Abstract:
The invention includes pieces of ceramic armor, methods of joining a carbide with a metal-comprising piece, and methods of metallizing carbide-comprising surfaces. In one implementation, a method of joining a carbide with a metal-comprising piece includes providing a mixture comprising (a) and (b) over a carbide-comprising surface of a substrate, where (a) comprises at least one of niobium and titanium, and (b) comprises silicon. The mixture is heated over the carbide-comprising surface at least to the melting temperatures (a) and (b). The melted mixture is solidified into an adherent layer on the substrate. A metal-based joining material is provided over the adherent layer. Metal of a metal-comprising piece is welded to the substrate with the metal-based joining material.
Abstract:
A snap fit between a top cover (30) and a partition (28) of an air conditioner assembly (10) simplifies assembly and provides for disassembly during service and maintenance. The top cover (30) is secured to the partition (28) by a snap fit securement feature. The snap fit includes a tab (34) extending upward from the partition (28) that is received within an opening (32) within the top cover (30). The opening (32) is disposed in the top cover (30) and cooperates with a securement surface (40). The securement surface (40) is spaced a distance (54) apart from the opening (32). The distance between the securement surface (40) and the opening (32) provides for bending of the tab (34) away from the engagement surface (40) to release the top cover (30) from the partition (28).
Abstract:
A method of forming a tank (30). The method comprising the steps of: providing a cylinder (24) having a cylinder wall (26) and a first end (28), providing a first end cap (10) having a peripheral edge portion (16), and forming the edge portion (16) of the end cap (10) to create a shoulder (20) and a peripheral skirt (22). The skirt (22) depends from the shoulder (20) and has a smaller outer diameter than the inside diameter of the cylinder wall (26). The method also includes arranging the skirt (22) of the end cap (10) within the cylinder (24) such that the shoulder (20) of the end cap (10) sits on the first end (28) of the cylinder (24) and the skirt (22) extends axially within the cylinder (24) and welding the skirt (22) to the cylinder (24).
Abstract:
This invention is directed to a process for joining materials (20,40) comprising providing an assembly comprising at least one material layer; at least one metal heat source (30); and at least one solder layer (25 or 35), each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere (50); and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.
Abstract:
A novel orbital welder includes a body defining a tube passage, a weld tip, a light source disposed to emit light toward the tube passage such that the emitted light will impinge upon one or more tubes placed in the tube passage, a detector to detect the light emitted by the light source from the tube passage, a clamp adjacent the tube passage, and a control unit operative to close the clamp responsive to a signal from the detector. A method is also disclosed for automatically clamping tubes in an orbital welder when they are properly aligned. The method includes the steps of emitting light from the light source into the tube passage, monitoring the light from the tube passage with the detector, receiving a signal indicative of the position of the tube(s) based on the intensity of the detected light, and automatically closing a clamp depending on the signal from the detector.
Abstract:
Welding systems are presented, in which a single power source provides a first DC output to a plurality of digital waveform controlled chopper modules. Welding modules are also disclosed for converting an input DC signal to a welding signal, which are comprised of a down-chopper for providing a welding signal waveform according to a pulse width modulated switching signal, along with a digital waveform controller providing the switching signal according to a desired waveform.
Abstract:
There is described novel bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Abstract:
Solid state processing is performed on a workpiece (70) that operates alone or is a component of equipment used in various demanding, harsh and wearing environments in which failure of a product could compromise safety or the environment or otherwise result in significant cost for repair or replacement, wherein the solid state processing performed by using a tool capable of friction stir processing, friction stir mixing, or friction stir welding results in a workpiece that offers a longer life-cycle and/or improved performance and/or improved reliability as a result of the solid state processing.
Abstract:
A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.