公开(公告)号：US08207604B2

公开(公告)日：2012-06-26

申请号：US10985126

申请日：2004-11-10

申请人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

发明人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

IPC分类号： H01L23/485

CPC分类号： H01L23/13 ,  H01L21/4846 ,  H01L2924/0002 ,  H01R13/2414 ,  H01R13/2464 ,  H01L2924/00

摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.

摘要翻译： 微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

公开(公告)号：US20080296717A1

公开(公告)日：2008-12-04

申请号：US11809780

申请日：2007-06-01

申请人： Masud Beroz ,  Belgacem Haba ,  Michael J. Nystrom ,  Richard Dewitt Crisp ,  Giles Humpston

发明人： Masud Beroz ,  Belgacem Haba ,  Michael J. Nystrom ,  Richard Dewitt Crisp ,  Giles Humpston

IPC分类号： H01L31/0203 ,  H01L21/58 ,  H01L23/02

CPC分类号： H01L31/0203 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/81192 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45099 ,  H01L2224/81805 ,  H01L2224/05599

摘要： A lidded chip is provided which includes a chip having a major surface and a plurality of first chip contacts exposed at the major surface. A lid overlies the major surface. A chip carrier is disposed between the chip and the lid, the chip carrier having an inner surface confronting the major surface and an outer surface confronting the lid. A plurality of first carrier contacts of the chip carrier are conductively connected to the first chip contacts. A plurality of second carrier contacts extend upwardly at least partially through the openings in the lid.

摘要翻译： 提供了一种带芯的芯片，其包括具有主表面的芯片和在主表面处暴露的多个第一芯片触点。 盖子盖在主表面上。 芯片载体设置在芯片和盖之间，芯片载体具有面向主表面的内表面和面对盖的外表面。 芯片载体的多个第一载体触点导电地连接到第一芯片触点。 多个第二载体触点至少部分地向上延伸穿过盖中的开口。

公开(公告)号：US07453157B2

公开(公告)日：2008-11-18

申请号：US11140312

申请日：2005-05-27

申请人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.

摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱，其暴露在所述柔性基板的表面处并与所述微电子元件电互连，其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中，并且设置柔性层 在微电子元件的第一面和柔性基板之间，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料，由此封装模具材料覆盖在柔性基板的外部区域上。

公开(公告)号：US07361979B2

公开(公告)日：2008-04-22

申请号：US11025401

申请日：2004-12-29

申请人： Masud Beroz ,  Belgacem Haba

发明人： Masud Beroz ,  Belgacem Haba

IPC分类号： H01L23/02 ,  H05K1/00

CPC分类号： H01L23/49833 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2224/49109 ,  H05K1/112 ,  H05K3/4611 ,  H05K2201/09472

摘要： A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.

摘要翻译： 提供具有多个片材的基片。 每个片材具有包含多个导电区域的第一主表面和与第一主表面相对的第二主表面。 片材布置成使得片材的第一主表面面对另一片材的第二主表面。 每个片材的至少一个导电区域部分或全部暴露。 片材的至少一个导电区域被部分或完全覆盖，例如由另一片材的一个或多个导电区域覆盖。 还提供了一种用于形成这种基板的方法。

公开(公告)号：US20080029879A1

公开(公告)日：2008-02-07

申请号：US11711595

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

IPC分类号： H01L23/10 ,  H01L21/58

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

摘要翻译： 提供了带芯芯片封装，其中光电子器件芯片具有在芯片的表面处暴露在其上的微电子电路，其上安装有覆盖在光电子器件和微电子电路上的盖。 不透明的膜可以附着到盖子上以覆盖微电子电路，同时暴露光电子器件。 还提供了带盖的芯片封装，其中盖子覆盖安装在芯片上的有源或无源器件。 接线迹线可以嵌入在盖子和芯片之间的粘合剂中。

公开(公告)号：US20070105346A1

公开(公告)日：2007-05-10

申请号：US11588438

申请日：2006-10-26

申请人： Masud Beroz ,  Belgacem Haba

发明人： Masud Beroz ,  Belgacem Haba

IPC分类号： H01L21/00

CPC分类号： H01L23/49572 ,  H01L23/4822 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/1302 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012

摘要： A method of expanding the contact pitch for un-diced chips in an array by pre-slicing the array in a first direction, attaching a lead frame to the chips' contacts, and then slicing the array and attached lead frame in the second direction. The lead frame has leads mechanically connected one another such that slicing the frame in the second direction along the mechanical connections separates the leads. Each lead has a first terminal which is conductively attached to a chip contact and a second terminal extending beyond the boundaries of the chip to which the first terminal is attached. In this manner, the contact pitch is effectively expanded to the terminal pitch of the leads.

摘要翻译： 一种通过在第一方向上预分割阵列来扩展阵列中未切割的芯片的接触间距的方法，将引线框架附接到芯片的触点，然后在第二方向上对阵列和附接的引线框进行切片。 引线框架具有彼此机械连接的引线，使得沿着机械连接沿第二方向切割框架将引线分开。 每个引线具有导电地连接到芯片触点的第一端子和延伸超过与第一端子连接的芯片的边界的第二端子。 以这种方式，接触间距有效地扩展到引线的端子间距。

公开(公告)号：US07176506B2

公开(公告)日：2007-02-13

申请号：US10746810

申请日：2003-12-24

申请人： Masud Beroz ,  Michael Warner ,  Lee Smith ,  Glenn Urbish ,  Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

发明人： Masud Beroz ,  Michael Warner ,  Lee Smith ,  Glenn Urbish ,  Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

IPC分类号： H01L27/148

CPC分类号： G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

摘要翻译： 射频芯片封装通过将诸如电路板的连接元件或其上具有芯片的柔性电路带与诸如引入框架的底部平面元件组合而形成，该引线框架包括大的导热板，并且从该平面 盘子。 组装步骤将芯片的后表面放置在连接元件的底侧，与导热体接近，并将连接元件上的导电迹线与导线连接。 所得的组件被封装，导致引线的底端处的端子被暴露。 封装的组件可以表面安装到电路板。 引线在连接元件和电路板之间提供牢固的电连接。

公开(公告)号：US07176043B2

公开(公告)日：2007-02-13

申请号：US11014439

申请日：2004-12-16

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L21/66

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

摘要翻译： 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

公开(公告)号：US07152311B2

公开(公告)日：2006-12-26

申请号：US10032886

申请日：2001-12-26

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B23P19/04

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

IPC分类号： H01L21/00

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

摘要翻译： 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸 在顶面和底面之间，与第一微电子元件上的触点对齐。 组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。 组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接， 电介质层的顶表面与第二微电子元件的第一表面间隔开。