摘要:
A voltage-boosting generator for reducing the effects due to operating voltage variation and temperature change. The generator comprises a delay line circuit and a voltage boosting circuit. The delay line circuit is used to perform a time delay according to an initial boosting signal and to produce a control signal. The voltage boosting circuit is used to boosted voltage according to the control signal.
摘要:
A nonvolatile memory array is associated with counting memory that stores data on a number of times a particular threshold state is reached in the associated nonvolatile memory. The aging physical characteristics of the nonvolatile memory can be compensated by adjusting the operating conditions of the nonvolatile memory. The operating conditions vary depending on the data stored in the counting memory.
摘要:
A nonvolatile memory array is associated with counting memory that stores data on a number of times a particular threshold state is reached in the associated nonvolatile memory. The aging physical characteristics of the nonvolatile memory can be compensated by adjusting the operating conditions of the nonvolatile memory. The operating conditions vary depending on the data stored in the counting memory.
摘要:
A transmission mechanism with intermittent output movement includes an output shaft rotatably mounted to first and second cams and a sun gear mounted to the output shaft. A first rocker includes a first planet gear meshed with the sun gear and first and second rollers rotatably mounted on opposite sides of the first planet gear and respectively in contact with the first and second cams. A second rocker includes a second planet gear meshed with the sun gear. An end of a first connecting rod is mounted to the first rocker. An end of a second connecting rod is mounted to the second rocker. Two ends of a link are rotatably mounted to the other ends of the first and second connecting rods. A planet gear carrier is mounted to an input shaft coaxial to the input shaft and includes an end rotatably mounted to the first rocker.
摘要:
The present invention provides a semiconductor device package, comprising a die having a back surface and an active surface formed thereon; an adhesive layer formed on the back surface of the die; a protection substrate formed on the adhesive layer; and a plurality of bumps formed on the active surface of the die for electrically connection. The present invention further provides a method for forming a semiconductor device package, comprising providing a plurality of die having a back surface and an active surface on a wafer; forming an adhesive layer on the back surface of the die; forming a protection substrates on the adhesive layer; forming a plurality of bumps on the active surface of each die; and dicing the plurality of die into individual die for singulation.
摘要:
A nitride trapping memory device includes a comparator, a bias unit, a memory cell, a cycling cell, a compensation cell and a control unit. The comparator has a reference voltage. The bias unit is for outputting a bias voltage to the comparator, and the comparator outputs a bit value according to comparison of the bias voltage and the reference voltage. The memory cell is connected to the bias unit via a first switch. The cycling cell is connected to the bias unit via a second switch. The compensation cell is connected to the bias unit via a third switch. The control unit is for controlling the cycling cell and the compensation cell according to the bit value.
摘要:
The present invention provides a semiconductor device package singulation method. The method comprises printing a photo epoxy layer on the back surface of a substrate of a wafer for marking the scribe lines to be diced. Then etching is performed through the substrate along the marks in the photo epoxy layer. Dicing the panel into individual package with a typical art designing knife, the step not only avoids the roughness on the edge of each die, but also decrease the cost of singulation process.
摘要:
An ultra cycling nitride read only memory (NROM) device is coupled to a NROM array such that both bits of the ultra cycling NROM device will be erased when all NROM devices of the NROM array are erased. The ultra cycling NROM device is then programmed at its right bit. A threshold voltage difference will be obtained for the ultra cycling NROM device for the un-programmed left bit. Next, a cycling number is obtained based on the threshold voltage difference for the ultra cycling NROM device. A threshold voltage shift can be found based on the cycling number for the NROM array. Finally, an erase voltage will be calculated according to the threshold voltage shift for the NROM array. If the NROM array is programmed again, the erase voltage will be applied to un-programmed NROM devices of the NROM array to further reduce the threshold voltages.
摘要:
A system and a method for controlling a sensorless motor are disclosed, where the system includes a motor driver and a zero-crossing detector. The motor driver can drive the sensorless motor. The zero-crossing detector can detect a zero-crossing point when the voltage of one motor coil of the sensorless motor is in a blanking period.
摘要:
The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.