公开(公告)号：US11069557B2

公开(公告)日：2021-07-20

申请号：US16553503

申请日：2019-08-28

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo

IPC分类号： B32B43/00 ,  H01L21/683 ,  C09J147/00 ,  B32B38/10

摘要： A method for producing a thin wafer includes: separating the support body from the laminate by irradiating a wafer laminate, which includes a support body, an adhesive layer formed on the support body, and a wafer laminated with a surface thereof including a circuit plane facing the adhesive layer, with light from a side of the support body of the wafer laminate; and after separating, removing a resin layer remaining on the wafer from the wafer by peeling, wherein the adhesive layer includes only a resin layer A with a light-blocking property, and a resin layer B including a thermosetting silicone resin or a non-silicone thermoplastic resin in this order from the side of the support body.

公开(公告)号：US10796939B2

公开(公告)日：2020-10-06

申请号：US15991533

申请日：2018-05-29

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Masahito Tanabe ,  Michihiro Sugo ,  Kazunori Kondo ,  Hiroyuki Yasuda

IPC分类号： H01L21/683 ,  C09J183/04 ,  C09J7/10 ,  C09J5/06 ,  C08G77/20 ,  C08G77/12

摘要： A temporary adhesive film roll for substrate processing, includes: a roll axis and a composite film-shaped temporary-adhesive material for temporarily bonding a substrate to a support, the composite film-shaped temporary-adhesive material being rolled up around the roll axis; wherein the composite film-shaped temporary-adhesive material includes a first temporary adhesive layer composed of a thermoplastic resin, a second temporary adhesive layer composed of a thermosetting resin, and a third temporary adhesive layer composed of a thermosetting resin which is different from that of the second temporary adhesive layer. The temporary adhesive film roll for substrate processing is capable of giving a temporary adhesive material which facilitates temporary adhesion between a substrate and a support, rapidly forms a temporary adhesive material layer on a substrate or a support, has excellent resistance to a thermal process such as chemical vapor deposition, and is easily separated to improve the productivity of thin wafers.

公开(公告)号：US10373903B2

公开(公告)日：2019-08-06

申请号：US15928301

申请日：2018-03-22

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato ,  Kazunori Kondo

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  C08G8/04 ,  C09D161/12 ,  H01L21/48 ,  C08L63/00 ,  C23C14/34 ,  C25D3/38 ,  C23C14/20

摘要： A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

公开(公告)号：US10242902B2

公开(公告)日：2019-03-26

申请号：US15122493

申请日：2015-03-03

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Michihiro Sugo ,  Hiroyuki Yasuda ,  Shohei Tagami ,  Masahito Tanabe

IPC分类号： H01L21/683 ,  C09J7/30 ,  C09J7/40 ,  C09J7/20 ,  C09J7/50 ,  C09J183/04 ,  C08G77/20 ,  B32B27/08 ,  B32B27/28 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B27/18 ,  B32B27/26 ,  B32B37/12 ,  C08G77/12

摘要： A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.

公开(公告)号：US20180102333A1

公开(公告)日：2018-04-12

申请号：US15728846

申请日：2017-10-10

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato

IPC分类号： H01L23/00

CPC分类号： H01L24/04 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B17/064 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/28 ,  B32B27/283 ,  B32B37/02 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/0092 ,  B32B2037/1253 ,  B32B2037/1269 ,  B32B2038/0016 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2270/00 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/12 ,  B32B2457/14 ,  C08G77/50 ,  C08G77/52 ,  C08G77/70 ,  C08G77/80 ,  C09J163/00 ,  C09J183/10 ,  H01L21/6836 ,  H01L2221/68381 ,  H01L2221/68386

摘要： Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers.The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

公开(公告)号：US20170154802A1

公开(公告)日：2017-06-01

申请号：US15360418

申请日：2016-11-23

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato

IPC分类号： H01L21/683 ,  C09D183/14 ,  C09J183/14 ,  H01L23/00 ,  C09D165/00 ,  H01L21/304 ,  C09J5/00 ,  C09D5/32 ,  C09J165/00

CPC分类号： H01L21/6836 ,  C08G77/52 ,  C08K5/0025 ,  C08L63/00 ,  C09D5/32 ,  C09D165/00 ,  C09D183/14 ,  C09J5/00 ,  C09J165/00 ,  C09J183/14 ,  C09J2203/326 ,  H01L21/304 ,  H01L21/6835 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/13147 ,  H01L2924/0715 ,  H01L2924/0782 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2924/3512

摘要： A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

公开(公告)号：US09263333B2

公开(公告)日：2016-02-16

申请号：US14060234

申请日：2013-10-22

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Michihiro Sugo ,  Hideto Kato ,  Shohei Tagami ,  Hiroyuki Yasuda ,  Masahito Tanabe

IPC分类号： H01L21/30 ,  H01L21/78 ,  H01L21/18 ,  H01L21/683

CPC分类号： H01L21/78 ,  C08G77/16 ,  C09J7/10 ,  C09J183/04 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2483/00 ,  H01L21/187 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/1457

摘要： A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer.

摘要翻译： 晶片处理层压体，晶片处理部件，晶片处理用临时粘接材料以及薄晶片的制造方法，有利于临时粘接晶片和支持体，能够形成均匀厚度的层 并且与TSV形成和晶片背面互连形成步骤兼容，并且晶片处理层叠体包括支撑体，在其上形成的临时粘合材料层和层叠在临时粘合材料层上的晶片，其中晶片 具有电路形成前表面和待加工的后表面，其中临时粘合材料层包括三层结构复合临时粘合材料层。

公开(公告)号：US10453732B2

公开(公告)日：2019-10-22

申请号：US15360418

申请日：2016-11-23

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L23/00 ,  C09J165/00 ,  C09J183/14 ,  C09D5/32 ,  C09D165/00 ,  C09D183/14 ,  C09J5/00 ,  C08G77/52 ,  C08K5/00 ,  C08L63/00

摘要： A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

公开(公告)号：US10297485B2

公开(公告)日：2019-05-21

申请号：US15928305

申请日：2018-03-22

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato ,  Kazunori Kondo

IPC分类号： H01L23/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  C09J161/06 ,  H01L21/56

摘要： A semiconductor device is provided comprising a support, an adhesive resin layer, an insulating layer, a redistribution layer, a chip layer, and a mold resin layer. The adhesive resin layer consists of a resin layer (A) comprising a photo-decomposable resin containing a fused ring in its main chain and a resin layer (B) comprising a non-silicone base thermoplastic resin and having a storage elastic modulus E′ of 1-500 MPa at 25° C. and a tensile break strength of 5-50 MPa. The semiconductor device is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

公开(公告)号：US20180277472A1

公开(公告)日：2018-09-27

申请号：US15928301

申请日：2018-03-22

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato ,  Kazunori Kondo

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L21/683 ,  C08G8/04 ,  C09D161/12

CPC分类号： H01L23/49838 ,  C08G8/04 ,  C08L63/00 ,  C09D161/12 ,  C23C14/205 ,  C23C14/34 ,  C25D3/38 ,  H01L21/4846 ,  H01L21/683 ,  H01L21/6835 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/50 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/82005 ,  H01L2924/00

摘要： A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.