公开(公告)号：US06605868B2

公开(公告)日：2003-08-12

申请号：US09457335

申请日：1999-12-09

申请人： Yutaka Ishiwata ,  Kosoku Nagata ,  Toshio Shimizu ,  Hiroyuki Hiramoto ,  Yasuhiko Taniguchi ,  Kouji Araki ,  Hiroshi Fukuyoshi ,  Hiroshi Komorita

发明人： Yutaka Ishiwata ,  Kosoku Nagata ,  Toshio Shimizu ,  Hiroyuki Hiramoto ,  Yasuhiko Taniguchi ,  Kouji Araki ,  Hiroshi Fukuyoshi ,  Hiroshi Komorita

IPC分类号： H05K346

CPC分类号： H05K1/0256 ,  H01L23/34 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48137 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/09145 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join the adjacent ceramic layers to each other, a first conductive layer (5) joined to the top surface of a top one of the ceramic layers, and a second conductive layer (6) joined to the bottom surface of a bottom one of the ceramic layers. Even if any one of the ceramic layers has strength lower than design strength and causes a breakage due to, for example, thermal stress, the remaining ceramic layers are sound to secure a specified breakdown voltage for the insulating substrate.

摘要翻译： 绝缘基板（1）具有彼此层叠的绝缘陶瓷层（2,3），由与陶瓷层的材料不同并且布置在相邻的陶瓷层之间的材料制成的中间层（4） 将相邻的陶瓷层彼此接合，接合到顶部陶瓷层的顶表面的第一导电层（5）和接合到陶瓷的底部陶瓷层的底表面的第二导电层（6） 层。 即使陶瓷层中的任何一个具有低于设计强度的强度并且由于例如热应力而引起断裂，剩余的陶瓷层声音可以确保绝缘基板的规定的击穿电压。

公开(公告)号：US07263766B2

公开(公告)日：2007-09-04

申请号：US10351312

申请日：2003-01-27

申请人： Yutaka Ishiwata ,  Kosoku Nagata ,  Toshio Shimizu ,  Hiroyuki Hiramoto ,  Yasuhiko Taniguchi ,  Kouji Araki ,  Hiroshi Fukuyoshi ,  Hiroshi Komorita

发明人： Yutaka Ishiwata ,  Kosoku Nagata ,  Toshio Shimizu ,  Hiroyuki Hiramoto ,  Yasuhiko Taniguchi ,  Kouji Araki ,  Hiroshi Fukuyoshi ,  Hiroshi Komorita

IPC分类号： H05K3/00 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC分类号： H05K1/0256 ,  H01L23/34 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48137 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/09145 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join the adjacent ceramic layers to each other, a first conductive layer (5) joined to the top surface of a top one of the ceramic layers, and a second conductive layer (6) joined to the bottom surface of a bottom one of the ceramic layers. Even if any one of the ceramic layers has strength lower than design strength and causes a breakage due to, for example, thermal stress, the remaining ceramic layers are sound to secure a specified breakdown voltage for the insulating substrate.

摘要翻译： 绝缘基板（1）具有彼此层叠的绝缘陶瓷层（2,3），由与陶瓷层的材料不同并且布置在相邻的陶瓷层之间的材料制成的中间层（4） 将相邻的陶瓷层彼此接合，接合到顶部陶瓷层的顶表面的第一导电层（5）和接合到陶瓷的底部陶瓷层的底表面的第二导电层（6） 层。 即使陶瓷层中的任何一个具有低于设计强度的强度并且由于例如热应力而引起断裂，剩余的陶瓷层声音可以确保绝缘基板的规定的击穿电压。

公开(公告)号：US07391386B2

公开(公告)日：2008-06-24

申请号：US10541601

申请日：2004-01-08

申请人： Takuma Sawaya ,  Kyoichi Iigusa ,  Makoto Taromaru ,  Takashi Ohira ,  Kouji Araki

发明人： Takuma Sawaya ,  Kyoichi Iigusa ,  Makoto Taromaru ,  Takashi Ohira ,  Kouji Araki

IPC分类号： H01Q19/00 ,  H01Q9/00

CPC分类号： H01Q1/2266 ,  H01Q1/2275 ,  H01Q1/242 ,  H01Q3/44 ,  H01Q9/30 ,  H01Q19/32 ,  H04B7/086

摘要： An array antenna apparatus (100) includes a radiating element (A0) for receiving a transmitted radio signal, two parasitic elements (A1, A2), and two variable reactance elements (12-1, 12-2) connected to the respective parasitic elements (A1, A2), and a directivity characteristic of the array antenna apparatus is changed by changing reactances set to the variable reactance elements. An antenna controller (10) selects and sets one reactance to be set from those in a first case in which a first reactance set is set to the two variable reactance elements (12-1, 12-2) and a second case in which a second reactance set is set to the two variable reactance elements (12-1, 12-2) to be able to obtain a diversity gain equal to or larger than a predetermined value, based on a received radio signal, based on signal quality of the radio signal.

