：US20160056097A1

公开(公告)日：2016-02-25

申请号：US14556225

申请日：2014-11-30

申请人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/52 ,  H01L21/78 ,  H01L21/56 ,  H01L21/311 ,  H01L21/3205 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L21/78 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

摘要翻译： 四边形扁平无引线（QFN）半导体管芯封装具有安装在引线框架的管芯标记上的半导体管芯。 A覆盖半导体管芯。 房屋有一个基地和两侧。 存在导电安装脚，每个脚在壳体的基部中具有暴露的基部，并且在壳体的一侧中的暴露的侧部。 接合线将半导体管芯的电极与相应的安装脚电连接。

公开(公告)号：US08643170B2

公开(公告)日：2014-02-04

申请号：US13442878

申请日：2012-04-10

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L23/34

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US20140127862A1

公开(公告)日：2014-05-08

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US08722465B1

公开(公告)日：2014-05-13

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

公开(公告)号：US08481369B2

公开(公告)日：2013-07-09

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标志和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。

公开(公告)号：US20120264258A1

公开(公告)日：2012-10-18

申请号：US13442878

申请日：2012-04-10

申请人： Junhua LUO ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua LUO ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/78

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US20110189823A1

公开(公告)日：2011-08-04

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标记和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。

公开(公告)号：US20150294929A1

公开(公告)日：2015-10-15

申请号：US14552491

申请日：2014-11-25

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/4839 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads.

摘要翻译： 半导体管芯封装由具有引线指的引线框架组装，引线框具有邻近管芯标记的结合端，以及远离管芯标记延伸的细长区域。 半导体管芯安装在管芯标记上，半导体管芯的电极通过接合线与接合端电连接。 每个细长区域被弯曲成具有安装脚的外部连接器引线。 每个引线指的细长区域从由模具化合物形成的壳体突出。 模具化合物从壳体延伸，以提供模制到外部连接器引线的绝缘支撑指。