公开(公告)号：US09589938B2

公开(公告)日：2017-03-07

申请号：US14981171

申请日：2015-12-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L23/31 ,  H01L23/538 ,  H01L23/12 ,  H01L25/10 ,  H01L25/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/56 ,  H01L23/50

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

摘要翻译： 本公开的实施例包括其形成装置及其方法。 一个实施例是一种器件，其包括在衬底的第一侧上的阻焊剂涂层，通过第一连接器接合到衬底的第一侧的管芯的有源表面以及通过第二组安装到管芯的表面安装器件 的表面安装器件位于管芯和衬底的第一侧之间，表面安装器件与阻焊涂层间隔开。

公开(公告)号：US20160079171A1

公开(公告)日：2016-03-17

申请号：US14949006

申请日：2015-11-23

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Der-Chyang Yeh ,  Hsien-Wei Chen ,  Ming-Yen Chiu ,  Ying-Ju Chen

IPC分类号： H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/13 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.

公开(公告)号：US09461020B2

公开(公告)日：2016-10-04

申请号：US14949006

申请日：2015-11-23

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Der-Chyang Yeh ,  Hsien-Wei Chen ,  Ming-Yen Chiu ,  Ying-Ju Chen

IPC分类号： H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L23/12 ,  H01L25/10 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.

公开(公告)号：US20160133606A1

公开(公告)日：2016-05-12

申请号：US14981171

申请日：2015-12-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen

IPC分类号： H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

公开(公告)号：US20150228606A1

公开(公告)日：2015-08-13

申请号：US14180138

申请日：2014-02-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen

IPC分类号： H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

摘要翻译： 本公开的实施例包括其形成装置及其方法。 一个实施例是一种器件，其包括在衬底的第一侧上的阻焊剂涂层，通过第一连接器接合到衬底的第一侧的管芯的有源表面以及通过第二组安装到管芯的表面安装器件 的表面安装器件位于管芯和衬底的第一侧之间，表面安装器件与阻焊涂层间隔开。

公开(公告)号：US20150228580A1

公开(公告)日：2015-08-13

申请号：US14180084

申请日：2014-02-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen ,  Ming-Yen Chiu ,  Der-Chyang Yeh

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/12

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.

摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种半导体封装，其包括包括一个或多个管芯的第一封装，以及通过第一组连接器与第一封装的第一侧结合的封装衬底。 半导体封装还包括安装到第一封装的第一侧的表面安装器件，表面安装器件基本上由一个或多个无源器件组成。

公开(公告)号：US09224709B2

公开(公告)日：2015-12-29

申请号：US14180138

申请日：2014-02-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen

IPC分类号： H01L23/48 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

摘要翻译： 本公开的实施例包括其形成装置及其方法。 一个实施例是一种器件，其包括在衬底的第一侧上的阻焊剂涂层，通过第一连接器接合到衬底的第一侧的管芯的有源表面以及通过第二组安装到管芯的表面安装器件 的表面安装器件位于管芯和衬底的第一侧之间，表面安装器件与阻焊涂层间隔开。

公开(公告)号：US09196586B2

公开(公告)日：2015-11-24

申请号：US14180084

申请日：2014-02-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsien-Wei Chen ,  Ying-Ju Chen ,  Ming-Yen Chiu ,  Der-Chyang Yeh

IPC分类号： H01L23/02 ,  H01L23/538 ,  H01L23/12 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.

摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种半导体封装，其包括包括一个或多个管芯的第一封装，以及通过第一组连接器与第一封装的第一侧结合的封装衬底。 半导体封装还包括安装到第一封装的第一侧的表面安装器件，表面安装器件基本上由一个或多个无源器件组成。