公开(公告)号：US06258721B1

公开(公告)日：2001-07-10

申请号：US09472104

申请日：1999-12-27

申请人： Yuzhuo Li ,  David Bruce Cerutti ,  Donald Joseph Buckley, Jr. ,  Earl Royce Tyre, Jr. ,  Jason J. Keleher ,  Richard J. Uriarte ,  Ferenc Horkay

发明人： Yuzhuo Li ,  David Bruce Cerutti ,  Donald Joseph Buckley, Jr. ,  Earl Royce Tyre, Jr. ,  Jason J. Keleher ,  Richard J. Uriarte ,  Ferenc Horkay

IPC分类号： H01L21302

CPC分类号： H01L21/3212 ,  H01L21/02074

摘要： The multistage process for the chemical-mechanical planarization (CMP) of Cu commences with forming a primary aqueous or non-aqueous (e.g., using alcohols and ketones as non-aqueous carriers) slurry from (i) between about 0 and 7 wt-% of an oxidizer, (ii) between 0 and 7 wt-% of a chelating agent, (iii) between about 0 and 5 wt-% of a surfactant, (iv) between about 0.001 and 5 wt-% diamond particles having an average particle size not substantially above about 0.4 &mgr;, and (v) an amount of a pH adjustment agent so that the aqueous slurry has a pH of between about 3 and 10, and advantageously about 5). The Cu of the semiconductor wafer then is subjected to CMP using the primary aqueous slurry and then is subjected to a cleaning operation. Next, a secondary aqueous slurry from (i) between about 0 and 5 wt-% of an a hydroxyl amine compound, (ii) between about 0 and 7 wt-% of a chelating agent, (iii) between about 0 and 5 wt-% of a surfactant, (iv) between about 0.001 and 5 wt-% diamond particles having an average particle size not substantially above about 0.4 &mgr;, and (v) an amount of a pH adjustment agent so that the aqueous slurry has a pH of between about 4 and 10, and advantageously about 8.5 pH. The semiconductor wafer then is subjected to CMP using said secondary aqueous slurry. Thereafter, the semiconductor wafer again is subjected to a cleaning operation.

摘要翻译： Cu的化学 - 机械平面化（CMP）的多阶段过程开始于形成主要含水或非水性（例如，使用醇和酮作为非水性载体）浆料，其从（i）约0至7重量％ 的氧化剂，（ii）0至7重量％的螯合剂，（iii）约0至5重量％的表面活性剂，（iv）约0.001至5重量％的具有平均值的金刚石颗粒 颗粒大小基本上不超过约0.4μm，和（v）一定量的pH调节剂，使得含水浆液的pH值在约3至10之间，有利地约为5）。 然后使用初级含水浆料对半导体晶片的Cu进行CMP处理，然后进行清洁操作。 接下来，从（i）约0至5重量％的羟胺化合物，（ii）约0至7重量％的螯合剂，（iii）约0至5重量％ - 表面活性剂的％，（iv）约0.001至5重量％的平均粒度基本上不超过约0.4μm的金刚石颗粒，和（v）一定量的pH调节剂，使得水性浆料具有pH 在约4至10之间，并且有利地约8.5 pH。 然后使用所述第二水性浆料对半导体晶片进行CMP。 此后，再次对半导体晶片进行清洁操作。

公开(公告)号：US06242351B1

公开(公告)日：2001-06-05

申请号：US09591189

申请日：2000-06-08

申请人： Yuzhuo Li ,  David Bruce Cerutti ,  Donald Joseph Buckley, Jr. ,  Earl Royce Tyre, Jr. ,  Jason J. Keleher ,  Richard J. Uriarte ,  Ferenc Horkay

发明人： Yuzhuo Li ,  David Bruce Cerutti ,  Donald Joseph Buckley, Jr. ,  Earl Royce Tyre, Jr. ,  Jason J. Keleher ,  Richard J. Uriarte ,  Ferenc Horkay

IPC分类号： H01L21302

CPC分类号： C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212

摘要： The multistage process for the chemical-mechanical planarization (CMP) of Cu commences with forming a primary aqueous or non-aqueous (e.g., using alcohols and ketones as non-aqueous carriers) slurry from (i) between about 0 and 7 wt-% of an oxidizer, (ii) between 0 and 7 wt-% of one or more of a complexing agent or a passivating agent, (iii) between about 0 and 5 wt-% of a surfactant, (iv) between about 0.001 and 5 wt-% diamond particles having an average particle size not substantially above about 0.4 &mgr;m, and (v) an amount of a pH adjustment agent so that the aqueous slurry has a pH of between about 3 and 10, and advantageously about 5). The Cu of the semiconductor wafer then is subjected to CMP using the primary aqueous slurry and then is subjected to a cleaning operation. Next, a secondary aqueous slurry from (i) between about 0 and 7 wt-% of one or more a complexing agent or a passivating agent, (ii) between about 0 and 5 wt-% of a surfactant, (iii) between about 0.001 and 5 wt-% diamond particles having an average particle size not substantially above about 0.4 &mgr;m, and (iv) an amount of a pH adjustment agent so that the aqueous slurry has a pH of between about 4 and 10, and advantageously about 8.5 pH. The semiconductor wafer then is subjected to CMP using said secondary aqueous slurry. Thereafter, the semiconductor wafer again is subjected to a cleaning operation.

