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公开(公告)号：US20110232384A1
公开(公告)日：2011-09-29
申请号：US13047274
申请日：2011-03-14
申请人： Teruhisa AKASHI , Yutaka NONOMURA , Motohiro FUJIYOSHI , Hirofumi FUNABASHI , Yoshiyuki HATA , Yoshiteru OMURA
发明人： Teruhisa AKASHI , Yutaka NONOMURA , Motohiro FUJIYOSHI , Hirofumi FUNABASHI , Yoshiyuki HATA , Yoshiteru OMURA
IPC分类号： G01C19/56
CPC分类号： G01C19/574 , G01P15/125 , G01P15/18 , G01P2015/082
摘要： A structure having a first movable portion that is displaced perpendicular to a substrate surface and a second movable portion that is displaced parallel to the substrate surface is realized by a laminated structure, and manufacturing cost is reduced by employing a nested structure for the first movable portion and the second movable portion. The laminated structure is provided with a frame-like outer movable portion and an inner movable portion housed within the frame of the outer movable portion. A y spring is connected to the outer movable portion, and the outer movable portion is displaceably supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner movable portion, and the inner movable portion is displaceably supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer movable portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer movable portion at a height apart from the outer movable portion.
摘要翻译： 具有垂直于基板表面移位的第一可移动部分和平行于基板表面移位的第二可移动部分的结构通过层压结构实现，并且通过采用用于第一可移动部分的嵌套结构来降低制造成本 和第二可动部。 层叠结构设置有框状的外部可动部和容纳在外部可动部的框架内的内部可动部。 y弹簧连接到外部可移动部分，外部可移动部分通过y弹簧以与外部基板隔开的高度在y轴方向上可移动地支撑。 z弹簧连接到内部可动部分，并且内部可动部分通过z弹簧以与外部基板隔开的高度在z轴方向上可移动地支撑。 外部可移动部分和z弹簧与基底处于不同的高度，并且z弹簧在与外部可移动部分隔开的高度处超过外部可动部分。
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公开(公告)号：US20110215428A1
公开(公告)日：2011-09-08
申请号：US13035186
申请日：2011-02-25
申请人： Hirofumi FUNABASHI , Yutaka NONOMURA , Yoshiyuki HATA , Motohiro FUJIYOSHI , Teruhisa AKASHI , Yoshiteru OMURA
发明人： Hirofumi FUNABASHI , Yutaka NONOMURA , Yoshiyuki HATA , Motohiro FUJIYOSHI , Teruhisa AKASHI , Yoshiteru OMURA
摘要： In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.
摘要翻译： 在MEMS结构中，形成贯穿第一层，第二层和第三层的第一沟槽，形成贯穿第五层，第四层和第三层的第二沟槽。 第一沟槽沿着堆叠的方向形成可动部分的轮廓的第一部分。 第二沟槽沿着堆叠方向在视图中形成可动部分的轮廓的第二部分。 第一沟槽的至少一部分沿着堆叠方向在视图中与第一延伸部分重叠。
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公开(公告)号：US20130049212A1
公开(公告)日：2013-02-28
申请号：US13596859
申请日：2012-08-28
申请人： Yoshiyuki HATA , Yutaka NONOMURA , Teruhisa AKASHI , Hirofumi FUNABASHI , Motohiro FUJIYOSHI , Yoshiteru OMURA
发明人： Yoshiyuki HATA , Yutaka NONOMURA , Teruhisa AKASHI , Hirofumi FUNABASHI , Motohiro FUJIYOSHI , Yoshiteru OMURA
IPC分类号： H01L23/498
CPC分类号： B81C1/00825 , B81B2201/0235 , B81B2203/033 , B81B2203/0392 , G01C19/5762 , G01C19/5769 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/084
摘要： Technology is provided in which, when forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming, a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.
摘要翻译： 提供了在厚半导体层中形成窄宽度的沟槽时可以形成沟槽而不会发生半导体残渣的技术。 在本说明书中，公开了在半导体层中形成沟槽的半导体器件。 在半导体器件的半导体层中，在沟槽宽度急剧变化的地方形成补偿沟槽宽度突然变化的补偿图案。 在上述半导体器件的半导体层中，由于在沟槽宽度突然变化的地方形成补偿图案，所以在使用深RIE法形成沟槽的情况下，由于 可以防止半导体残渣。 因此，当在厚半导体层中形成窄宽度的沟槽时，可以防止发生半导体残渣。
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公开(公告)号：US20100219716A1
公开(公告)日：2010-09-02
申请号：US12710571
申请日：2010-02-23
CPC分类号： B81B3/001 , B81B2201/025 , G01P15/125 , G01P15/18
摘要： The micro device includes a support substrate, and a movable structure configured to move with respect to the support substrate. At least one of the support substrate and the movable structure is provided with at least one protrusion protruding towards the other of the support substrate and the movable structure. Further, a base portion extending into the one of the support substrate and the movable structure is provided integrally with the at least one protrusion. With this configuration, the protrusion is securely held by the base portion, and the detachment of the protrusion can therefore be prevented even after repeated collisions between the support substrate and the movable structure via the protrusion.