摘要翻译： 阵列天线装置（100）包括用于接收发送的无线电信号的辐射元件（A 0），两个寄生元件（A 1，A 2）和两个连接到所述发射无线电信号的可变电抗元件（12-1,12-2） 相应的寄生元件（A 1，A 2）和阵列天线装置的方向特性通过改变设置到可变电抗元件的电抗而改变。 天线控制器（10）从将第一电抗设置为两个可变电抗元件（12-1,12-2）的第一种情况中选择并设置一个电抗，并且设置一个电抗 基于所接收的无线电信号，将第二电抗设置为两个可变电抗元件（12-1,12-2）以能够基于所接收的无线电信号的信号质量获得等于或大于预定值的分集增益 无线电信号。

公开(公告)号：US5295044A

公开(公告)日：1994-03-15

申请号：US950899

申请日：1992-09-25

申请人： Kouji Araki ,  Shinjiro Kojima ,  Wataru Takahashi

发明人： Kouji Araki ,  Shinjiro Kojima ,  Wataru Takahashi

IPC分类号： H01L25/00 ,  H01L23/24 ,  H01L23/538 ,  H01L25/065 ,  H05K7/02 ,  H05K7/20

CPC分类号： H01L23/24 ,  H01L23/5385 ,  H01L25/0652 ,  H05K7/023 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/1627 ,  H01L2924/19107

摘要： A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective circuit boards are attached to the respective frames, a semiconductor device having semiconductor elements mounted at high density can be formed by stacking the first and second frames on each other and setting the respective connection terminals in contact with each other to electrically connect the circuit boards to each other.

摘要翻译： 使用多个电路板，并且将框架附接到电路板以包围其周边部分。 由于电连接到各个电路板的连接端子被附接到各个框架，所以可以通过将第一和第二框架彼此堆叠并且将各个连接端子与每个连接端子接触来形成具有以高密度安装的半导体元件的半导体器件 另外将电路板彼此电连接。

公开(公告)号：US5338392A

公开(公告)日：1994-08-16

申请号：US132866

申请日：1993-10-07

申请人： Kouji Araki

发明人： Kouji Araki

IPC分类号： H01L23/12 ,  H01L23/495 ,  H05K3/20 ,  B44C1/22 ,  C23F1/00

CPC分类号： H01L23/49541 ,  H01L2924/0002 ,  H05K3/202

摘要： In a method for manufacturing a laminated plate used in a semiconductor device according to the present invention, a conductive member is processed to form a frame and a wiring pattern supported by the frame integrally with each other, the wiring pattern is bonded to the major surface of a base member by high-temperature heating, using the frame as a guide, thereby to form a laminated layer, and the frame is removed from the laminated layer to form a desirable laminated plate.

摘要翻译： 在根据本发明的用于半导体器件的层压板的制造方法中，将导电部件加工成由框架和由框架一体地支撑的布线图案，将布线图案粘合到主表面 通过高温加热使用框架作为引导件，从而形成层压层，并且将框架从层压层移除以形成所需的层压板。

公开(公告)号：US4911350A

公开(公告)日：1990-03-27

申请号：US327626

申请日：1989-03-24

申请人： Kouji Araki ,  Toshihiro Kato

发明人： Kouji Araki ,  Toshihiro Kato

IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/607

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48624 ,  H01L2224/78302 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A wire bonding capillary for a bonding process comprises an elongated capillary body having an axial bore through the body for receiving a wire of a predetermined diameter to be bonded, and a working face on one end of the body for applying force to the bonding wire during the bonding process. The working face includes a first surface portion surrounding the bore and having a first radius of curvature, and a second surface portion adjacent to the first surface portion and having a second radius of curvature smaller than the first radius curvature.

摘要翻译： 用于接合工艺的引线接合毛细管包括细长毛细管体，其具有穿过本体的轴向孔，用于接收预定直径的待接合的线，以及在所述主体的一端上的工作面，用于在接合线 粘合过程。 工作面包括围绕孔并且具有第一曲率半径的第一表面部分和与第一表面部分相邻并具有小于第一半径曲率的第二曲率半径的第二表面部分。

公开(公告)号：US5332921A

公开(公告)日：1994-07-26

申请号：US052610

申请日：1993-04-27

申请人： Noriaki Dousen ,  Nobuyuki Sato ,  Kouji Araki

发明人： Noriaki Dousen ,  Nobuyuki Sato ,  Kouji Araki

IPC分类号： H01L23/12 ,  H01L23/24 ,  H01L23/28 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L25/04 ,  H01L25/18 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/24 ,  H01L23/4334 ,  H01L23/49531 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107

摘要： A resin-seal type semiconductor device includes a main substrate divided into first and second surfaces on which first and second insulating substrates are respectively provided. Circuit wiring patterns and first end portions of outer leads are provided on the first and second insulating substrates. Semiconductor elements are soldered onto the wiring patterns and coated with a surface protection material. The main substrate is then folded over so that the first and second surfaces oppose one another and the device acquires a U-shaped cross-section. A space formed between the first and second surfaces inside the U-shape is sealed with a resin such that second end portions of the outer leads are exposed from the resin.

摘要翻译： 树脂密封型半导体器件包括分为第一和第二表面的主衬底，分别设有第一和第二绝缘衬底。 电路布线图案和外引线的第一端部设置在第一绝缘基板和第二绝缘基板上。 将半导体元件焊接到布线图案上并涂覆有表面保护材料。 然后将主基板折叠成使得第一和第二表面彼此相对，并且该装置获得U形横截面。 在U形内部的第一和第二表面之间形成的空间用树脂密封，使得外引线的第二端部从树脂露出。

公开(公告)号：US5113241A

公开(公告)日：1992-05-12

申请号：US627573

申请日：1990-12-14

申请人： Satoru Yanagida ,  Kouji Araki ,  Hikaru Okunoyama ,  Tetsunori Niimi

发明人： Satoru Yanagida ,  Kouji Araki ,  Hikaru Okunoyama ,  Tetsunori Niimi

IPC分类号： H01L21/52 ,  H01B3/00 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/83 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.