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    Method for manufacturing wiring circuit boards with bumps and method for forming bumps
    1.
    发明授权
    Method for manufacturing wiring circuit boards with bumps and method for forming bumps 失效
    用于制造具有凸块的布线电路板的方法和用于形成凸块的方法

    公开(公告)号：US06977349B2

    公开(公告)日：2005-12-20

    申请号：US10403024

    申请日：2003-04-01

    申请人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    发明人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    IPC分类号： H05K3/34 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H01K1/00

    CPC分类号： H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/0367 ,  H05K2203/0369

    摘要： Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

    摘要翻译： 可以制造具有凸块的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他难以操作的电镀。 通过利用凸起形成蚀刻掩模7形成在金属箔3的凸起形成表面3a上的技术，金属箔3的厚度是布线电路1的厚度t 1和高度t 2之和 要形成在布线电路1上的凸块2（t 1 + t 2），然后通过将金属箔3半蚀刻到与所需的凸起高度t 2相对应的深度来形成凸块2 凸点形成蚀刻掩模7侧，可以制造具有凸起的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他复杂的工艺。

    Method for manufacturing wiring circuit boards with bumps and method for forming bumps
    6.
    发明授权
    Method for manufacturing wiring circuit boards with bumps and method for forming bumps 有权
    用于制造具有凸块的布线电路板的方法和用于形成凸块的方法

    公开(公告)号：US06562250B1

    公开(公告)日：2003-05-13

    申请号：US09697453

    申请日：2000-10-27

    申请人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    发明人： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

    IPC分类号： H01B1322

    CPC分类号： H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/0367 ,  H05K2203/0369

    摘要： Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

    摘要翻译： 可以制造具有凸块的布线电路板，使得可以进行稳定的凸点连接，并且不需要电镀预处理或其他难以操作的电镀。 通过利用在金属箔3的凸起形成表面3a上形成凸起形成蚀刻掩模7的技术，其厚度是布线电路1的厚度t1和凸块的高度t2之和的厚度 2（t1 + t2），然后通过从凸块形成蚀刻掩模7将金属箔3半蚀刻到与期望的凸块高度t2相对应的深度来形成凸块2 可以制造具有凸块的布线电路板，使得可以实现稳定的凸点连接，并且不需要电镀预处理或其他复杂工艺。

    Method for production of interposer for mounting semiconductor element
    7.
    发明授权
    Method for production of interposer for mounting semiconductor element 失效
    用于安装半导体元件的插入件的制造方法

    公开(公告)号：US06312614B1

    公开(公告)日：2001-11-06

    申请号：US09577883

    申请日：2000-05-25

    申请人： Yoshio Arimitsu ,  Yutaka Kaneda

    发明人： Yoshio Arimitsu ,  Yutaka Kaneda

    IPC分类号： H01L2100

    CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/064 ,  H05K3/28 ,  H05K2203/0571 ,  H05K2203/058 ,  H05K2203/0588 ,  H01L2924/00

    摘要： A semiconductor element mounting interposer is produced by (A) forming a conducting circuit that comprises motherboard connecting electrodes 2 and plated leads 3 on an insulating base film 1; (B) forming a patterning resin layer 5 over the conducting circuit 4; (C) etching patterning resin layer 5 so as to expose the motherboard connecting electrodes 2 and plated leads 3; (D) masking plated leads 3 with an electroplating resist layer 6; (E) depositing an electroplated metal layer 7 over the exposed motherboard connecting electrodes 2; (F) removing the electroplating resist layer 6; (G) removing the exposed plated leads 3 through etching; and (H) where the patterning resin layer 5 is a polyimide precursor layer, bringing about complete imidation of the polyimide precursor layer.

