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1.发明公开公开(公告)号：US20240364001A1
公开(公告)日：2024-10-31
申请号：US18769067
申请日：2024-07-10
发明人： Shao-Tzu TANG , Chih-Hsien CHIU , Wen-Jung TSAI , Ko-Wei CHANG , Chia-Chu LAI
摘要： An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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公开(公告)号：US20240321591A1
公开(公告)日：2024-09-26
申请号：US18732009
申请日：2024-06-03
发明人： Shu-Chi CHANG , Wei-Ping WANG , Hsien-Lung HSIAO , Kaun-I CHENG
IPC分类号： H01L21/44 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/485 , H01L23/552 , H01L27/06 , H01L29/78
CPC分类号： H01L21/44 , H01L23/3114 , H01L23/485 , H01L23/552 , H01L24/12 , H01L27/0623 , H01L29/7834 , H01L21/561 , H01L23/3121 , H01L24/16 , H01L24/48 , H01L2224/16227 , H01L2224/48227 , H01L2224/97 , H01L2924/15313 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US12100633B2
公开(公告)日：2024-09-24
申请号：US18214969
申请日：2023-06-27
发明人： Ho-Chuan Lin , Min-Han Chuang , Chia-Chu Lai
IPC分类号： H01L23/31 , H01L21/56 , H01L23/00 , H01L23/528
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/5286 , H01L24/11 , H01L24/14 , H01L24/43 , H01L24/45
摘要： An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
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公开(公告)号：US20240274505A1
公开(公告)日：2024-08-15
申请号：US18330233
申请日：2023-06-06
发明人： Shuai-Lin LIU , Nai-Hao KAO , Yu-Po WANG
IPC分类号： H01L23/433 , H01L21/56 , H01L23/00 , H01L25/065 , H01L25/16
CPC分类号： H01L23/4334 , H01L21/561 , H01L21/568 , H01L24/19 , H01L24/20 , H01L25/0655 , H01L25/16 , H01L24/32 , H01L2224/19 , H01L2224/211 , H01L2224/214 , H01L2224/215 , H01L2224/32225 , H01L2924/01029
摘要： An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in an encapsulation layer, and a circuit structure is disposed on the encapsulation layer and electrically connected to the first electronic element and the second electronic element. The circuit structure has a hollow area corresponding to the first electronic element, and a heat dissipation structure is disposed in the hollow area to thermally connect the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation structure, so as to avoid the problem of affecting the operation of the second electronic element due to the overheating of the encapsulation layer.
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公开(公告)号：US20240266197A1
公开(公告)日：2024-08-08
申请号：US18323741
申请日：2023-05-25
发明人： Tang-Hsin KUO , Chin-Chih HSIAO , Hung-Wen CHIEN , I HSU
IPC分类号： H01L21/677 , H01L21/67 , H01L21/687
CPC分类号： H01L21/6773 , H01L21/67173 , H01L21/67196 , H01L21/67769 , H01L21/67778 , H01L21/68707
摘要： A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.
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6.发明授权公开(公告)号：US12014967B2
公开(公告)日：2024-06-18
申请号：US18215113
申请日：2023-06-27
发明人： Ho-Chuan Lin , Min-Han Chuang , Chia-Chu Lai
IPC分类号： H01L23/31 , H01L21/56 , H01L23/00 , H01L23/528
CPC分类号： H01L23/3107 , H01L21/56 , H01L23/5286 , H01L24/11 , H01L24/14 , H01L24/43 , H01L24/45
摘要： An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
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公开(公告)号：US12009340B2
公开(公告)日：2024-06-11
申请号：US17481610
申请日：2021-09-22
发明人： Lung-Yuan Wang , Feng Kao , Mao-Hua Yeh
IPC分类号： H01L25/065 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/00 , H01L25/16
CPC分类号： H01L25/0652 , H01L21/4853 , H01L21/56 , H01L23/3121 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L25/16 , H01L25/50
摘要： An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
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公开(公告)号：US20240162101A1
公开(公告)日：2024-05-16
申请号：US18190344
申请日：2023-03-27
发明人： Yung-Ta LI
CPC分类号： H01L23/16 , H01L21/568 , H01L23/3128 , H01L23/3185 , H01L24/19 , H01L24/20 , H01L25/16 , H01L21/561 , H01L24/95 , H01L2224/19 , H01L2224/211 , H01L2224/214 , H01L2224/95001
摘要： An electronic package includes a first electronic element and a dummy die embedded in an encapsulation layer, where the dummy die is used to prevent a warpage caused by the mismatch of coefficient of thermal expansion (CTE) between the encapsulation layer and the first electronic element in the manufacturing process of large full-panel.
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公开(公告)号：US20240145908A1
公开(公告)日：2024-05-02
申请号：US18146924
申请日：2022-12-27
发明人： Yi-Chun LAI , Hsuan-Jen WANG , Rung-Jeng LIN
IPC分类号： H01Q1/38
摘要： An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, and an antenna structure is stacked on the carrier structure via conductors, where at least one through hole is formed on and penetrating through the antenna structure, and an insulating support body is formed between the carrier structure and the antenna structure, so that the insulating support body is correspondingly formed at the through hole and/or an edge of the antenna structure, and the through hole is free from being filled up by the insulating support body, such that the through hole has an air medium. The design of the through hole allows the characteristic of the dielectric constant of air being 1 to be utilized so as to reduce the signal loss and the signal offset, thereby facilitating the signal transmission of the antenna body.
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公开(公告)号：US11973047B2
公开(公告)日：2024-04-30
申请号：US17102841
申请日：2020-11-24
发明人： Feng Kao , Lung-Yuan Wang
CPC分类号： H01L24/17 , H01L21/56 , H01L23/3157 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/13005 , H01L2224/13083 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/24227 , H01L2224/73209 , H01L2224/92124
摘要： An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.
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