Light emitting device and method of manufacturing the same
    10.
    发明授权
    Light emitting device and method of manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US08581276B2

    公开(公告)日:2013-11-12

    申请号:US12801268

    申请日:2010-06-01

    IPC分类号: H01L33/00

    CPC分类号: H01L33/382 H01L2933/0016

    摘要: Example embodiments relate to a light emitting device and a method of fabricating the light emitting device. The light emitting device may include an n-type clad layer including a plurality of nitride semiconductor layers, at least one interlayer disposed between the plurality of nitride semiconductor layers, a via hole in which a first electrode is formed, a p-type clad layer, and an active layer between the n-type clad layer and the p-type clad layer.

    摘要翻译: 示例性实施例涉及发光器件和制造发光器件的方法。 发光器件可以包括包括多个氮化物半导体层的n型覆盖层,设置在多个氮化物半导体层之间的至少一个中间层,形成有第一电极的通孔,p型覆盖层 ,以及n型覆盖层和p型覆盖层之间的有源层。