公开(公告)号：US20030183418A1

公开(公告)日：2003-10-02

申请号：US10457129

申请日：2003-06-09

发明人： Abram M. Castro ,  Bernardo Gallegos ,  Gary Lee Engvall

IPC分类号： H01L023/34 ,  H01L023/42 ,  H05K001/16

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15173 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/061 ,  H05K2203/066 ,  H01L2924/00

摘要： A circuit board according to the invention is made from two or more laminates each made of a fusible dielectric material, which laminates are bonded to each other along respective inner faces thereof. Each such laminate is preferably a pre-preg sheet containing both a heat-fusible resin and a reinforcing fiber filler to provide the desired stiffness and strength. A number of first electrical contacts are exposed on an outer face of the first laminate, and second electrical contacts are exposed on an outer face of the second laminate. The circuit board further includes a plurality of electrical conductors each running from a first contact to a second contact, the conductors including elongated conductive lines extending along one of the first or second laminates, and vias extending through the first and second laminates which have been filled with an electrically conductive via filler.

公开(公告)号：US20030109083A1

公开(公告)日：2003-06-12

申请号：US10266848

申请日：2002-10-07

发明人： Syed Sajid Ahmad

IPC分类号： H01L023/42

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/06136 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/45015 ,  H01L2924/207

摘要： Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. In one aspect of the invention, an interconnecting substrate comprises a first external layer having a first external surface, a second external layer having a second external surface, and a conductive core between the first and second external layers. The conductive core can have at least a first conductive stratum between the first and second external layers, and a dielectric layer between the first conductive stratum and one of the first or second external layers. The conductive core can also include a second conductive stratum such that the first conductive stratum is on a first surface of the dielectric layer and the second conductive stratum is on a second surface of the dielectric layer. The interconnecting substrate also has at least one vent through at least one of the first conductive stratum, the second conductive stratum, and/or the dielectric layer. The vent is configured to direct moisture away from the dielectric layer, and thus the vent can be a moisture release element that allows moisture to escape from the dielectric layer during high temperature processing.

公开(公告)号：US20040000712A1

公开(公告)日：2004-01-01

申请号：US10184690

申请日：2002-06-28

申请人： Lord Corporation

发明人： Mark B. Wilson ,  James H. Hogan ,  Michael L. Owen

IPC分类号： H01L023/42

CPC分类号： C09J9/02 ,  C08G59/54 ,  C08K3/08 ,  C08L63/00 ,  C08L2666/54 ,  C09J163/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

摘要翻译： 本发明是基于用于集成电路封装的环氧树脂的热成型，96-100％固体，热固性，银填充的热界面的导热的热接合模组件和导电热导体。 将粘合剂放置在模具和盖子，盖子和散热器和/或模具和散热器之间。 界面粘合剂组合物包含无机组分和有机组分。 包含导热填料的无机组分的含量为70重量％，重量百分比为85重量％，有机组分为60至70重量％。 ％的双酚化合物的二缩水甘油醚，4〜30重量％ ％的无环脂族或脂环族或单核芳族二癸二醇醚，3至30％的单官能环氧化合物和20-30％的聚胺酐加合物。

公开(公告)号：US20020070445A1

公开(公告)日：2002-06-13

申请号：US09734552

申请日：2000-12-13

申请人： Advanced Micro Devices, Inc.

发明人： Thomas S. Tarter

IPC分类号： H01L023/42

CPC分类号： H01L23/433 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15312 ,  H01L2224/0401

摘要： An enveloped thermal interface servers as a heat-conducting spacer between a heat dissipating member and an electronic package or device. Embodiments of the present invention include a member comprising a hermetically sealed thermal interface. A conformable metallic envelope containing a heat-conducting matrix, such as a eutectic alloy having a melting point below the normal operating temperature of the packaged device.

摘要翻译： 封装的热接口服务器作为散热构件和电子封装或器件之间的导热间隔件。 本发明的实施例包括包括密封的热界面的构件。 包含导热基体的适形金属外壳，例如熔点低于封装器件正常工作温度的共熔合金。