    摘要翻译： 通过（A）在绝缘基膜1上形成包括母板连接电极2和电镀引线3的导电电路来制造半导体元件安装插入件; （B）在导电电路4上形成图案化树脂层5; （C）蚀刻图形化树脂层5，以使母板连接电极2和电镀引线3露出; （D）用电镀抗蚀剂层6对电镀引线3进行掩模; （E）在暴露的母板连接电极2上沉积电镀金属层7; （F）去除电镀抗蚀剂层6; （G）通过蚀刻去除暴露的电镀引线3; 和（H），其中图案形成树脂层5是聚酰亚胺前体层，使聚酰亚胺前体层完全酰化。

    Block copolymer
    9.
    发明授权
    Block copolymer 失效
    嵌段共聚物

    公开(公告)号：US07407694B2

    公开(公告)日：2008-08-05

    申请号：US11203608

    申请日：2005-08-11

    申请人： Akio Taniguchi ,  Kentaro Takesada ,  Yutaka Kaneda ,  Tadashi Kokubo ,  Nobuaki Ohshiro ,  Atsushi Kumasaki ,  Takeshi Chiba ,  Tomoki Hiiro

    发明人： Akio Taniguchi ,  Kentaro Takesada ,  Yutaka Kaneda ,  Tadashi Kokubo ,  Nobuaki Ohshiro ,  Atsushi Kumasaki ,  Takeshi Chiba ,  Tomoki Hiiro

    IPC分类号： C08L53/00

    CPC分类号： C08F293/00 ,  C08F293/005 ,  Y10T428/1352 ,  Y10T428/1386 ,  Y10T428/139

    摘要： The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.

    摘要翻译： 本发明涉及包含（甲基）丙烯酸聚合物嵌段（a）和丙烯酸类聚合物嵌段（b）的嵌段共聚物（A）。 （甲基）丙烯酸系聚合物嵌段（a）优选与具有高凝聚力的官能团的单体如羧基共聚，使得5％重量损失温度为300℃以上或 拉伸强度为3MPa以上，通过根据JIS K6253的A型硬度计测定的硬度为50以下，在70℃下22小时后测定的压缩永久变形量为45％以下。 嵌段共聚物（A）在高温下表现出优异的耐热分解性和低压缩永久变形。 嵌段共聚物（A）可以用作汽车的软质材料，硬度低，附着力高，耐油性高，耐候性高，耐热性高，回收性能好，拉伸性能好，脱蜡性高。

    Acrylic block copolymer and thermoplastic resin composition
    10.
    发明授权
    Acrylic block copolymer and thermoplastic resin composition 失效
    丙烯酸嵌段共聚物和热塑性树脂组合物

    公开(公告)号：US07309736B2

    公开(公告)日：2007-12-18

    申请号：US10522869

    申请日：2003-07-31

    申请人： Akio Taniguchi ,  Tadashi Kokubo ,  Kentaro Takesada ,  Kozo Kondo ,  Takeshi Chiba ,  Atsushi Kumasaki ,  Yutaka Kaneda

    发明人： Akio Taniguchi ,  Tadashi Kokubo ,  Kentaro Takesada ,  Kozo Kondo ,  Takeshi Chiba ,  Atsushi Kumasaki ,  Yutaka Kaneda

    IPC分类号： C08L53/00

    CPC分类号： C08F293/005 ,  C08F8/48 ,  C08F297/026 ,  C08F2438/01 ,  C08L53/00 ,  C08L2666/02 ,  C09J153/00

    摘要： The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).

    摘要翻译： 本发明提供了一种具有柔软性，机械强度，成型性，耐油性，耐热性，耐热分解性，耐候性和压缩永久变形性优异，反应性更强的新型丙烯酸系嵌段共聚物。 本发明还提供组合物，密封产品以及汽车，电气和电子部件，所有这些部件都包括丙烯酸类嵌段共聚物。 丙烯酸嵌段共聚物包括甲基丙烯酸系聚合物嵌段（a）和丙烯酸系聚合物嵌段（b），至少一个聚合物嵌段在其主链中含有至少一个由式（1）表示的酸酐基团（c） ：（其中R 1〜S各自表示氢或甲基，可以相同或不同，n表示0〜3的整数，m表示0或1的整数）。