摘要翻译： 微型装置包括支撑基板和被配置为相对于支撑基板移动的可移动结构。 支撑基板和可移动结构中的至少一个设置有至少一个朝着支撑基板和可移动结构中的另一个突出的突起。 此外，延伸到支撑基板和可移动结构中的一个的基部与所述至少一个突起一体设置。 通过这种构造，突起被基部牢固地保持，并且因此即使在支撑基板和可移动结构经由突起重复碰撞之后也能够防止突起的分离。
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公开(公告)号：US20100236328A1
公开(公告)日：2010-09-23
申请号：US12723971
申请日：2010-03-15
IPC分类号： G01C19/56
CPC分类号： G01C19/5719 , G01P2015/082
摘要： An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively. The first movable portion is configured to move along the z-axis but not to move along the x-axis and the y-axis nor to rotate around the z-axis, and the second movable portion is configured to move along the x-axis and the z-axis with respect to the support portion.
摘要翻译： 公开了一种具有沿x轴方向和z轴方向移动的第二可移动部分和仅沿着z轴方向移动的第一可动部分的装置。 该装置设置有固定到支撑部分的固定部分，连接到固定部分的多个第一弹簧部分，连接到多个第一弹簧部分的第一可动部分，连接到第一可动部分的第二弹簧部分， 以及与第二弹簧部连接的第二可动部。 多个第一弹簧部分中的每一个在z轴方向上的弹簧常数分别低于多个第一弹簧部分在x轴和y轴方向上的弹簧常数，弹簧常数 x轴方向上的第二弹簧部分分别低于第二弹簧部分在y轴和z轴方向上的弹簧常数。 第一可移动部分被配置为沿着z轴移动但不沿着x轴和y轴移动，也不围绕z轴旋转，并且第二可移动部分构造成沿x轴移动 和z轴相对于支撑部分。
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公开(公告)号：US20150333046A1
公开(公告)日：2015-11-19
申请号：US14389103
申请日：2013-02-28
申请人： Mitsutoshi MAKIHATA , Masayoshi ESASHI , Shuji TANAKA , Masanori MUROYAMA , Hirofumi FUNABASHI , Yutaka NONOMURA , Yoshiyuki HATA , Hitoshi YAMADA , Takahiro NAKAYAMA , Ui YAMAGUCHI
发明人： Mitsutoshi MAKIHATA , Masayoshi ESASHI , Shuji TANAKA , Masanori MUROYAMA , Hirofumi FUNABASHI , Yutaka NONOMURA , Yoshiyuki HATA , Hitoshi YAMADA , Takahiro NAKAYAMA , Ui YAMAGUCHI
IPC分类号： H01L25/16 , H01L25/18 , H01L21/306 , B81B7/00 , H01L21/78 , H01L21/683 , H01L25/07 , H01L23/538
CPC分类号： H01L23/552 , B81B7/008 , B81C1/00238 , B81C2203/0792 , H01L21/3043 , H01L21/30625 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/5386 , H01L25/072 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/0611 , H01L29/0657 , H01L2221/68327 , H01L2224/94 , H01L2924/0002 , H01L2924/00 , H01L2224/03
摘要： An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
摘要翻译： 提供了具有高绝缘公差的集成器件。 在相邻的装置之间设有具有倾斜侧面的凹槽。 当安装电子电路或MEMS装置的一侧是前表面时，由于倾斜表面，凹槽从前表面变窄到后表面。 模具材料（绝缘材料）设置在凹槽内，使得多个装置机械地接合在一起，彼此电绝缘。 形成相邻器件之间形成电导通的线构件沿着沟槽的侧表面和底表面。 为了将线导出到背面，凹槽的底表面具有孔，使得线构件从孔的背面露出。
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公开(公告)号：US20110083517A1
公开(公告)日：2011-04-14
申请号：US12903673
申请日：2010-10-13
申请人： Masanori MUROYAMA , Masayoshi ESASHI , Shuji TANAKA , Sakae MATSUZAKI , Mitsutoshi MAKIHATA , Yutaka NONOMURA , Motohiro FUJIYOSHI , Takahiro NAKAYAMA , Ui YAMAGUCHI , Hitoshi YAMADA
发明人： Masanori MUROYAMA , Masayoshi ESASHI , Shuji TANAKA , Sakae MATSUZAKI , Mitsutoshi MAKIHATA , Yutaka NONOMURA , Motohiro FUJIYOSHI , Takahiro NAKAYAMA , Ui YAMAGUCHI , Hitoshi YAMADA
IPC分类号： G01L1/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
摘要翻译： 传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分， 其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得 第一感测装置的检测特性与第二感测装置的检测特性不同。
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公开(公告)号：US20170351088A1
公开(公告)日：2017-12-07
申请号：US13899077
申请日：2013-05-21
申请人： Isao AOYAGI , Kanae MURATA , Takashi OZAKI , Norio FUJITSUKA , Yutaka NONOMURA , Teruhisa AKASHI
发明人： Isao AOYAGI , Kanae MURATA , Takashi OZAKI , Norio FUJITSUKA , Yutaka NONOMURA , Teruhisa AKASHI
CPC分类号： G02B26/0841 , B81B3/0062 , B81B5/00 , B81B2201/042 , G02B6/3512 , G02B6/3572 , G02B7/1821 , G02B26/085 , G02B26/10 , H04N1/113
摘要： The present application discloses a deflector including a substrate portion, a movable portion, a reflective portion, a support portion, and a moving mechanism. The movable portion is supported by a first end of the support portion. A second end of the support portion is supported by the substrate portion. An end of the movable portion is capable of coming into contact with the substrate portion. The reflective portion is formed on the movable portion. The moving mechanism is capable of driving the movable portion so as to bring the movable portion into at least any one of a first state, a second state, a third state, and a fourth state.
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