摘要:
A mold for use in molding a surface of a component is formed from separate building blocks that are assembled together so that mold surface segments associated with each of the building blocks line up to form one contiguous mold surface that corresponds with the shape of the mold. The building blocks can be formed to have integral formations for connecting them together. The building blocks can be formed by modeling the contiguous mold surface, dividing this first mold model into sections which define discrete building block models, and then forming each building block separately based on the discrete building block models. For instance, the individual block models can be assigned to different additive manufacturing machines and then later be assembled together at a final location.
摘要:
Provided are a molding method for efficiently and accurately performing molding of a layered component made of a thermosetting resin by a simple mechanism, and molded articles. For this purpose, primary molding for molding a plurality of divided bodies and secondary molding for joining the plurality of divided bodies with one another are performed sequentially.
摘要:
A method of making hollow microneedle arrays is described. Also described are the articles therefrom and the use of the articles in applications such as delivering fluid to and/or extracting body fluid from a subject.
摘要:
A press molding system (1) may include a first press molding apparatus (2) and a second press molding apparatus (3). When a material (M3) molded by the first press molding apparatus (2) is conveyed to the second press molding apparatus (3), an orientation of the material may be changed simultaneously with the conveyance from an orientation taken when conveyed out of the first press molding apparatus (2) to a desired orientation for the second press molding apparatus (3).
摘要:
A mold for manufacturing hemispherical sections for a golf ball includes a first mold plate including a first cavity, a second mold plate including a second cavity, and a midplate. The midplate includes an indentation on a first side of the midplate and a projection on a second side of the midplate. The indentation of the midplate corresponds to the first cavity of the first mold plate. The projection of the midplate corresponds to the second cavity of the second mold plate.
摘要:
The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.
摘要:
Various embodiments of the present invention provide systems and methods for manufacturing crumb rubber products. In various embodiments, the product being manufactured is a floor mat, which may be a decorative floor mat or fatigue floor mat used in industrial applications. In various embodiments, a crumb rubber and binder mixture is dispensed into a pan and leveled within the pan using a vibratory leveling operation. A die release may then be applied and the pan conveyed into a press. The press may be equipped with an upper die, which is compressed against the crumb rubber in the pan. The press applies both heat and pressure to activate the binder, which bonds the crumb rubber granules together to form a cohesive mat.
摘要:
In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要:
A process of making a casting includes the steps of designing a mold (1010), fabricating the layers (or laminations) of the mold (1020), stacking and assembling the laminations into a mold (1030), producing a casting (1060) and demolding the casting (1070). If necessary, a derived mold can be made (1040, 1050) prior to producing the casing (1060).
摘要:
A flow molding apparatus with multiple layers of molds and electrodes is disclosed. In an exemplary embodiment, the apparatus includes top and bottom electrodes with an intermediate electrode positioned therebetween. A first mold is disposed between the top electrode and the intermediate electrode, and a second mold is disposed between the bottom electrode and the intermediate electrode. Preferably, a plurality of metallic locking fixtures are attached to the top and bottom electrodes for securing the apparatus in a closed position. An electromagnetic energy source is operably connected to the electrodes such that the top and bottom electrodes are grounded and the intermediate electrode carries a high voltage. As such, an alternating electric field may be established across each of the first and second molds during a heating cycle.