公开(公告)号：US10577704B2

公开(公告)日：2020-03-03

申请号：US15738398

申请日：2016-06-01

申请人： METALOR TECHNOLOGIES CORPORATION

发明人： Masato Furukawa

IPC分类号： C25D3/48 ,  C25D3/62

摘要： Electrolytic hard gold plating solution substitution inhibitors containing at least one compound selected from the group consisting of an imidazole compound having a mercapto group, a triazole compound having a mercapto group, and an aliphatic compound having a sulfonic acid group and a mercapto group are provided. Electrolytic hard gold plating solutions containing at least one electrolytic hard gold plating solution substitution inhibitor, a gold salt, a soluble cobalt salt and/or a soluble nickel salt, an organic acid conducting salt, and a chelating agent are also provided.

公开(公告)号：US20180320283A1

公开(公告)日：2018-11-08

申请号：US16038662

申请日：2018-07-18

申请人： The Swatch Group Research and Development Ltd

发明人： Thomas FROELICHER ,  Christophe HENZIROHS ,  Guido PLANKERT

IPC分类号： C25D3/62

CPC分类号： C25D3/62

摘要： A method for the galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, the alloy metals being copper metal and silver metal allowing a mirror-bright yellow gold alloy to be deposited on the electrode characterized in that the bath respects a proportion of 21.53% gold, 78.31% copper and 0.16% silver.

公开(公告)号：US20180171499A1

公开(公告)日：2018-06-21

申请号：US15898330

申请日：2018-02-16

申请人： The Swatch Group Research and Development Ltd.

发明人： Christophe HENZIROHS ,  Guido Plankert

IPC分类号： C25D3/62

CPC分类号： C25D3/62 ,  B05D1/18 ,  C25D3/56 ,  C25D3/58 ,  C25D7/005

摘要： A method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.

公开(公告)号：US09867293B1

公开(公告)日：2018-01-09

申请号：US15474466

申请日：2017-03-30

申请人： Jerry T. Fang

发明人： Jerry T. Fang

IPC分类号： H05K3/18 ,  C25D5/02 ,  H05K3/00 ,  C25D3/62 ,  C25D7/12 ,  C25D17/00 ,  C22C5/02

CPC分类号： H05K3/188 ,  C22C5/02 ,  C25D3/62 ,  C25D5/022 ,  C25D7/123 ,  C25D17/007 ,  H05K3/0073 ,  H05K2203/0723

摘要： A method of controlling alloy composition of deposited gold-tin alloy during electroplating of a large panel includes masking at least one planar surface of the panel with conductive material applied in a predetermined pattern. The masked panel is located at least partially within an electroplating solution including a gold-tin alloy in solution at a predetermined gold:tin ratio. Electrical current applied to the masked panel is conducted across the planar surface via the conductive material to induce a predetermined electrical current distribution across the planar surface and thereby pull gold ions and tin ions from the electroplating solution. The pulled ions are deposited upon a supermajority of an unmasked area of the masked panel. The predetermined pattern is selected to achieve deposition of the gold-tin alloy with substantially uniform alloy composition, directly corresponding to the predetermined gold:tin ratio, across the supermajority of the unmasked area of the masked panel.

公开(公告)号：US20170299542A1

公开(公告)日：2017-10-19

申请号：US15641184

申请日：2017-07-03

申请人： Mahmoud Amouzadeh Tabrizi ,  Mojtaba Shamsipur ,  Reza Saber ,  Saeed Sarkar

发明人： Mahmoud Amouzadeh Tabrizi ,  Mojtaba Shamsipur ,  Reza Saber ,  Saeed Sarkar

IPC分类号： G01N27/404 ,  G01N27/30 ,  C25D5/48 ,  G01N33/00 ,  C25D3/62

CPC分类号： G01N27/4045 ,  C25D3/62 ,  C25D5/48 ,  C25D7/00 ,  G01N27/301 ,  G01N27/413 ,  G01N33/0052

摘要： An electrochemical chlorine gas sensor is disclosed with a working electrode, a counter electrode, and a reference electrode. The working electrode may be coated with a nanoporous gold layer, a first solution comprising an ionic liquid, and a second solution that may be selected from a Nation solution, a chitosan solution, an agar solution, or combinations thereof. The reference and counter electrodes may be further coated with the ionic liquid.

