摘要:
A hypervisor is operated while an I/O device is not controlled by the hypervisor performs a process operation. A result of the process of the I/O device which is being concurrently operated is recorded to be capable of being reflected to the operation of the hypervisor. Therefore, a hypervisor which assigns a computer including an I/O control device controlling an I/O device, a main storage device, and a CPU as resources to each of one or more logical partitions (LPAR) and performs control, and a logging circuit recording data transmission from the I/O device to the main storage device, which is uncontrolled by the hypervisor, in response to an instruction from the hypervisor, are provided. It is possible to shorten a halt time period of an LPAR.
摘要:
An image processing apparatus includes a character recognition unit configured to perform character recognition of a character region where characters exist in an image to generate character code, a detection unit configured to detect a region of the image where a feature change in the image is small, and a placement unit configured to place data obtained from the character code in the detected region.
摘要:
The present invention aims to provide a method of shot-peening treatment that substantially improves the durability (particularly, heat check resistance) of the treated surface of the steel products in the process of treating by shot peening (hereafter, “SP”) the surface of the steel product that is the work to be treated and that was treated by heat hardening.The SP treatment of the present invention that gives the SP treatment to the steel product that was heat-treated and that is a work to be treated comprises the first SP treatment that removes the compound layer (white layer) and a second SP treatment that gives compressive residual stress to the first SP treated surface that was treated by the first SP treatment where the second SP treatment is carried out only to the products where it has been proved by the non-destructive inspection that the compound layers are removed by the first SP treatment.
摘要:
A low-pressure loop EGR device (47, 89) includes an electronic control unit (controller) (55). When an off signal is inputted from a key switch (57) as a stop warning signal to give notice that a supercharged engine (1) is about to stop, the electric control unit (55) controls an EGR valve (51) so as to close an EGR passage (49), and then controls a nozzle actuator (27) so as to turn multiple variable nozzles (25) in a narrowing direction.
摘要:
Provided is an imaging apparatus capable of obtaining images of an object at high precision even if the intensities of illuminating light temporally varies. The imaging apparatus 1 comprises a lamp unit 10, lens 21, a half mirror 22, a lens 23, a liquid crystal tunable filter 24, a lens 25, a reference mirror 31, a reference mirror 32, an image capturing unit 40, an operation unit 50, and a display unit 60. The reference mirrors 31 and 32 are provided at the positions to which illuminating light led by an optical system for illuminating light is irradiated and which are located at a part of the view of the image capturing unit 40. The operation unit 50 corrects the value of the image part of the object 2 by using the value of the image part of the reference mirrors 31 and 32 out of the images captured by the image capturing unit 40.
摘要:
An image processing apparatus includes a character recognition unit configured to perform character recognition of a character region where characters exist in an image to generate character code, a detection unit configured to detect a region of the image where a feature change in the image is small, and a placement unit configured to place data obtained from the character code in the detected region.
摘要:
A method of shot peening in which with respect to a carburized and quenched metal part, only its surface abnormal layer detrimental to the fatigue strength thereof is scraped without scraping of the martensitic structure underlying the surface abnormal layer, namely, in which the fatigue strength can be rendered stable and enhanced without surface cracking. As bombardment shot, use is made of a shot with hardness higher than that (first hardness) of the surface abnormal layer occurring at a surface layer portion of metal part prior to shot peening but lower than that (second hardness) of the martensitic structure.
摘要:
The Job executing device comprises a Job executing unit of executing a job concerning image data, an execution instruction-receiving unit of receiving an instruction for job execution sent to the Job executing unit by a user who is authenticated by an authentication unit, a memory unit of storing the notification destination corresponding to user identification information inputted for user authentication, and a notification unit of notifying the notification destination corresponding to the inputted user identification information of the instruction of job execution after receipt of the instruction for job execution by the execution instruction-receiving unit.
摘要:
Provided is a constant current circuit and a reference voltage circuit with improved line regulation without needing a start-up circuit. The constant current circuit includes: a constant current generation circuit including NMOS transistors and a resistor; a current mirror circuit including a pair of depletion mode NMOS transistors, for allowing a current of the constant current generation circuit to flow; and a feedback circuit for maintaining constant voltages of source terminals of the pair of depletion mode NMOS transistors.
摘要:
A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.