Method and apparatus for thermal treatment of semiconductor workpieces
    1.
    发明授权
    Method and apparatus for thermal treatment of semiconductor workpieces 有权
    半导体工件热处理方法和装置

    公开(公告)号:US08383429B2

    公开(公告)日:2013-02-26

    申请号:US12733436

    申请日:2007-08-29

    IPC分类号: H01L21/00

    摘要: The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece.

    摘要翻译: 本发明提供了一种用于在两个紧密布置的热处理室中快速均匀地热处理半导体工件的装置和方法,其间具有可伸缩门。 可伸缩门在加热或冷却过程中在两个热处理室之间移动,并且为半导体工件的双面热处理提供附加的加热和冷却源。

    Plating apparatus for metallization on semiconductor workpiece
    2.
    发明授权
    Plating apparatus for metallization on semiconductor workpiece 有权
    用于在半导体工件上进行金属化的电镀装置

    公开(公告)号:US08518224B2

    公开(公告)日:2013-08-27

    申请号:US12734438

    申请日:2007-11-02

    摘要: The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.

    摘要翻译: 本发明提供具有多个阳极区和阴极区的电镀装置。 每个区域内的电解液流场都由独立的流量控制装置单独控制。 其表面形成打褶通道的气泡收集器通过收集小气泡,聚结并释放残留气体来实现气体去除。 内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

    PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
    3.
    发明申请
    PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE 有权
    用于金属化半导体工件的镀层设备

    公开(公告)号:US20100307913A1

    公开(公告)日:2010-12-09

    申请号:US12734438

    申请日:2007-11-02

    IPC分类号: C25D17/00 C25D17/02 C25D17/10

    摘要: The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.

    摘要翻译: 本发明提供具有多个阳极区和阴极区的电镀装置。 每个区域内的电解液流场都由独立的流量控制装置单独控制。 其表面形成打褶通道的气泡收集器通过收集小气泡,聚结并释放残留气体来实现气体去除。 内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

    Methods and apparatus for cleaning semiconductor wafers
    4.
    发明授权
    Methods and apparatus for cleaning semiconductor wafers 有权
    用于清洁半导体晶片的方法和设备

    公开(公告)号:US08580042B2

    公开(公告)日:2013-11-12

    申请号:US12734983

    申请日:2007-12-10

    IPC分类号: B08B3/00 B08B7/00

    CPC分类号: H01L21/67051

    摘要: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

    摘要翻译: 用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘,腔室,用于收集具有一个或多个排出口的清洁溶液的可旋转托盘,用于收集多个清洁溶液的多个受体,用于驱动的​​第一马达 卡盘和第二马达驱动托盘。 托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。 由托盘收集的清洁溶液可以被引导到指定的受体中。 该设备的一个特征是具有坚固且精确控制的清洁溶液循环,具有最小的交叉污染。

    METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
    5.
    发明申请
    METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS 有权
    清洗半导体波形的方法和装置

    公开(公告)号:US20110114120A1

    公开(公告)日:2011-05-19

    申请号:US12734983

    申请日:2007-12-10

    IPC分类号: B08B3/00

    CPC分类号: H01L21/67051

    摘要: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

    摘要翻译: 用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘,腔室,用于收集具有一个或多个排出口的清洁溶液的可旋转托盘,用于收集多个清洁溶液的多个受体,用于驱动的​​第一马达 卡盘和第二马达驱动托盘。 托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。 由托盘收集的清洁溶液可以被引导到指定的受体中。 该设备的一个特征是具有坚固且精确控制的清洁溶液循环,具有最小的交叉污染。

    METHOD AND APPARATUS TO PREWET WAFER SURFACE
    6.
    发明申请
    METHOD AND APPARATUS TO PREWET WAFER SURFACE 有权
    方法和装置调整水面

    公开(公告)号:US20140154405A1

    公开(公告)日:2014-06-05

    申请号:US14077756

    申请日:2013-11-12

    申请人: Yue Ma David Wang

    发明人: Yue Ma David Wang

    IPC分类号: H05K3/46

    摘要: The present invention improves the wetting between process solution and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface. The pre-implementing adsorbed liquid is fully filled in the patterned structures formed on the wafer by multilayer absorption of the vaporized liquid molecules and the temperature of the wafer surface is above dew point of the vaporized liquid while condensing, which avoids generating bubbles inside the patterned structures.

    摘要翻译: 本发明通过在处理之前预先实施在晶片的整个前表面上的吸附液体层进行接触来改善工艺溶液与晶片表面之间的润湿性。 通过在升高的温度(相对于晶片)从气相输送蒸发的液体分子并将其冷凝到晶片表面上来实现预实施吸附液体层。 预先实施的吸附液体通过多次吸收蒸发的液体分子而完全填充在晶片上形成的图案化结构中,并且晶片表面的温度在冷凝时高于蒸发液体的露点,这避免了图案化内部产生气泡 结构。

    Method and apparatus to prewet wafer surface for metallization from electrolyte solutions
    7.
    发明申请
    Method and apparatus to prewet wafer surface for metallization from electrolyte solutions 审中-公开
    从电解液中预浸晶片表面进行金属化的方法和装置

    公开(公告)号:US20090107846A1

    公开(公告)日:2009-04-30

    申请号:US12005538

    申请日:2007-12-27

    申请人: Yue Ma David Wang

    发明人: Yue Ma David Wang

    摘要: The present invention improves the wetting between electrolyte and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the plating process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface.

    摘要翻译: 本发明通过在电镀工艺之前预先在晶片的整个前表面上预先实施吸附液体层来改善电解液和晶片表面之间的润湿性。 通过在升高的温度(相对于晶片)从气相输送蒸发的液体分子并将其冷凝到晶片表面上来实现预实施吸附液体层。