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公开(公告)号：US08039959B2
公开(公告)日：2011-10-18
申请号：US11580750
申请日：2006-10-13
申请人： Masud Beroz
发明人： Masud Beroz
IPC分类号： H01L23/48
CPC分类号： H01L23/49805 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/40 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/02379 , H01L2224/04034 , H01L2224/04042 , H01L2224/05568 , H01L2224/05573 , H01L2224/06181 , H01L2224/06182 , H01L2224/131 , H01L2224/16145 , H01L2224/16238 , H01L2224/1703 , H01L2224/171 , H01L2224/2919 , H01L2224/32145 , H01L2224/401 , H01L2224/40145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48149 , H01L2224/48465 , H01L2224/73207 , H01L2224/73213 , H01L2224/73221 , H01L2224/73265 , H01L2224/73271 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2924/014
摘要： A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.
摘要翻译： 微电子连接部件包括具有第一表面，第二表面和外围边缘的基板。 第一和第二端子在基板的第一表面处露出。 引线接合焊盘在第一表面附近暴露于基板的周边边缘。 第一导电路径将第一端子耦合到引线接合焊盘。 接合引线延伸超过衬底的周缘。 第二导电路径将第二端子耦合到接合引线。
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公开(公告)号：US20170042053A1
公开(公告)日：2017-02-09
申请号：US15200890
申请日：2016-07-01
发明人： Shin SOYANO
CPC分类号： H05K7/026 , H01L23/3142 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/3701 , H01L2224/37011 , H01L2224/37599 , H01L2224/401 , H01L2224/40137 , H01L2224/40155 , H01L2224/40499 , H01L2224/48227 , H01L2224/48472 , H01L2224/83801 , H01L2224/84801 , H01L2224/9221 , H01L2224/92246 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15159 , H01L2924/15162 , H05K1/0263 , H05K1/0298 , H05K1/142 , H05K1/181 , H05K5/0004 , H05K5/0069 , H05K2201/049 , H05K2201/10166 , H05K2201/10174 , H05K2201/10363 , H05K2201/10522 , H01L2924/014 , H01L2224/45099 , H01L2924/00012 , H01L2224/83 , H01L2224/84 , H01L2224/37099
摘要： In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.
摘要翻译： 在半导体器件中，多层基板包括绝缘基板，具有设置在其上的第一半导体芯片的第一电路板和设置在其上的第二半导体芯片的第二电路板。 在半导体装置的多层基板上，包括调整各半导体芯片的位置的第一定位部的树脂板的板部夹在包括与第一半导体芯片连接的第一端子的第一跨接端子和 垂直于第一端子的第一板构件和第二跨接端子，其包括连接到第二半导体芯片的第二端子和垂直于第二端子的第二板构件。
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公开(公告)号：US20070108613A1
公开(公告)日：2007-05-17
申请号：US11580750
申请日：2006-10-13
申请人： Masud Beroz
发明人： Masud Beroz
IPC分类号： H01L23/48
CPC分类号： H01L23/49805 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/40 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/02379 , H01L2224/04034 , H01L2224/04042 , H01L2224/05568 , H01L2224/05573 , H01L2224/06181 , H01L2224/06182 , H01L2224/131 , H01L2224/16145 , H01L2224/16238 , H01L2224/1703 , H01L2224/171 , H01L2224/2919 , H01L2224/32145 , H01L2224/401 , H01L2224/40145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48149 , H01L2224/48465 , H01L2224/73207 , H01L2224/73213 , H01L2224/73221 , H01L2224/73265 , H01L2224/73271 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2924/014
摘要： A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.
摘要翻译： 微电子连接部件包括具有第一表面，第二表面和外围边缘的基板。 第一和第二端子在基板的第一表面处露出。 引线接合焊盘在第一表面附近暴露于基板的周边边缘。 第一导电路径将第一端子耦合到引线接合焊盘。 接合引线延伸超过衬底的周缘。 第二导电路径将第二端子耦合到接合引线。
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