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    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    2.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 审中-公开
    方向独立的设备配置和组装

    公开(公告)号：WO2015047757A1

    公开(公告)日：2015-04-02

    申请号：PCT/US2014/055480

    申请日：2014-09-12

    Applicant: OSRAM SYLVANIA INC.

    Inventor： HAMBY, David W. ,  SCOTCH, Adam M. ,  VENK, Sridharan ,  LENEF, Alan

    IPC: H01L25/16 ,  H01L33/00 ,  H05K1/11 ,  H05K3/30

    CPC classification number: H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电垫。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可被配置为与流体自组装（FSA）一起使用。 例如，装置壳体可以制造成具有在制造期间使装置达到中性浮力的凹穴。

    METHODS OF PRODUCING ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM
    4.
    发明申请
    METHODS OF PRODUCING ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM 审中-公开

    公开(公告)号：WO2014182773A3

    公开(公告)日：2014-11-13

    申请号：PCT/US2014/037082

    申请日：2014-05-07

    Applicant: OSRAM SYLVANIA INC.

    Inventor： VENK, Sridharan ,  SCOTCH, Adam ,  HAMBY, David

    IPC: H05K1/14 ,  H05K3/28 ,  H05K3/40 ,  H01L33/48 ,  H01L33/62 ,  H05K3/30 ,  H05K3/36

    Abstract: Described herein are methods of making electronic assemblies including a subassembly film. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

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