摘要翻译： Cu的化学 - 机械平面化（CMP）的多阶段过程开始于形成主要含水或非水性（例如，使用醇和酮作为非水性载体）浆料，其从（i）约0至7重量％ 的氧化剂，（ii）0至7重量％的一种或多种络合剂或钝化剂，（iii）约0至5重量％的表面活性剂，（iv）约0.001至5重量％ 具有基本上不超过约0.4μm的平均粒度的重量％金刚石颗粒，和（v）一定量的pH调节剂，使得所述含水浆料的pH为约3至10，并且有利地为约5）。 然后使用初级含水浆料对半导体晶片的Cu进行CMP处理，然后进行清洁操作。 接下来，从（i）约0至7重量％的一种或多种络合剂或钝化剂的二次含水浆料，（ii）约0至5重量％的表面活性剂之间，（iii）介于约 0.001和5重量％的具有基本上不超过约0.4μm的平均粒度的金刚石颗粒，和（iv）一定量的pH调节剂，使得所述含水浆料的pH为约4至10，有利地为约8.5 pH值。 然后使用所述第二水性浆料对半导体晶片进行CMP。 此后，再次对半导体晶片进行清洁操作。

公开(公告)号：US06921929B2

公开(公告)日：2005-07-26

申请号：US10609040

申请日：2003-06-27

申请人： Steven Francis LeBoeuf ,  Donald Joseph Buckley, Jr. ,  Stanton Earl Weaver

发明人： Steven Francis LeBoeuf ,  Donald Joseph Buckley, Jr. ,  Stanton Earl Weaver

IPC分类号： H01L33/50 ,  H01J29/24 ,  H01J1/62 ,  H01L29/24

CPC分类号： H01L33/502 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K2201/10106

摘要： A lens and encapsulant made of an amorphous fluoropolymer for a light-emitting diode (LED) or diode laser, such as an ultraviolet (UV) LED (UVLED). A semiconductor diode die (114) is formed by growing a diode (110) on a substrate layer (115) such as sapphire. The diode die (114) is flipped so that it emits light (160, 365) through the face (150) of the layer (115). An amorphous fluoropolymer encapsulant encapsulates the emitting face of the diode die (114), and may be shaped as a lens to form an integral encapsulant/lens. Or, a lens (230, 340) of amorphous fluoropolymer may be joined to the encapsulant (220). Additional joined or separate lenses (350) may also be used. The encapsulant/lens is transmissive to UV light as well as infrared light. Encapsulating methods are also provided.

摘要翻译： 由用于发光二极管（LED）或二极管激光器（例如紫外线（UV）LED（UVLED））的无定形含氟聚合物制成的透镜和密封剂。 通过在诸如蓝宝石的衬底层（115）上生长二极管（110）来形成半导体二极管管芯（114）。 二极管管芯（114）被翻转，使得它通过层（115）的面（150）发光（160,365）。 无定形氟聚合物密封剂封装二极管管芯（114）的发射面，并且可以被成形为透镜以形成整体的密封剂/透镜。 或者，可以将无定形含氟聚合物的透镜（230,340）接合到密封剂（220）。 还可以使用附加的连接或分开的透镜（350）。 密封剂/透镜对于紫外线以及红外光是透射的。 还提供封装方法。

公开(公告)号：US07822457B2

公开(公告)日：2010-10-26

申请号：US10723318

申请日：2003-11-25

申请人： Murtuza Lokhandwalla ,  Ajay Kapur ,  Donald Joseph Buckley, Jr.

发明人： Murtuza Lokhandwalla ,  Ajay Kapur ,  Donald Joseph Buckley, Jr.

IPC分类号： A61B5/05 ,  A61B6/04

CPC分类号： A61B6/502 ,  A61B5/0091 ,  A61B5/4312 ,  A61B6/0414 ,  A61B6/4417 ,  A61B2562/17

摘要： Apparatus for compressing tissue to be scanned for medical imaging is provided. The apparatus may comprise a compression membrane and a tensioning apparatus coupled to the membrane to apply a tensile force to the membrane to place the membrane in a taut condition during an imaging process. In one exemplary application that combines ultrasound scanning with X-ray mammography, the compressing apparatus enables accurate, reproducible ultrasound images reducing distortion and attenuation, which may otherwise be introduced as a consequence of such a combination of imaging processes.

