公开(公告)号：WO2007109326A3

公开(公告)日：2008-07-17

申请号：PCT/US2007007029

申请日：2007-03-21

Applicant: PROMERUS LLC ,  APANIUS CHRIS ,  SHICK ROBERT A ,  NG HENDRA ,  BELL ANDREW ,  ZHANG WEI ,  NEAL PHIL

Inventor： APANIUS CHRIS ,  SHICK ROBERT A ,  NG HENDRA ,  BELL ANDREW ,  ZHANG WEI ,  NEAL PHIL

IPC: H01L21/98 ,  H01L25/065

CPC classification number: H01L24/29 ,  C08F32/00 ,  C08G64/0208 ,  C09D145/00 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599

Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

Abstract translation: 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：WO2007109326A2

公开(公告)日：2007-09-27

申请号：PCT/US2007/007029

申请日：2007-03-21

Applicant: PROMERUS LLC ,  APANIUS, Chris ,  SHICK, Robert, A. ,  NG, Hendra

Inventor： APANIUS, Chris ,  SHICK, Robert, A. ,  NG, Hendra

IPC: H01L21/98 ,  H01L25/065

CPC classification number: H01L24/29 ,  C08F32/00 ,  C08G64/0208 ,  C09D145/00 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599

Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

Abstract translation: 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：WO2012019091A1

公开(公告)日：2012-02-09

申请号：PCT/US2011/046729

申请日：2011-08-05

Applicant: PROMERUS LLC ,  BELL, Andrew ,  SHICK, Robert, A. ,  LANGSDORF, Leah ,  SETO, Keitaro ,  TSANG, W.,C., Peter

Inventor： BELL, Andrew ,  SHICK, Robert, A. ,  LANGSDORF, Leah ,  SETO, Keitaro ,  TSANG, W.,C., Peter

IPC: C08G64/02 ,  C08K5/00 ,  B23K35/26 ,  H05K3/34 ,  B81C1/00

CPC classification number: B23K35/362 ,  B23K35/26 ,  B23K35/3613 ,  C08G64/0208 ,  C08K5/0033 ,  C08K5/07 ,  C08K5/09 ,  C08K5/1535 ,  C08K5/42 ,  C08K5/55 ,  C09J169/00

Abstract: Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.

Abstract translation: 根据本发明的实施方案涉及牺牲聚合物组合物，其包含具有衍生自立体特异性多环2,3-二醇单体的重复单元的聚碳酸酯聚合物。 牺牲聚合物组合物还包括选自至少一种光致酸产生剂和/或至少一种热酸产生剂的酸产生剂。 此外，根据本发明的实施例涉及一种形成包括介于基板和外涂层之间的三维空间的结构的方法，以及将第一和第二基板临时粘合在一起的方法，其利用 聚碳酸酯聚合物。