公开(公告)号：US11619423B2

公开(公告)日：2023-04-04

申请号：US15336663

申请日：2016-10-27

申请人： SAPHIRE SOLAR TECHNOLOGIES APS

发明人： Yakov Safir

IPC分类号： H02S20/22 ,  H02S40/42 ,  F24S20/69 ,  H02S40/38 ,  H02S20/26 ,  H02S20/23 ,  H02S40/44 ,  F24S80/65 ,  F24S20/67 ,  F24S10/75 ,  F24S80/52 ,  F24S25/61 ,  F24S10/50 ,  H01L31/054 ,  H01L31/0443 ,  H01L31/0203 ,  H01L31/0525 ,  H01L31/147 ,  H01L31/18

摘要： A solar module includes a plurality of photovoltaic cells and a sandwich structure on which the plurality of photovoltaic cells is structurally supported. The sandwich structure includes top and bottom structural plates and an open-cell inner material located between the top and bottom structural plates.

公开(公告)号：US11531351B2

公开(公告)日：2022-12-20

申请号：US16782476

申请日：2020-02-05

申请人： DENSO CORPORATION

发明人： Shunsuke Kimura

IPC分类号： G03F7/20 ,  G05D1/02 ,  G01S17/931 ,  G01S7/481 ,  G01S17/10 ,  G01S17/89 ,  H04N5/225 ,  H04N5/232 ,  H01L31/107 ,  H01L31/147 ,  H01L27/146 ,  G01S7/48 ,  H01L31/10

摘要： A light receiving element array includes one or more unit element blocks. Each of the unit element blocks includes different light receiving elements with different element structures.

公开(公告)号：US11057551B2

公开(公告)日：2021-07-06

申请号：US16365952

申请日：2019-03-27

申请人： CANON KABUSHIKI KAISHA

发明人： Yosuke Nishide ,  Yu Maehashi ,  Masahiro Kobayashi ,  Katsuyuki Hoshino ,  Akira Okita ,  Takeshi Ichikawa

IPC分类号： H04N5/222 ,  H04N5/225 ,  G06F1/16 ,  H01L31/0216 ,  H01L31/147 ,  H01L31/02 ,  H01L27/146 ,  H01L27/15 ,  H01L27/14 ,  H04N5/369 ,  H01L31/10 ,  H05B33/02 ,  G09F9/30 ,  H01L27/32 ,  H05B33/14 ,  H01L51/50 ,  H05B33/12 ,  H01L27/144

摘要： An image capturing and display apparatus comprises a plurality of photoelectric conversion elements for converting incident light from the outside of the image capturing and display apparatus to electrical charge signals, and a plurality of light-emitting elements for emitting light of an intensity corresponding to the electrical charge signals acquired by the plurality of photoelectric conversion elements. A pixel region is defined as a region in which the plurality of photoelectric conversion elements are arranged in an array. Signal paths for transmitting signals from the plurality of photoelectric conversion elements to the plurality of light-emitting elements lie within the pixel region.

公开(公告)号：US20190222733A1

公开(公告)日：2019-07-18

申请号：US16365952

申请日：2019-03-27

申请人： CANON KABUSHIKI KAISHA

发明人： Yosuke Nishide ,  Yu Maehashi ,  Masahiro Kobayashi ,  Katsuyuki Hoshino ,  Akira Okita ,  Takeshi Ichikawa

IPC分类号： H04N5/225 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/147 ,  G06F1/16

CPC分类号： H04N5/2257 ,  G06F1/163 ,  G09F9/30 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L27/15 ,  H01L27/32 ,  H01L31/02019 ,  H01L31/02164 ,  H01L31/10 ,  H01L31/147 ,  H01L51/50 ,  H04N5/2256 ,  H04N5/369 ,  H05B33/02 ,  H05B33/12 ,  H05B33/14

摘要： An image capturing and display apparatus comprises a plurality of photoelectric conversion elements for converting incident light from the outside of the image capturing and display apparatus to electrical charge signals, and a plurality of light-emitting elements for emitting light of an intensity corresponding to the electrical charge signals acquired by the plurality of photoelectric conversion elements. A pixel region is defined as a region in which the plurality of photoelectric conversion elements are arranged in an array. Signal paths for transmitting signals from the plurality of photoelectric conversion elements to the plurality of light-emitting elements lie within the pixel region.

公开(公告)号：US20180288270A1

公开(公告)日：2018-10-04

申请号：US15938637

申请日：2018-03-28

申请人： CANON COMPONENTS, INC.

发明人： Toshihiko AMANO ,  Yoshihiro HATTORI

IPC分类号： H04N1/193 ,  H01L25/04 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/147

摘要： An image sensor unit includes multiple elongated-shaped sensor wiring boards provided with sensor chips that generate an electric signal in response to incident light. The sensor wiring boards are arranged such that end faces in the longitudinal direction face each other. A resin material is provided between the end faces of the sensor wiring boards that face each other.