摘要翻译： 提供了用于压缩待扫描医疗成像的组织的装置。 该装置可以包括压缩膜和连接到膜的张紧装置，以在成像过程中将拉力施加到膜以使膜处于紧张状态。 在将超声扫描与X射线乳腺X线照相术组合的一个示例性应用中，压缩装置能够实现精确的，可再现的超声图像，减少失真和衰减，否则可能由于成像过程的组合而被引入。

公开(公告)号：US07021147B1

公开(公告)日：2006-04-04

申请号：US11178128

申请日：2005-07-11

申请人： Kanakasabapathi Subramanian ,  Donald Joseph Buckley, Jr. ,  Slawomir Rubinsztajn ,  Arun Virupaksha Gowda ,  Stanton Earl Weaver, Jr. ,  Russell William Craddock ,  Deborah Ann Haitko

发明人： Kanakasabapathi Subramanian ,  Donald Joseph Buckley, Jr. ,  Slawomir Rubinsztajn ,  Arun Virupaksha Gowda ,  Stanton Earl Weaver, Jr. ,  Russell William Craddock ,  Deborah Ann Haitko

IPC分类号： G01L19/04

CPC分类号： G01L19/0645

摘要： A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.

摘要翻译： 描述传感器封装和方法。 传感器组件包括外壳，连接到外壳的隔膜。 隔膜被配置为从周围环境接收振动。 此外，传感器封装包括设置在外壳内部的压力感测元件和设置在外壳内部并且靠近压力感测元件的压力传感介质，其中压力传递介质包括流体，以及悬浮在流体中的多个填料颗粒 。 填料颗粒用于降低压力传递介质的热膨胀系数。

公开(公告)号：US06559270B1

公开(公告)日：2003-05-06

申请号：US09416529

申请日：1999-10-12

申请人： Tiberiu Mircea Siclovan ,  Jimmy Lynn Webb ,  Sterling Bruce Brown ,  Donald Joseph Buckley, Jr. ,  James Edward Pickett ,  Joseph Anthony Suriano ,  Paul Dean Sybert ,  Daniel Joseph Brunelle ,  Margaret Louise Blohm ,  Hongyi Zhou ,  Georgia Dris Fishburn

发明人： Tiberiu Mircea Siclovan ,  Jimmy Lynn Webb ,  Sterling Bruce Brown ,  Donald Joseph Buckley, Jr. ,  James Edward Pickett ,  Joseph Anthony Suriano ,  Paul Dean Sybert ,  Daniel Joseph Brunelle ,  Margaret Louise Blohm ,  Hongyi Zhou ,  Georgia Dris Fishburn

IPC分类号： C08G6401

CPC分类号： C08L67/00 ,  C08G63/64 ,  C08G63/78 ,  C08G64/18 ,  C08G2261/126 ,  C08K3/013 ,  C08L67/02 ,  C08L67/03 ,  C08L69/00 ,  C08L69/005 ,  C08L79/08 ,  F02B61/045

摘要： Block copolyestercarbonates may be prepared by first conducting a reaction between at least one of resorcinol or an alkyl- or haloresorcinol and at least one aromatic dicarboxylic acid dichloride, preferably isophthaloyl dichloride, terephthaloyl dichloride or a mixture thereof, to produce a hydroxy-terminated polyester intermediate, and then conducting a reaction of the intermediate with a carbonate precursor, preferably in the presence of a dihydroxy compound such as bisphenol A. The products have excellent physical properties, including a high degree of weatherability. They may be blended with other polymers such as polycarbonates, poly(alkylene carboxylates), polyarylates, polyetherimides, and addition polymers to improve the weatherability thereof.

摘要翻译： 嵌段共聚酯碳酸酯可以通过首先在间苯二酚或烷基 - 或卤代间苯二酚和至少一种芳族二羧酸二氯化物，优选间苯二酰氯，对苯二甲酰氯或其混合物中的至少一种之间进行反应来制备，以产生羟基封端的聚酯中间体 ，然后进行中间体与碳酸酯前体的反应，优选在二羟基化合物如双酚A的存在下进行。产物具有优异的物理性能，包括高度的耐候性。 它们可以与其他聚合物如聚碳酸酯，聚（亚烷基羧酸酯），聚芳酯，聚醚酰亚胺和加成聚合物共混以改善其耐候性。