公开(公告)号：US20170292200A1

公开(公告)日：2017-10-12

申请号：US15472620

申请日：2017-03-29

申请人： Katsunori Hayashi

发明人： Katsunori Hayashi

IPC分类号： C25D3/62 ,  C22C5/02 ,  C25D7/12

CPC分类号： C25D3/62 ,  C22C5/02 ,  C25D7/12

摘要： The present invention provides a non-cyanide based Au—Sn alloy plating solution capable of performing a Au—Sn alloy plating treatment by a plating solution composition that is neutral and does not contain cyanide. In the present invention, a non-cyanide soluble gold salt, a Sn compound composed of tetravalent Sn, and a thiocarboxylic acid-based compound are contained. The non-cyanide based Au—Sn alloy plating solution of the present invention can further contain sugar alcohols, and, in addition, can further contain a dithioalkyl compound.

公开(公告)号：US09788438B2

公开(公告)日：2017-10-10

申请号：US14368210

申请日：2012-12-12

申请人： LG INNOTEK CO., LTD.

发明人： Seol Hee Lim ,  Yun Kyoung Jo ,  Ae Rim Kim ,  Sai Ran Eom ,  Chang Hwa Park

IPC分类号： H01R9/00 ,  H05K3/30 ,  H05K1/11 ,  H05K3/24 ,  C25D3/12 ,  C25D3/16 ,  C25D3/48 ,  C25D3/50 ,  C25D3/56 ,  C25D3/62 ,  C25D5/12 ,  H05K1/09 ,  H05K1/18 ,  H05K3/18 ,  C23C18/16

CPC分类号： H05K3/301 ,  C23C18/1653 ,  C25D3/12 ,  C25D3/16 ,  C25D3/48 ,  C25D3/50 ,  C25D3/562 ,  C25D3/567 ,  C25D3/62 ,  C25D5/12 ,  H05K1/092 ,  H05K1/117 ,  H05K1/18 ,  H05K3/185 ,  H05K3/244 ,  H05K2201/10159 ,  H05K2201/10909 ,  H05K2203/049 ,  H05K2203/1572 ,  Y10T29/49128

摘要： The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

公开(公告)号：US09212429B2

公开(公告)日：2015-12-15

申请号：US13301942

申请日：2011-11-22

申请人： Koichi Yomogida ,  Makoto Kondo

发明人： Koichi Yomogida ,  Makoto Kondo

IPC分类号： C25D3/56 ,  C25D7/00 ,  C23C28/02 ,  C25D3/62

CPC分类号： C25D3/62

摘要： A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity.

摘要翻译： 公开了一种镀金液和电镀方法，其中金氰化物或其盐提供金源，钴化合物和至少含有含氮杂环化合物和表卤代醇的化合物的反应产物。 镀金液镀层具有较高的沉积选择性。

公开(公告)号：US08956523B2

公开(公告)日：2015-02-17

申请号：US13621285

申请日：2012-09-16

申请人： Erik Reddington ,  Gonzalo U. Desmaison ,  Zukra I. Niazimbetova ,  Donald E. Cleary ,  Mark Lefebvre

发明人： Erik Reddington ,  Gonzalo U. Desmaison ,  Zukra I. Niazimbetova ,  Donald E. Cleary ,  Mark Lefebvre

IPC分类号： C25D3/56 ,  C25D3/62 ,  C25D3/00 ,  C25D3/46

CPC分类号： C07C235/10

摘要： Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

摘要翻译： 公开了金属电镀组合物和方法。 金属电镀组合物提供良好的流平性能和抛光力。

公开(公告)号：US08608931B2

公开(公告)日：2013-12-17

申请号：US12887909

申请日：2010-09-22

申请人： Wan Zhang-Beglinger ,  Jonas Guebey ,  André Egli

发明人： Wan Zhang-Beglinger ,  Jonas Guebey ,  André Egli

IPC分类号： C25D3/62

CPC分类号： C25D3/62 ,  C25D3/48

摘要： Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

摘要翻译： 公开了一种防置换硬金组合物，用于抑制金属从镀有硬金的衬底上的位移。 反位移硬金组合物可用于用硬金定位板基材。