公开(公告)号：US20180108802A1

公开(公告)日：2018-04-19

申请号：US15821797

申请日：2017-11-23

申请人： LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORPORATION

发明人： Hung-Jui Chen

IPC分类号： H01L31/167 ,  H01L31/0232 ,  H01L31/09 ,  G01V8/14 ,  G01S17/02 ,  H04N1/00 ,  H01L31/147

CPC分类号： H01L31/167 ,  G01S7/4813 ,  G01S7/4815 ,  G01S17/026 ,  G01V8/14 ,  G01V8/20 ,  G03G2215/00616 ,  H01L31/02327 ,  H01L31/09 ,  H01L31/147 ,  H04N1/00734

摘要： An optical sensor includes a substrate, light emitting units for emitting light with different wavelengths, and a photodetector. The substrate has at least one receiver for containing these light emitting units and a slot for containing the photodetector. A light guide structure of the optical sensor can be the receiver with a specific design, so that the light emitted by the light emitting units can be reflected towards a central axis of the photodetector. Thus, when at least one of the light emitting units emits light onto an object, the photodetector can receive the light reflected from the object.

公开(公告)号：US20180080827A1

公开(公告)日：2018-03-22

申请号：US15554006

申请日：2016-05-13

申请人： Hojun Yoon

发明人： Taek Kim

IPC分类号： G01J3/28 ,  H01L31/147 ,  G01J3/10 ,  G01J3/02 ,  H04N5/225 ,  H04N5/232 ,  G01J3/12

CPC分类号： G01J3/2823 ,  G01J3/0256 ,  G01J3/10 ,  G01J3/12 ,  G01J3/28 ,  G01J2003/104 ,  G01J2003/1213 ,  G01J2003/2826 ,  H01L31/028 ,  H01L31/02966 ,  H01L31/0304 ,  H01L31/03046 ,  H01L31/0312 ,  H01L31/0324 ,  H01L31/147 ,  H04N5/2257 ,  H04N5/23232 ,  H04N5/268

摘要： A hyperspectral camera apparatus is disclosed. The disclosed hyperspectral camera includes a plurality of semiconductor light sources to illuminate the subject with different wavelengths of light, an image sensor to acquire the image of the subject illuminated by the semiconductor light sources, and at least one optical filter provided in front of the image sensor to selectively transmit particular wavelengths of light onto the sensor.

公开(公告)号：US20170309771A1

公开(公告)日：2017-10-26

申请号：US15646533

申请日：2017-07-11

申请人： PIXART IMAGING INC.

发明人： CHI-CHIH SHEN

IPC分类号： H01L31/147 ,  H01L31/0216 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02 ,  A61B5/024 ,  G06K9/00 ,  A61B5/1455

摘要： An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.

公开(公告)号：US20170199343A1

公开(公告)日：2017-07-13

申请号：US15470978

申请日：2017-03-28

申请人： International Business Machines Corporation

发明人： SHIGERU NAKAGAWA ,  YOICHI TAIRA ,  MASAO TOKUNARI

IPC分类号： G02B6/42 ,  H01L31/147 ,  G02B6/132 ,  G02B6/12 ,  G02B6/43

CPC分类号： G02B6/4215 ,  G02B6/12007 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12109 ,  G02B2006/12173 ,  H01L31/147 ,  H04B10/40

摘要： An optical module includes: at least one optical waveguide provided on a surface of a substrate; a plurality of grooves provided in the optical waveguide on the surface of the substrate and having both a surface orthogonal to the surface of the substrate and an inclined surface; multiple pairs of light-emitting and light-receiving elements aligned with the plurality of grooves in the optical waveguide and provided so as to correspond to light of different wavelengths on the optical waveguide; and a plurality of light-selecting filters each provided on an inclined surface of the plurality of grooves in the optical waveguide and reflecting light of the wavelength corresponding to the light-emitting element in the respective pair of light-emitting and light-receiving elements towards the optical waveguide, and selectively reflecting light of the corresponding wavelength from the light propagating through the optical waveguide towards the corresponding pair of light-emitting and light-receiving elements.

公开(公告)号：US09431335B2

公开(公告)日：2016-08-30

申请号：US14559696

申请日：2014-12-03

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L23/48 ,  H01L21/3105 ,  H01L31/147 ,  H01L23/495 ,  H01L33/44 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49894 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/566 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A cylindrical molding compound supported RDL for IC package is disclosed wherein a central cavity is formed in the center of the molding compound. A plurality of metal pillar is embedded in the molding compound, a redistribution layer is configured on bottom of the plurality of metal pillar; at least one passive element such as a capacitor can be mounted in the central cavity. The bottom of the package is adaptive for at least one chip to mount so that the passive element is close to the chip and therefore simultaneous switching noise (SSN) can be reduced to a minimum at the initial first stage when a power is turned on.

摘要翻译： 公开了一种用于IC封装的圆柱形模塑复合物的RDL，其中在模塑料的中心形成中心腔。 多个金属柱嵌入模塑料中，在多个金属柱的底部配置再分配层; 诸如电容器的至少一个无源元件可以安装在中心腔中。 封装的底部适合于至少一个芯片来安装，使得无源元件靠近芯片，因此当电源接通时，在初始第一阶段同时开关噪声（SSN）可以降低到最小值。