公开(公告)号：US09842480B2

公开(公告)日：2017-12-12

申请号：US14807385

申请日：2015-07-23

申请人： FUJI ELECTRIC CO., LTD.

发明人： Noriho Terasawa ,  Yasuyuki Momose

IPC分类号： G08B19/00 ,  H02M1/32 ,  H03K7/08 ,  H03K17/082 ,  H03K17/18 ,  H02M7/5387

CPC分类号： G08B19/00 ,  H02M1/32 ,  H02M7/5387 ,  H03K7/08 ,  H03K17/0828 ,  H03K17/18

摘要： An alarm processing circuit includes a plurality of abnormality detection circuits for detecting different abnormalities and outputting alarm signals respectively; a signal conversion circuit for converting the alarm signals outputted from the plurality of abnormality detection circuits into time signals with time widths corresponding to types of the abnormalities respectively; and a determination circuit for determining the types of the abnormalities respectively based on the time widths of the time signals outputted from the signal conversion circuit.

公开(公告)号：US09165852B2

公开(公告)日：2015-10-20

申请号：US14349023

申请日：2012-09-18

申请人： FUJI ELECTRIC CO., LTD.

发明人： Noriho Terasawa ,  Yasuyuki Momose

IPC分类号： H01L23/12 ,  H01L23/34 ,  H05K1/02 ,  H05K3/36 ,  H05K7/14 ,  H05K7/02 ,  H01L23/049 ,  H01L23/00 ,  H01L25/07 ,  H01L23/36 ,  H01L23/373

CPC分类号： H01L23/34 ,  H01L23/049 ,  H01L23/36 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K3/368 ,  H05K7/02 ,  H05K7/142 ,  H05K7/1432 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2201/2072 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.

摘要翻译： 一种用于印刷电路板的安装结构，包括固定有重材料的印刷电路板; 固定件，紧固在重材料正下方的印刷电路板上; 以及固定到主体的接收构件。 固定构件的底部设置在接收构件中，并通过树脂粘合剂固定到接收构件。

公开(公告)号：US09768763B2

公开(公告)日：2017-09-19

申请号：US14985091

申请日：2015-12-30

申请人： FUJI ELECTRIC CO., LTD.

发明人： Noriho Terasawa ,  Yasuyuki Momose

IPC分类号： H02H3/00 ,  H03K17/082 ,  H02H3/16 ,  H03K17/18 ,  H03K19/173 ,  H02H3/08 ,  H02H9/02 ,  H03K17/08

CPC分类号： H03K17/082 ,  H02H3/08 ,  H02H3/16 ,  H02H9/02 ,  H03K17/0828 ,  H03K17/18 ,  H03K19/1732 ,  H03K2017/0806

摘要： An IGBT provided on the high voltage side uses the sensing function of the IGBT to detect a current and prevents the IGBT from breaking due to an overcurrent through a gate drive unit when the current detected by the short-circuit protection unit is determined to be an overcurrent. When detecting an overcurrent, the short-circuit protection unit outputs an alarm signal to a composition unit. Also, it detects the temperature of the power semiconductor module by using a temperature detection element, converts the detected temperature into a digital signal in the temperature information generating unit, and outputs the digitized temperature information to the composition unit. The composition unit composites the temperature information and the alarm signal and one resultant composite output is transmitted to a control unit on the low voltage side.

公开(公告)号：US20140233188A1

公开(公告)日：2014-08-21

申请号：US14349023

申请日：2012-09-18

申请人： FUJI ELECTRIC CO., LTD.,

发明人： Noriho Terasawa ,  Yasuyuki Momose

IPC分类号： H01L23/34 ,  H05K7/02

CPC分类号： H01L23/34 ,  H01L23/049 ,  H01L23/36 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K3/368 ,  H05K7/02 ,  H05K7/142 ,  H05K7/1432 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2201/2072 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.

摘要翻译： 一种用于印刷电路板的安装结构，包括固定有重材料的印刷电路板; 固定件，紧固在重材料正下方的印刷电路板上; 以及固定到主体的接收构件。 固定构件的底部设置在接收构件中，并通过树脂粘合剂固定到接收构件。

公开(公告)号：US09653379B2

公开(公告)日：2017-05-16

申请号：US15066382

申请日：2016-03-10

申请人： FUJI ELECTRIC CO., LTD.

发明人： Takahiro Koyama ,  Noriho Terasawa

IPC分类号： H01L23/48 ,  H01L23/34 ,  F28F7/00 ,  F28D15/00 ,  F28F27/00 ,  H01L23/473 ,  H01L23/367 ,  H05K7/20 ,  F28F3/02 ,  F28F3/12 ,  F28F3/04 ,  F28F27/02 ,  F28F13/12 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/373

CPC分类号： H01L23/473 ,  F28D15/00 ,  F28F3/02 ,  F28F3/022 ,  F28F3/048 ,  F28F3/12 ,  F28F13/12 ,  F28F27/02 ,  F28F2255/04 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49838 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.